市场调查报告书

故障分析(FA) - 全球市场预测(2017年~2026年)

Failure Analysis - Global Market Outlook (2017-2026)

出版商 Stratistics Market Research Consulting 商品编码 744603
出版日期 内容资讯 英文 167 Pages
商品交期: 2-3个工作天内
价格
故障分析(FA) - 全球市场预测(2017年~2026年) Failure Analysis - Global Market Outlook (2017-2026)
出版日期: 2018年10月01日内容资讯: 英文 167 Pages
简介

全球故障分析(FA)市场在2017年估算为53亿26万美元,从2017年到2026年间预测将以8.6%的年复合成长率发展,到2026年市场规模将成长到111亿5,026万美元。奈米技术及医疗领域的故障分析的用途扩大,技术进步,半导体领域的故障分析的利用等成为这个市场主要成长要素。

本报告提供全球故障分析(FA)市场调查,市场概要,各设备、实验、技术、用途、地区的市场规模的变化与预测,市场趋势,市场成长要素及阻碍因素分析,市场机会,市场占有率,竞争情形,主要企业的简介等全面性资讯。

目录

第1章 摘要整理

第2章 简介

第3章 市场趋势分析

  • 简介
  • 成长要素
  • 阻碍因素
  • 市场机会
  • 威胁
  • 技术分析
  • 用途分析
  • 新兴市场
  • 今后的市场情况

第4章 波特的五力分析

  • 买方议价能力
  • 供给企业谈判力
  • 新加入业者的威胁
  • 替代品的威胁
  • 竞争企业间的敌对关系

第5章 全球故障分析(FA)市场:各设备

  • 简介
  • 扫描式电子显微镜(SEM)
  • 双束系统
  • 聚焦离子束系统(FIB)
  • 穿透式电子显微镜(TEM)

第6章 全球故障分析(FA)市场:各实验法

  • 简介
  • 物理实验
  • 冶金实验
  • 非破坏性检验(NDT)
  • 材料实验
  • 电子元件故障分析
  • 机械性实验
  • 化学的实验

第7章 全球故障分析(FA)市场:各技术

  • 简介
  • Broad ION Milling (BIM)
  • 反应性离子蚀刻(RIE)
  • 二次离子质谱分析(SIMS)
  • 能源分散式X光扫描光谱学(EDX)
  • 聚焦离子束(FIB)
  • 材料技术
  • 物理性故障分析
  • 非破坏技术
  • 故障树分析(FTA)
  • 功能故障分析
  • 物理性破坏
  • 潜行电路分析
  • 软体故障分析
  • 共模故障分析
  • 障碍方式的影响分析
  • 障碍方式的影响/致命度分析
  • 其他

第8章 全球故障分析(FA)市场:各用途

  • 简介
  • 生物科学
    • 神经科学
    • 细胞生物学
    • 生物医学工程
    • 结构生物学
  • 材料科学
    • 纸浆、造纸
    • 聚合物
    • 奈米加工
    • 陶瓷、玻璃
    • 金属、冶金
    • MEMS、薄膜制造
    • 半导体制造
  • 产业科学
    • 发电、能源
    • 化学
    • 汽车、航太
    • 石油、天然气
    • 再生能源
    • 采矿
    • 机器、工具
    • 其他

第9章 全球故障分析(FA)市场:各地区

  • 简介
  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他
  • 南美
    • 阿根廷
    • 巴西
    • 智利
    • 其他
  • 中东、非洲
    • 沙乌地阿拉伯
    • 阿拉伯联合大公国
    • 卡达
    • 南非
    • 其他

第10章 主要市场趋势

  • 协定,伙伴关系,合作,合资企业
  • 收购与合并
  • 新产品的销售
  • 事业扩张
  • 其他

第11章 企业简介

  • FEI Company
  • 日立先端科技
  • Jeol Ltd.
  • CARL Zeiss SMT GmbH
  • Intertek Group PLC
  • Thermo Fisher Scientific Inc
  • Motion X Corporation
  • Tescan Orsay Holding, A.S.
  • EAG (Evans Analytical Group) Inc.
  • A&D Company Ltd.
  • Raytheon Company (U.S.)
  • Meyer Burger Technology
  • Canon Anelva Corporation
  • Veeco Instruments Inc.
  • Bruker Corporation
  • Plasma-Therm
  • Scia Systems GmbH
  • EDAX, Inc.
  • Innovative Circuits Engineering, Inc.
  • IXRF Systems, Inc.
目录

According to Stratistics MRC, the Failure Analysis Market is accounted for $ 5300.26 Million in 2017 and is expected to reach $11150.26 Million by 2026 growing at a CAGR of 8.6% during the forecast period. Rising applications of failure analysis equipment in nanotechnology and medical applications and advancements in technology and usage of failure analysis equipment in semiconductors are some of the factors driving the market. However, high maintenance and equipment cost may hinder the market growth. Demand for failure analysis equipment in emerging nations may create an opportunity to the market.

