市场调查报告书

软性电子产品用材料的革新

Innovations in Materials for Flexible Electronics (TechVision)

出版商 Frost & Sullivan 商品编码 375812
出版日期 内容资讯 英文 67 Pages
商品交期: 最快1-2个工作天内
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软性电子产品用材料的革新 Innovations in Materials for Flexible Electronics (TechVision)
出版日期: 2016年09月30日内容资讯: 英文 67 Pages
简介

本报告提供影响软性电子产品产业,现有及新兴基板材料的相关分析,各基板材料的考察,主要相关利益者的倡议,影响软性电子产品产业的基板材料的评估,技术开发情形,及未来技术趋势分析等。

第1章 摘要整理

第2章 技术概述

  • 软性电子产品概要
  • 软性电子产品的应用区分
  • 软式电路板:技术概要
  • 对软式电路板材料的终端用户必要条件
  • 现在所使用的基板材料:聚合物基板广泛使用,其次是金属基板

第3章 软性电子产品基板所使用的材料

  • 玻璃基板:技术概要
  • 玻璃基板:主要的革新
  • 金属基板:技术概要
  • 金属基板:主要的革新
  • 聚合物基板:技术概要
  • 聚合物基板概要
  • 聚合物基板:主要的革新
  • 终端用户差距分析
  • 新的基板材料
  • 新的材料:主要的革新

第4章 产业概要

  • 技术促进要素
  • 技术抑制因素
  • 技术价值链
  • 主要的技术相关利益者
  • 近几年的R&D倡议

第5章 技术开发、IP趋势

  • 全球技术开发可能性
  • 全球技术引进可能性
  • 专利趋势:各国图表
  • 专利趋势:全基板材料到目前为止的图表
  • 专利趋势:聚合物基板材料到目前为止的图表

第6章 软性电子产品材料的技术基准

  • 软式电路板材料的机会策略评估 (OSE)
  • OSE电网的考察:材料开发者的机会扩大

第7章 技术蓝图

  • 技术蓝图 - 未来趋势的评估:技术开发情形
  • 技术蓝图 - 说明:高性能PI基板及生物适合性基板为主要的革新

第8章 主要专利

  • 主要的专利:USPTO
  • 主要的专利:EPO
  • 主要的专利:WIPO

第9章 主要的契约

第10章 附录

第11章 关于Frost&Sullivan

目录
Product Code: D6DE

Analysis of Current and Emerging Materials Used for Flexible Electronic Substrates

Flexible electronics are highly popular owing to their high usage convenience, novel display attributes, high reliability, and lightweight. These devices find high potential for adoption in a range of high-end application sectors, which includes consumer electronics, automotive, healthcare, energy, defense, and textiles. However, flexible electronics need to address several key challenges in their performance before they can satisfy high mass volume demand. Flexible substrate materials used for the development of flex circuits have been identified as key enabling components that determine the performance of flexible electronics. Flexible substrate materials that provide high device efficiency, optimal production costs, superior display attributes, and long lifetime need to be developed and further enhanced to pave the path for next-generation flexible electronics. This research study provides an analysis of the existing and emerging substrate materials that influence the flexible electronics industry. This includes glass, metal, polymers, paper, stretchable, and hybrid substrates to name the key ones. The research service also provides insights into each substrate materials and highlights the key stakeholder initiatives, while assessing the substrate material impact on the flexible electronics industry. The technology development scenario in the form of a technology roadmap maps the future direction expected from each flexible substrate material.

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Process and Methodology
  • 1.3. Key Findings: Low-cost and Highly Optically Transparent Substrates Will Lead Adoption in Future

2.0. TECHNOLOGY SNAPSHOT

  • 2.1. Flexible Electronics - An Overview: An Emerging Product Concept Designed to Meet Consumer Demand for Novel Properties in Devices
  • 2.2. Flexible Electronics - Application Segmentation: High Promise in the Consumer Electronics Sector
  • 2.3. Flexible Substrates-Technology Snapshot: Enabling Technologies that Determine the Performance of Flexible Electronics
  • 2.4. End User Requirements for Flexible Substrate Materials: Need for Stable Substrates that Facilitate High Performance of Devices
  • 2.5. Currently Used Substrate Materials: Polymer Substrates Are Widely Adopted Followed by Metal Substrates

