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市场调查报告书

全球IC封装市场:2018年版

The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry

出版商 New Venture Research 商品编码 275970
出版日期 内容资讯 英文 500+ Pages
商品交期: 最快1-2个工作天内
价格
全球IC封装市场:2018年版 The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版日期: 2018年04月30日内容资讯: 英文 500+ Pages
简介

2017年的全球IC封装市场规模预计超过3580亿美元。

本报告提供全球IC封装的市场调查,全世界的经济环境和电子产业趋势,各设备类型、包装系列趋势与市场规模的变化与预测,OSAT市场趋势与策略分析,主要OSAT企业的简介等汇整资料。

第1章 简介

第2章 摘要整理

第3章 全球电子产业展望

  • 全球经济展望
    • 近几年的经济趋势
    • 全球GDP
    • 对半导体市场的影响
    • 关注趋势
  • 全球电子产品市场
    • 通讯市场
      • 蜂巢式终端设备
      • LAN
      • DSL、纜线数据机
      • 电信级设备
    • 电脑市场
      • PC
      • 平板电脑
      • 伺服器
      • 存储系统
      • 萤幕
      • 印表机
    • 消费者产品市场
      • TV
      • 机上盒
      • 数位相机
      • 个人导航设备
    • 产业的产品市场
      • 流程控制
      • 检验、检测
      • 其他
    • 医疗市场
      • 医疗诊断
      • 治疗
      • 监测
      • 手术
    • 汽车市场
    • 民航、防卫、其他运输市场

第4章 半导体设备市场分析

  • 全球半导体设备市场
    • 整体市场预测
    • IC应用预测
    • 地区市场趋势
  • IC市场预测:全球各主要地区
  • 市场预测:各设备类型
    • 电晶体
    • 处理器设备
      • MPU
      • MCU (4、8、16、32位元~)
      • DSP
    • 记忆体设备
      • DRAM
      • SRAM
      • flash
      • ROM/EPROM
      • EEPROM
    • 逻辑装置
      • 数位双极
      • 标准逻辑
      • 闸门阵列
      • 标准单元&PLD
      • 显示驱动&触控萤幕控制器
      • 各种SPL
    • 类比设备
      • 放大器、比较仪
      • 介面
      • 电压调整器、标准
      • 数据转换器
      • 各种专用类比

第5章 IC封装市场分析

  • 概要
  • IC包装家庭
  • 全球IC封装
  • IC封装整体市场预测
    • IC封装市场:各I/O点数
    • 包装价格趋势
  • IC包装家庭的预测
    • DIP
    • TO包装
    • SOT
    • SOIC
    • TSOP
    • CC
    • QFP
    • DFN
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
    • DCA
  • 先进IC封装
    • MCP (多晶片包装)
    • FOWLP (Fan-Out Wafer-Level Package)
    • Multirow QFN 包装
    • 覆晶连接
    • TSV连接

第6章 OSAT市场、策略分析

  • 半导体市场上外包
  • OSAT市场预测
    • 出货数
    • 收益
    • 包装ASP
  • OSAT市场领导

第7章 OSAT企业的简介

  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • CONNECTEC JAPAN
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Interconnect Systems
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • nepes Corp.
  • OSE
  • Palomar Technologies

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目录
Product Code: PKG18

Synopsis

‘The Worldwide IC Packaging Market, 2018 Edition’, a new report from New Venture Research (NVR), examines the global marketplace of integrated circuits (Ics) and the many packaging designs developed for Ics. This comprehensive report presents detailed analysis of a vast and vibrant market that exceeded $358 billion in 2017. The nearly 500-page report provides insightful analysis of major market trends affecting the semiconductor industry, and presents dozens of tables and figures quantifying both the semiconductor device and IC packaging markets. The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 31 separate semiconductor device types as well as 14 major packaging categories comprising 44 IC packaging market segments. Virtually every table presents two years of historical data for 2016 and 2017, and five-year forecasts from 2018 through 2022. In addition, numerous graphical figures provide an alternative perspective for understanding the underlying data.

The report is arranged into seven chapters focused on four major topics of discussion. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2), Chapter 3, "Worldwide Electronics Industry Outlook," examines broad economic trends and the global electronics industry, specifically looking at products that are helping drive the expanding demand for semiconductors and IC packaging technologies. Markets covered includes communications products, computers and peripherals, and consumer products, as well as products for industrial, medical, automotive and commercial aviation and defense sectors.

In Chapter 4, "Semiconductor Device Market Analysis," the report analyzes each semiconductor device type with forecasts provided for unit shipments and revenues presented in terms of function, packaging types, applications and major world regions. Chapter 5, "IC Packaging Market Analysis," examines the IC packaging market in terms of unit shipments, revenues and package pricing for each packaging market segment in terms of semiconductor device type and I/O count. The chapter also provides a short overview of advanced packaging products adapted from NVR's companion report Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition.