Failure analysis is a process in which the origin cause for the failure is recognized and the correction in the product is done. It is widely used in sectors such as material science, bioscience and other sectors. These processes mainly deal with the failures in structures, assemblies and components. The recognition of failure is a multilevel process which includes the physical investigation of the product. This process is done by the experts in those fields who can recognize the problem and who can make essential changes in the products.

By Equipment, Focused ION Beam System (FIB) segment accounted for the largest market share in the global Failure Analysis market owing to their extensive utilization.

Based on geography, Asia Pacific is expected to dominate the global Failure Analysis market during the forecast period owing to investing heavily in medical technologies, nanotechnology and R&D infrastructure.

Some of the key players in Failure Analysis market include FEI Company, Hitachi High, Technologies Corporation, Jeol Ltd., CARL Zeiss SMT GmbH, Intertek Group PLC, Thermo Fisher Scientific Inc, Motion X Corporation, Tescan Orsay Holding, A.S., EAG (Evans Analytical Group) Inc. , A&D Company Ltd., Raytheon Company (U.S.), Meyer Burger Technology, Canon Anelva Corporation, Veeco Instruments Inc., Bruker Corporation, Plasma-Therm, Scia Systems GmbH, EDAX, Inc., Innovative Circuits Engineering, Inc. and IXRF Systems, Inc.

Equipments Covered:

  • Scanning Electron Microscope (SEM)
  • Dual-Beam Systems
  • Focused ION Beam System (FIB)
  • Transmission Electron Microscope (TEM)

Technologies Covered:

  • Broad ION Milling (BIM)
  • Reactive ION Etching (RIE)
  • Secondary ION Mass Spectroscopy (SIMS)
  • Secondary ION Mass Spectroscopy (SIMS)
  • Energy Dispersive X-Ray Spectroscopy (EDX)
  • Focused ION Beam (FIB)
  • Materials Technology
  • Physical Technology
  • Non-Destructive Technology (NDT)

Applications Covered:

  • Bio Science
  • Material Science
  • Industrial Science

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • UK
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country level segments
  • Market share analysis of the top industry players
  • Strategic recommendations for the new entrants
  • Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Futuristic Market Scenario

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Failure Analysis Market, By Equipment

  • 5.1 Introduction
  • 5.2 Scanning Electron Microscope (SEM)
  • 5.3 Dual-Beam Systems
  • 5.4 Focused ION Beam System (FIB)
  • 5.5 Transmission Electron Microscope (TEM)

6 Global Failure Analysis Market, By Testing

  • 6.1 Introduction
  • 6.2 Physical Testing
  • 6.3 Metallurgical Testing
  • 6.4 Non-destructive Testing (NDT)
  • 6.5 Materials Testing
  • 6.6 Electronic Component Failure Analysis
  • 6.7 Mechanical Testing
  • 6.8 Chemical Testing

7 Global Failure Analysis Market, By Technology

  • 7.1 Introduction
  • 7.2 Broad ION Milling (BIM)
  • 7.3 Reactive ION Etching (RIE)
  • 7.4 Secondary ION Mass Spectroscopy (SIMS)
  • 7.5 Energy Dispersive X-Ray Spectroscopy (EDX)
  • 7.6 Focused ION Beam (FIB)
  • 7.7 Materials Technology
  • 7.8 Physics of Failure Analysis
  • 7.9 Non-Destructive Technology (NDT)
  • 7.1 Fault Tree Analysis(FTA)
  • 7.11 Functional Failure Analysis
  • 7.12 Destructive Physical Analysis
  • 7.13 Sneak Circuit Analysis
  • 7.14 Software Failure Analysis
  • 7.15 Common-Mode Failure Analysis
  • 7.16 Failure Modes Effect Analysis (FMEA)
  • 7.17 Failure Modes, Effects, and Criticality Analysis (FMECA)
  • 7.18 Other Technologies

