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市场调查报告书

LEDinside:Micro LED新一代显示器(2019年) :主要技术报告

LEDinside: 2019 Micro LED Next Generation Display Key Technology Report

出版商 TrendForce 商品编码 752366
出版日期 内容资讯 英文
商品交期: 最快1-2个工作天内
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LEDinside:Micro LED新一代显示器(2019年) :主要技术报告 LEDinside: 2019 Micro LED Next Generation Display Key Technology Report
出版日期: 2019年01月31日内容资讯: 英文
简介

本报告调查了全球Micro LED市场,并统整了市场及产品概要、市场发展变化、市场规模变化与预测应用产品与开发趋势、专利趋势、主要技术区分别的瓶颈及问题分析、主要企业的技术开发趋势等。

第1章 Micro LED:定义、市场规模

  • 产品定义
  • 市场规模分析、预测
  • 出货数分析
  • 普及率分析

第2章 Micro LED应用产品、开发趋势

  • Micro LED产品概要
  • 头戴式装置
  • 穿戴式装置
  • 手环式装置
  • IT装置
  • IT显示器
  • 汽车显示器
  • TV
  • LED显示器

第3章 Micro LED专利分析

第4章 Micro LED技术瓶颈与解决方案

  • 技术概要
  • 制造流程
  • LED分子束磊晶、晶片制造流程
  • 转移技术/邦定技术/驱动、背板技术

第5章 分子束磊晶技术:瓶颈与挑战

  • 解决方案
  • 磊晶晶圆结构、发光原理
  • 分子束磊晶发光层材料、视感效果度
  • leak问题
  • 机器技术分类
  • 机器技术比较
  • 磊晶晶圆:主要技术分类
  • 适用分析等

第6章 晶片制造流程技术:瓶颈、课题分析

  • LED晶片小型化
  • LED晶片制造流程
  • 横向晶片、覆晶技术、垂直晶片在结构上的差异
  • 小型LED晶片(包含蓝宝石基板)Craving技术
  • 小型LED晶片(不包含蓝宝石基板)Craving技术
  • 雷射剥蚀
  • 结构性脆弱与绝缘层
  • Transfer Head的设计
  • 传统型LED与Micro LED晶片生产过程的差异

第7章 Mass Transfer技术:瓶颈、课题分析

  • Mass Transfer技术分类
  • 薄膜Mass Transfer技术分类
  • Pick and Place技术
  • 对UPH的影响因素
  • Apple (LuxVue)
  • Samsung
  • X:Celeprint
  • ITRI
  • MikroMesa
  • AUO
  • VueReal
  • Rohinni
  • eLux
  • PlayNitride
  • 索尼
  • QMAT
  • Uniqarta
  • OPTOVATE
  • KIMM
  • Micro LED与Mass Transfer技术的7种主要课题
  • 适用分析等

第8章 检查技术:瓶颈、课题分析

  • Micro LED技术瓶颈&解决方案:概要 - 检查技术
  • PL检查技术
  • 数位相机光电检查
  • 接触型光电检查
  • 非接触型光电检查技术
  • 非接触EL检查技术
  • 紫外线照射型光电检查
  • 各种技术比较等

第9章 修复技术:瓶颈、课题分析

  • Micro LED技术瓶颈&解决方案:概要 - 修复技术
  • 紫外线照射
  • 雷射焊接
  • 选择性Pick
  • 选择性雷射
  • Back up电路设计解决方案等

第10章 全彩技术解决方案:瓶颈、课题分析

  • 全彩技术解决方案的各种类型
  • RGB晶片的上色技术
  • 色转换
  • 量子点色转换技术、用途
  • QW色转换技术
  • 适用分析等

第11章 邦定技术:瓶颈、课题分析

  • 技术性分类
  • SMT解决方案
  • 共晶波峰焊
  • 异方性导电胶(ACF)解决方案
  • 异方性导电胶水(SAP)解决方案
  • 晶圆邦定技术解决方案
  • 晶圆邦定困难的分析
  • Micro TUBE解决方案
  • 可行性分析等

第12章 驱动计画:瓶颈、课题分析

  • 驱动计画类型
  • Driver IC的重要
  • Switch Mode Driver的各种类型
  • active vs passive matrix驱动比较
  • 显示器驱动计画
  • 薄膜电晶体
  • OLED驱动计画
  • Micro LED驱动计画
  • OLED vs Micro LED:Power Module比较等