Chapter 6, "OSAT Market and Strategy Analysis," focuses on the outsourced semiconductor assembly and test (OSAT) company market segment, vendors who specialize in providing IC packaging and testing services to other companies in the industry. Consisting of more than 100 companies worldwide, the OSAT market segment accounts for a significant and growing sector of the semiconductor market. The report looks not only at the size of the OSAT market, but discusses the various strategies for success shared by the leading competitors. Finally, Chapter 7, "OSAT Company Profiles," presents concise profiles of 40 OSAT companies, providing a cross-section of both large and small competitors. Each profile includes an overview of the company, as well as details of their IC packaging product lines.

‘The Worldwide IC Packaging Market, 2018 Edition’ continues NVR's leadership position in analyzing semiconductor device markets and IC packaging products and technologies. This report is an effective and economical tool for any company interested in competing in the semiconductor industry as an aid in assessing the present and future of this dynamic industry.

Report Highlights

Industry Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Worldwide Semiconductor Device Market Forecasts, 2016-2022

  • By Unit Shipments and Revenues
  • By Packaging Type
  • By Application
  • By Major World Region

Worldwide IC Packaging Market Forecasts, 2016-2022

  • By Unit Shipments, Revenues and ASP
  • By Semiconductor Product
  • By I/O Range

OSAT IC Packaging Market Forecasts, 2016-2022

  • IC Packaging Type by Unit Shipments, Revenues and ASP
  • Competitive Rankings
  • Company Profiles

About The Author

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry, writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his lifelong passion for inquiry into difficult subject matter and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Worldwide Electronics Industry Outlook

  • Global Economic Outlook
    • Recent Economic Trends
    • World GDP
    • Impact on Semiconductor Market
    • Trends to Watch in 2018 and Beyond
  • Global Electronics Market
    • Communications Markets, including: Cellular Handsets, LANs, DSL & Cable Modems, Carrier-class Equipment
    • Computers Markets, including: PCs, Tablets, Servers, Storage Systems, Monitors, Printers
    • Consumer Markets, including: TVs, Settop Boxes, Digital Cameras, Personal Navigation Devices
    • Industrial Markets, including: Process Control, Test & Measurements, Other Industrial
    • Medical Markets, including: Medical Diagnostics, Therapeutic, Monitoring & Surgical
    • Automotive Markets
    • Commercial Aviation, Defense and Other Transportation Markets

Chapter 4: Semiconductor Device Market Analysis

  • Worldwide Semiconductor Device Market
    • Total Market Forecasts
    • IC Application Forecasts
    • Regional Market Trends

Covers: Consumer, Transportation, Computer Communications, Industrial & Other

  • IC Market Forecasts by Major World Regions
  • Market Forecasts by Device Type
    • Transistors
    • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
    • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM
    • Logic Devices: Digital Bipolar, Standard Logic, Gate Arrays, Standard Cell & PLDs, Display Drivers & Touch Screen Controllers, Special Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose & Other)
    • Analog Devices: Amplifiers & Comparators, Interfaces, Voltage Regulators & References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial & Other)

Chapter 5: IC Packaging Market Analysis

  • Overview
  • IC Package Families
  • Worldwide IC Packaging Market
  • Total IC Packaging Market Forecasts
    • IC Packaging Market by I/O Count
    • Package Pricing Trends
  • IC Package Families Forecasts
    • Dual In-Line Package Markets (DIP)
    • Transistor Outline Package Markets (TO)
    • Small Outline Transistor Package Market (SOT)
    • Small Outline IC Markets (SOIC)
    • Thin Small Outline Package Markets (TSOP)
    • Chip Carrier Markets (CC)
    • Quad Flat Pack Markets (QFP)
    • Dual Flat Pack No Lead Markets (DFN)
    • Quad Flat Pack No Lead Markets (QFN)
    • Pin Grid Array Package Markets (PGA)
    • Ball Grid Array Package Markets (BGA)
    • Fine-Pitch Ball Grid Array Package Markets (FBGA)
    • Wafer-Level Packaging Markets (WLP)
    • Direct Chip Attached Markets (DCA)
  • Advanced IC Packaging
    • Multichip Packages
    • Fan-Out Wafer-Level Package (FOWLP)
    • Multirow QFN Packages
    • Flip Chip Interconnection
    • Through-Silicon Via Interconnect Solutions

Chapter 6: OSAT Market and Strategy Analysis

  • Outsourcing in the Semiconductor Market
  • OSAT Market Forecasts, including: Unit Shipments, Revenues, Package ASP

Chapter 7: OSAT Company Profiles

  • 3D Plus
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • ANST China
  • ASE
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • CONNECTEC Japan
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • Interconnect Systems
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision Industries
  • nepes Corp.
  • OSE
  • Palomar Technologies
  • Powertech Technology
  • Shinko Electric
  • Signetics
  • Sigurd Microelectronics
  • SPiL
  • SPEL Semiconductor
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • TongFu Microelectronics
  • Unisem
  • UTAC
  • Walton Advanced Engineering
  • Xintec