8 Global Failure Analysis Market, By Application

  • 8.1 Introduction
  • 8.2 Bio Science
    • 8.2.1 Neuroscience
    • 8.2.2 Cellular Biology
    • 8.2.3 Biomedical Engineering
    • 8.2.4 Structural Biology
  • 8.3 Material Science
    • 8.3.1 Paper & Fiber Material
    • 8.3.2 Polymer
    • 8.3.3 Nanofabrication
    • 8.3.4 Ceramic & Glass
    • 8.3.5 Metals & Metallurgy
    • 8.3.6 MEMS and Thin Film Production
    • 8.3.7 Semiconductor Manufacturing
  • 8.4 Industrial Science
    • 8.4.1 Power Generation & Energy
    • 8.4.2 Chemical
    • 8.4.3 Automotive & Aerospace
    • 8.4.4 Oil & Gas
    • 8.4.5 Renewable Energy
    • 8.4.6 Mining
    • 8.4.7 Machinery & Tools
    • 8.4.8 Other Industrial Science

9 Global Failure Analysis Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 FEI Company
  • 11.2 Hitachi High-Technologies Corporation
  • 11.3 Jeol Ltd.
  • 11.4 CARL Zeiss SMT GmbH
  • 11.5 Intertek Group PLC
  • 11.6 Thermo Fisher Scientific Inc
  • 11.7 Motion X Corporation
  • 11.8 Tescan Orsay Holding, A.S.
  • 11.9 EAG (Evans Analytical Group) Inc.
  • 11.1 A&D Company Ltd.
  • 11.11 Raytheon Company (U.S.)
  • 11.12 Meyer Burger Technology
  • 11.13 Canon Anelva Corporation
  • 11.14 Veeco Instruments Inc.
  • 11.15 Bruker Corporation
  • 11.16 Plasma-Therm
  • 11.17 Scia Systems GmbH
  • 11.18 EDAX, Inc.
  • 11.19 Innovative Circuits Engineering, Inc.
  • 11.2 IXRF Systems, Inc.