第13章 背板技术:瓶颈、课题分析

  • 显示器背板构造
  • 背板材料各种类型
  • 积体电路背板:玻璃基板、画素变换零件的动作原理
  • 积体电路背板:玻璃基板、画素变换零件的特征
  • 积体电路背板:玻璃基板画素变换零件的制造流程
  • 积体电路背板:玻璃基板画素变换零件的解析度比较
  • 积体电路背板:玻璃基板画素变换零件的消费电力比较
  • 积体电路背板:玻璃基板画素变换零件的漏出量比较
  • 积体电路背板:柔性印刷电路板、画素变换零件的特征
  • 积体电路背板:柔性印刷电路板的制造流程
  • 积体电路背板:柔性印刷电路板材料特征
  • 积体电路背板:矽基板构造
  • 积体电路背板:矽基板制造流程
  • 积体电路背板:矽基板材料特征
  • 非积体电路背板:PCB基板比较
  • 非积体电路背板:PCB制造课题
  • 非积体电路背板:PCB尺寸限制
  • 背板技术比较
  • 适用分析等

第14章 Micro LED供应链、企业别技术开发分析

目录

Analysis and Prediction of Micro LED Market Value

The market value of Micro LED doesn't include mass transfer and other cost but includes LED epitaxyand chip.

Due to the high unit price of wafer used in Micro LED Display, it will contribute to the market value in the short term although there are only a few quantities. As the technology matures, the wafer price has gradually declined. It is estimated that the price will drop to 29% of CAGR in 2018-2023.

Overview Analysis

At present, there are six bottlenecks, including epitaxyand chip, transfer, full color, power drive, backplane, and inspection and repairing technologies.

Table of Contents

Chapter 1: Definition and Market Scale of Micro LED

  • Product Definition of Micro LED
  • Analysis and Prediction of Micro LED Market Value
  • Analysis and Prediction of Micro LED Output Volume
  • Estimation of Micro LED Display Penetration Rate

Chapter 2: Micro LED Applications and Technology Development

  • Micro LED Product Overview
  • Micro LED Product Specifications Overview
  • Micro LED Applications-Specifications of Head Mounted Device
  • Micro LED Applications-Cost of Head Mounted Device
  • Micro LED Applications-Shipment Volume of Head Mounted Device
  • Micro LED Applications-Specifications of Wearable Device
  • Micro LED Applications-Cost of Wearable Device
  • Micro LED Applications-Shipment Volume of Wearable Device
  • Micro LED Applications-Specifications of Handheld Device
  • Micro LED Application-Cost of Handheld Device
  • Micro LED Application-Shipment Volume of Handheld Device
  • Micro LED Application-Specifications of IT Device
  • Micro LED Application-Cost of IT Display
  • Micro LED Application-Shipment Volume of IT Device
  • Micro LED Application-Specification of Automotive Display
  • Micro LED Application-Cost of Automotive Display
  • Micro LED Application-Shipment Volume of Automotive Display
  • Micro LED Application-Specifications of TV
  • Micro LED Application-Cost of TV
  • Micro LED Application-Shipment Volume of TV
  • Micro LED Application-Specifications of LED Display
  • Micro LED Application-Cost of LED Display
  • Micro LED Application-Shipment Volume of LED Display

Chapter 3: Micro LED Patent Analysis

  • 2000-2018 Micro LED Patent Layout-Patent Family Analysis
  • 2000-2018 Micro LED Patent Layout-Region Analysis
  • 2000-2018 Micro LED Patent Layout-Technology Analysis
  • 2000-2018 Micro LED Patent Layout-Manufacturer Analysis
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Patent Technology Overview
  • Mass Transfer Technology-Patent Technology Classification
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Brand Manufacturer Technology Layout Analysis
  • Mass Transfer Technology-Start-up and Research Institution Technology Layout Analysis

Chapter 4: Micro LED Technology Bottleneck and Solution

  • Micro LED Industry Technology Overview Analysis
  • Micro LED Technology Bottleneck and Solution Overview-Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-LED Epitaxy and Chip Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-Transfer Technology/Bonding Technology/Drive and Backplane Technology

Chapter 5: EpitaxyTechnology Bottleneck and Challenge Analysis

  • Epitaxy Technology-Solution
  • Epitaxy Technology-Epitaxial Wafer Structure and Light Emitting Principle
  • Epitaxy Technology-Epitaxy Emissive Layer Material and Luminous Efficacy
  • EpitaxyTechnology-The Leakage Problem of Chip Miniaturization Causes the Drop of Luminous Efficacy
  • EpitaxyTechnology-Equipment Technology Classification
  • EpitaxyTechnology-Equipment Technology Comparison
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Wavelength Uniformity
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Defect Control
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Increase of Utilization of Epitaxial Wafer
  • Epitaxy Technology-Applicability Analysis