3.0. MATERIALS USED FOR FLEXIBLE ELECTRONIC SUBSTRATES

  • 3.1. Glass Substrates - Technology Snapshot: Highly Stable but Unsuitable for Mass Processing
  • 3.2. Glass Substrates - Key Innovations: Large Volume Production of Ultrathin Glass
  • 3.3. Metal Substrates-Technology Snapshot: High Impermeability and Lightweight Attributes
  • 3.4. Metal Substrates - Key Innovations: Developments Include Flexible Solar Cells and OLEDs
  • 3.5. Polymer Substrates - Technology Snapshot: Low Cost and Variations in Performance Properties
  • 3.6. Overview of Polymer Substrates: PET and PEN Are the Most Widely Used Polymer Materials
  • 3.7. Overview of Polymer Substrates: PI is Showing Promise in Adoption for Flexible Substrates
  • 3.8. Overview of Polymer Substrates: PC Films Are Used in High Durability Applications
  • 3.9. Polymer Substrates - Key Innovations: Applications Focused on Organic Electronics
  • 3.10. End-user Gap Analysis: Unmet End-user Requirements Creates Demand for Novel Substrate Materials
  • 3.11. Emerging Substrate Materials: Biocompatible and Stretchable Substrate Materials Are Being Developed
  • 3.12. Emerging Materials - Key Innovations: Low-cost Substrate Materials with High Optical Performance

4.0. INDUSTRY OVERVIEW

  • 4.1. Technology Drivers: Superior Printability and Lightweight Properties Drive Adoption
  • 4.2. Technology Restraints: High Competition from Rigid Substrates and Lack of Materials That Provide Long Operation Lifetime Hinders Adoption
  • 4.3. Technology Value Chain: Highly Integrated Industry with Increasing Contribution from Coating Developers
  • 4.4. Key Technology Stakeholders: Technology Developers Are Spread across North America, Europe, and Asia-Pacific
  • 4.5. Recent R&D Initiatives: Government Funding Contributes Significantly to Technology Development

5.0. TECHNOLOGY DEVELOPMENT AND IP TRENDS

  • 5.1. Global Technology Development Potential: North America Leads in Technology Development
  • 5.2. Global Technology Adoption Potential: Mass Volume Production Methods Facilitate High Adoption in North America
  • 5.3. Patent Trends - Country-wise Charts: US Leads Number of Granted Patents
  • 5.4. Patent Trends - Historical Charts for All Substrate Materials: Main Focus Among Granted Patents Is on Polymer Substrates
  • 5.5. Patent Trends - Historical Charts for Polymer Substrate Materials: Highest Innovations on PET Substrates, Followed by PI

6.0. TECHNOLOGY BENCHMARKING OF MATERIALS FOR FLEXIBLE ELECTRONICS

  • 6.1. Opportunity Strategy Evaluation (OSE) of Flexible Substrate Materials
  • 6.2. Insights from the OSE Grid: Increasing Opportunities for Material Developers

7.0. TECHNOLOGY ROADMAP

  • 7.1. Technology Roadmap - Assessment of Future Trends: Technology Development Scenario 2016-2020
  • 7.2. Technology Roadmap - Explanation: High Performance PI Substrates and Biocompatible Substrates Are Key Innovations Expected in 2020

8.0. KEY PATENTS

  • 8.1. Key Patents - USPTO
  • 8.2. Key Patents - EPO
  • 8.3. Key Patents - WIPO

9.0. KEY CONTACTS

  • 9.1. Key Contacts

10.0. APPENDIX

  • 10.1. Appendix A - OSE Grid: Definition of Criteria Used for Evaluation
  • 10.2. Appendix A - OSE Grid: Explanation of Quadrant Placement in the Matrix
  • 10.3. Appendix A - OSE Grid: Criteria-based Evaluation of Currently Used Substrate Materials
  • 10.4. Appendix A - OSE Grid: Criteria-based Evaluation of Emerging Substrate Materials
  • Legal Disclaimer

11.0. THE FROST & SULLIVAN STORY

  • 11.1. The Frost & Sullivan Story
  • 11.2. Value Proposition: Future of Your Company and Career
  • 11.3. Global Perspective
  • 11.4. Industry Convergence
  • 11.5. 360° Research Perspective
  • 11.6. Implementation Excellence
  • 11.7. Our Blue Ocean Strategy
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