List of Tables

  • Table 1 Global Failure Analysis Market Outlook, By Region (2016-2026) (US $MN)
  • Table 2 Global Failure Analysis Market Outlook, By Equipment (2016-2026) (US $MN)
  • Table 3 Global Failure Analysis Market Outlook, By Scanning Electron Microscope (SEM) (2016-2026) (US $MN)
  • Table 4 Global Failure Analysis Market Outlook, By Dual-Beam Systems (2016-2026) (US $MN)
  • Table 5 Global Failure Analysis Market Outlook, By Focused ION Beam System (FIB) (2016-2026) (US $MN)
  • Table 6 Global Failure Analysis Market Outlook, By Transmission Electron Microscope (TEM) (2016-2026) (US $MN)
  • Table 7 Global Failure Analysis Market Outlook, By Testing (2016-2026) (US $MN)
  • Table 8 Global Failure Analysis Market Outlook, By Physical Testing (2016-2026) (US $MN)
  • Table 9 Global Failure Analysis Market Outlook, By Metallurgical Testing (2016-2026) (US $MN)
  • Table 10 Global Failure Analysis Market Outlook, By Non-destructive Testing (NDT) (2016-2026) (US $MN)
  • Table 11 Global Failure Analysis Market Outlook, By Materials Testing (2016-2026) (US $MN)
  • Table 12 Global Failure Analysis Market Outlook, By Electronic Component Failure Analysis (2016-2026) (US $MN)
  • Table 13 Global Failure Analysis Market Outlook, By Mechanical Testing (2016-2026) (US $MN)
  • Table 14 Global Failure Analysis Market Outlook, By Chemical Testing (2016-2026) (US $MN)
  • Table 15 Global Failure Analysis Market Outlook, By Technology (2016-2026) (US $MN)
  • Table 16 Global Failure Analysis Market Outlook, By Broad ION Milling (BIM) (2016-2026) (US $MN)
  • Table 17 Global Failure Analysis Market Outlook, By Reactive ION Etching (RIE) (2016-2026) (US $MN)
  • Table 18 Global Failure Analysis Market Outlook, By Secondary ION Mass Spectroscopy (SIMS) (2016-2026) (US $MN)
  • Table 19 Global Failure Analysis Market Outlook, By Energy Dispersive X-Ray Spectroscopy (EDX) (2016-2026) (US $MN)
  • Table 20 Global Failure Analysis Market Outlook, By Focused ION Beam (FIB) (2016-2026) (US $MN)
  • Table 21 Global Failure Analysis Market Outlook, By Materials Technology (2016-2026) (US $MN)
  • Table 22 Global Failure Analysis Market Outlook, By Physics of Failure Analysis (2016-2026) (US $MN)
  • Table 23 Global Failure Analysis Market Outlook, By Non-Destructive Technology (NDT) (2016-2026) (US $MN)
  • Table 24 Global Failure Analysis Market Outlook, By Fault Tree Analysis(FTA) (2016-2026) (US $MN)
  • Table 25 Global Failure Analysis Market Outlook, By Functional Failure Analysis (2016-2026) (US $MN)
  • Table 26 Global Failure Analysis Market Outlook, By Destructive Physical Analysis (2016-2026) (US $MN)
  • Table 27 Global Failure Analysis Market Outlook, By Sneak Circuit Analysis (2016-2026) (US $MN)
  • Table 28 Global Failure Analysis Market Outlook, By Software Failure Analysis (2016-2026) (US $MN)
  • Table 29 Global Failure Analysis Market Outlook, By Common-Mode Failure Analysis (2016-2026) (US $MN)
  • Table 30 Global Failure Analysis Market Outlook, By Failure Modes Effect Analysis (FMEA) (2016-2026) (US $MN)
  • Table 31 Global Failure Analysis Market Outlook, By Failure Modes, Effects, and Criticality Analysis (FMECA) (2016-2026) (US $MN)
  • Table 32 Global Failure Analysis Market Outlook, By Other Technologies (2016-2026) (US $MN)
  • Table 33 Global Failure Analysis Market Outlook, By Application (2016-2026) (US $MN)
  • Table 34 Global Failure Analysis Market Outlook, By Bio Science (2016-2026) (US $MN)
  • Table 35 Global Failure Analysis Market Outlook, By Neuroscience (2016-2026) (US $MN)
  • Table 36 Global Failure Analysis Market Outlook, By Cellular Biology (2016-2026) (US $MN)
  • Table 37 Global Failure Analysis Market Outlook, By Biomedical Engineering (2016-2026) (US $MN)
  • Table 38 Global Failure Analysis Market Outlook, By Structural Biology (2016-2026) (US $MN)
  • Table 39 Global Failure Analysis Market Outlook, By Material Science (2016-2026) (US $MN)
  • Table 40 Global Failure Analysis Market Outlook, By Paper & Fiber Material (2016-2026) (US $MN)
  • Table 41 Global Failure Analysis Market Outlook, By Polymer (2016-2026) (US $MN)
  • Table 42 Global Failure Analysis Market Outlook, By Nanofabrication (2016-2026) (US $MN)
  • Table 43 Global Failure Analysis Market Outlook, By Ceramic & Glass (2016-2026) (US $MN)
  • Table 44 Global Failure Analysis Market Outlook, By Metals & Metallurgy (2016-2026) (US $MN)
  • Table 45 Global Failure Analysis Market Outlook, By MEMS and Thin Film Production (2016-2026) (US $MN)
  • Table 46 Global Failure Analysis Market Outlook, By Semiconductor Manufacturing (2016-2026) (US $MN)
  • Table 47 Global Failure Analysis Market Outlook, By Industrial Science (2016-2026) (US $MN)
  • Table 48 Global Failure Analysis Market Outlook, By Power Generation & Energy (2016-2026) (US $MN)
  • Table 49 Global Failure Analysis Market Outlook, By Chemical (2016-2026) (US $MN)
  • Table 50 Global Failure Analysis Market Outlook, By Automotive & Aerospace (2016-2026) (US $MN)
  • Table 51 Global Failure Analysis Market Outlook, By Oil & Gas (2016-2026) (US $MN)
  • Table 52 Global Failure Analysis Market Outlook, By Renewable Energy (2016-2026) (US $MN)
  • Table 53 Global Failure Analysis Market Outlook, By Mining (2016-2026) (US $MN)
  • Table 54 Global Failure Analysis Market Outlook, By Machinery & Tools (2016-2026) (US $MN)
  • Table 55 Global Failure Analysis Market Outlook, By Other Industrial Science (2016-2026) (US $MN)

Note North America, Europe, Asia Pacific, South America and Middle East & Africa are represented in above manner.