Chapter 6: Chip Manufacturing Process Technology Bottleneck and Challenge Analysis

  • Chip Manufacturing Process Technology-Development of LED Chip Miniaturization
  • Chip Manufacturing Process Technology-LED Chip Production Process
  • Chip Manufacturing Process Technology-Structural Differences between Lateral Chip, Flip Chip and Vertical Chip
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Including Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Excluding Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Laser Ablation
  • Chip Manufacturing Process Technology-Structural Weakening and Insulating Layer
  • Chip Manufacturing Process Technology-Design of Structural Weakening
  • Chip Manufacturing Process Technology-Design of Transfer Head
  • Chip Manufacturing Process Technology-Differences between Traditional LED and Micro LED Chip Manufacturing Processes

Chapter 7: Mass Transfer Technology Bottleneck and Challenge Analysis

  • Mass Transfer Technology-Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology-Pick & Place Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Non-selective Pick Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology will Increase Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology in Repair Application
  • Mass Transfer Technology-Thin Film Transfer Technology-Factors that Affect UPH
  • Mass Transfer Technology-Thin Film Transfer Technology-Solution of Increasing UPH for Large Transfer Head
  • Mass Transfer Technology-Thin Film Transfer Technology-Higher Transfer Head Accuracy Requirement
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Transfer Times and Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Cycle Time and UPH
  • Mass Transfer Technology-Thin Film Transfer Technology: Apple (LuxVue)
    • Electrostatic Adsorption + Phase Change Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Samsung
    • Chip Transfer and Flip
  • Mass Transfer Technology-Thin Film Transfer Technology-Van der Waals Force Introduction
  • Mass Transfer Technology-Thin Film Transfer Technology: X-Celeprint
    • Van der Waals Force
  • Mass Transfer Technology-Thin Film Transfer Technology: ITRI
    • Electromagnetic Adsorption
  • Mass Transfer Technology-Thin Film Transfer Technology: MikroMesa
    • Adhesion and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: AUO
    • Electrostatic Adsorption and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: VueReal
    • Solid Printing
  • Mass Transfer Technology-Thin Film Transfer Technology: Rohinni
    • Alignment Pin
  • Mass Transfer Technology-Thin Film Transfer Technology-Fluidic Assembly Technology
  • Mass Transfer Technology-Thin Film Transfer Technology: eLux
    • Fluidic Assembly
  • Mass Transfer Technology-Thin Film Transfer Technology: PlayNitride
    • Fluidic Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer Classification
  • Mass Transfer Technology-Thin Film Transfer Technology: Sony
    • Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: QMAT
    • BAR(Beam-Addressed Release) Mass Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Uniqarta
    • Multi-Beam Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: OPTOVATE
    • Laser Lift-off (δ-LLO)Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Roll to Roll Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: KIMM
    • Roll to Roll Transfer
  • Mass Transfer Technology-Seven Major Challenges of Micro LED Mass Transfer Technology
  • Mass Transfer Technology-Transfer Yield Depends on the Control of Manufacturing Capability
  • Mass Transfer Technology-Applicability Analysis

Chapter 8: Testing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Testing Technology
  • Testing Technology-Testing Method
  • Testing Technology-Electrical Properties
  • Testing Technology-EL
  • Testing Technology-Light Properties
  • Testing Technology-PL
  • Testing Technology-Overview of Mass Testing Technology
  • Mass Testing Method-PL Testing Technology
  • Mass Testing Method-Digital Camera Photoelectric Testing Technology
  • Mass Testing Method-Contact Photoelectric Testing Technology
  • Mass Testing Method-Contactless Photoelectric Testing Technology
  • Mass Testing Method-Contactless EL Testing Technology
  • Mass Testing Method-Ultraviolet Irradiation Photoelectric Testing Technology
  • Mass Testing Technology Difference Comparison

Chapter 9: Repairing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Repairing Technology
    • Micro LED Repairing Technology Solution
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Repairing Process of Micro LED Dead Pixel
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Dead Pixel Repairing Technology Analysis
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Transfer Head Pickup Process
  • Repairing Technology Solution-Laser Welding Repairing Technology
  • Repairing Technology Solution-Selective Pick Repairing Technology
  • Repairing Technology Solution-Selective Laser Repairing Technology
  • Repairing Technology Solution-Backup Circuit Design Solution
    • Micro LED Active Defect Detection Design

Chapter 10: Full Color Technical Bottleneck and Challenge Analysis

  • Full Color Technical Solution Types
  • Full Color Technical Solution -RGB Chip Colorization Technique
  • Full Color Technical Solution -RGB's QantumPhotonic Imager on the Same Wafer
  • Full Color Technical Solution -Color Conversion Technology
  • Full Color Technical Solution -QunatumDot Color Conversion Technology and Application
  • Full Color Technical Solution -Quantum Well (QW) Color Conversion Technology
  • Full Color Technical Solution -Overview
  • Full Color Technical Solution -Applicability Analysis

Chapter 11: Bonding Technical Bottleneck and Challenge Analysis

  • Bonding Technology -Technical Classification
  • Bonding Technology -SMT Solution
  • Bonding Technology -Eutectic Wave Soldering Assembly Technical Solution
  • Bonding Technology -Anisotropic Conductive Adhesive (ACF) Solution
  • Bonding Technology -Anisotropic Solder Paste (SAP) Solution
  • Bonding Technology -Wafer Bonding Technical Solution
  • Bonding Technology -Wafer Bonding Difficulty Analysis
  • Bonding Technology -Micro TUBE Solution
  • Bonding Technology -Technical Difficulty Analysis
  • Bonding Technology -Feasibility Analysis

Chapter 12: Analysis of driving scheme bottlenecks and challenges

  • Driving Technology-driving scheme types
  • Driving Technology-the importance of driver IC
  • Driving Technology-Relationship Between V-I Characteristics and Luminance of LED
  • Driving Technology-Types of Switch Mode Driver
  • Driving Technology-Relationship between PWM and Duty Cycle
  • Driving Technology-Comparison between Active and Passive Matrix Driving
  • Driving Technology-Display Driving Scheme-Scanning Behavior and Refresh Rate
  • Driving Technology-Display Driving Scheme-Fine-pitch Display Analysis
  • Driving Technology-Thin Film Transistor-Driving Matrix of LCD displays
  • Driving Technology-Thin Film Transistor-Active Matrix (AM) V.S. Passive Matrix (PM)
  • Driving Technology-Thin Film Transistor-Analysis of Quality-affecting Factors
  • Driving Technology-OLED Driving Scheme-Photoelectric Properties of OLED
  • Driving Technology-OLED Driving Scheme-PMOLED
  • Driving Technology-OLED Driving Scheme-AMOLED
  • Driving Technology-Micro LED Driving Scheme-PM Micro LED
  • Driving Technology-Micro LED Driving Scheme-AM Micro LED
  • OLED V.S. Micro LED: Power Module Comparison

Chapter 13: Analysis of Backplane Technology Bottlenecks and Challenges

  • Backplane Technology-Structure of Display Backplane
  • Backplane Technology-Types of Backplane Material
  • Backplane Technology-Integrated Backplane: Operating Principles of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Features of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Size Development of Glass Substrate
  • Backplane Technology-Integrated Backplane: Thermal Expansion Challenges of Glass Substrate
  • Backplane Technology-Integrated Backplane: Application of Glass Substrate with Switch Components
  • Backplane Technology-Integrated Backplane: Structure of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of a-Si Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of IGZO Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of LTPS Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Resolution Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Power Consumption Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Leakage Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Flexible Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate Materials
  • Backplane Technology-Integrated Backplane: Structure of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Features of Silicon Substrate Materials
  • Backplane Technology-Non-integrated Backplane: Outward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Inward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Thermal Effect of PCB
  • Backplane Technology-Non-integrated Backplane: Comparison of PCB Substrates
  • Backplane Technology-Non-integrated Backplane: Challenges of Manufacturing PCB
  • Backplane Technology-Non-integrated Backplane: Size Limit of PCB
  • Comparison of Backplane Technologies
  • Backplane Technology-Applicability Analysis

Chapter 14: Analysis of Micro LED Supply Chain and Technology Developments by Company

  • Analysis of Major Micro LED Developers (in the Supply Chain)
  • Analysis of Product Strategies and Technology Developments by Region-Taiwan
  • Analysis of Product Strategies and Technology Developments by Region-China
  • Analysis of Product Strategies and Technology Developments by Region-Korea
  • Analysis of Product Strategies and Technology Developments by Region-Japan
  • Analysis of Product Strategies and Technology Developments by Region-EU & the US
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