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市场调查报告书

基板印刷电路板 (SLP)的全球市场预测 (2024年):自动光学检验 (AOI)、直描曝光方式 (DI) 或雷射直接绘图方式 (LDI)、光学式自动成型 (AOS)

Substrate-Like PCB Market by Line/Spacing, Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

出版商 MarketsandMarkets 商品编码 771614
出版日期 内容资讯 英文 121 Pages
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基板印刷电路板 (SLP)的全球市场预测 (2024年):自动光学检验 (AOI)、直描曝光方式 (DI) 或雷射直接绘图方式 (LDI)、光学式自动成型 (AOS) Substrate-Like PCB Market by Line/Spacing, Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024
出版日期: 2019年01月11日内容资讯: 英文 121 Pages
简介

全球基板印刷电路板 (substrate-like PCB:SLP)的市场规模,预测将从2018年的11亿美元到2024年达到26亿美元,以15.6%的年复合成长率 (CAGR) 成长。SLP市场,由于主要OEM的SLP引进高,对智慧消费者电子产品、穿戴式设备的需求剧增,及SLP的冲击强的优点等各式各样的因素所促进。可是,SLP相关的安装成本高额,有阻碍市场成长的可能性。

本报告提供全球基板印刷电路板 (substrate-like PCB:SLP) 市场调查,市场概要,市场成长的各种影响因素及市场机会分析,各市场区隔、各地区的趋势以及市场规模的变化与预测,竞争环境,主要企业的简介等系统性资讯。

第1章 简介

第2章 调查方法

第3章 摘要整理

第4章 重要考察

  • SLP市场上富有魅力的机会
  • 亚太地区的SLP市场:各应用、各国
  • 各国SLP市场成长率

第5章 市场概要

  • 简介
  • 市场动态
    • 成长推动因素
    • 阻碍成长要素
    • 市场机会
    • 课题

第6章 SLP市场:线/空间

  • 简介
  • 25/25微米、30/30微米 线/空间
  • 25/25微米 线/空间 以下

第7章 SLP市场:各用途

  • 简介
  • 消费者电子产品
  • 运算、通讯
  • 汽车
  • 医疗
  • 产业
  • 军事、防卫、航太

第8章 SLP市场:各检验技术

  • 简介
  • 自动光学检验 (AOI)
  • 直描曝光方式 (DI) 或雷射直接绘图方式 (LDI)
  • 光学式自动成型 (AOS)

第9章 地区分析

  • 简介
  • 北美
  • 欧洲
  • 亚太地区
  • 其他

第10章 竞争环境

  • 概要
  • 市场参与企业的排行榜分析

第11章 企业简介

  • 概要
  • 主要企业
    • KINSUS INTERCONNECT TECHNOLOGY
    • IBIDEN
    • COMPEQ
    • UNIMICRON
    • AT&S
    • TTM TECHNOLOGIES
    • SAMSUNG ELECTRO-MECHANICS
    • KOREA CIRCUIT
    • ZHEN DING TECHNOLOGY
  • 其他的企业
    • DAEDUCK GDS COMPANY
    • ISU PETASYS
    • TRIPOD TECHNOLOGY CORP
    • LG INNOTEK

第12章 附录

目录
Product Code: SE 6851

"High adoption of SLP by leading OEMs to drive overall growth of substrate-like PCB market"

The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The substrate-like PCB market is driven by various factors, such as the high adoption of SLPs by leading OEMs, the surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs. However, higher setup costs associated with SLPs can hinder the growth of the market.

"Based on line/space, less than 25/25 µm line/space to witness highest CAGR during forecast period"

The line spacing of the copper track embedded into the PCB is important as it is directly related to the size of the PCB and eventually the size of the product. As miniaturization of the product has become an important factor in applications such as consumer electronics, medical, and computing and communications, the line spacing is expected to decrease further. With modified semi-additive method (mSAP), manufacturing smaller size PCBs can be achieved by reducing the track width, which ultimately makes it possible to have more number of electrical connections on the same area of the PCB. The PCB industry is striving continuously to improve the mSAP process capability and achieve unprecedented densities, which, in turn, helps fabricators to offer SLPs with line/space of less than 25/25 µm.

"Based on inspection technologies, automated optical shaping to grow at highest CAGR during forecast period"

AOS technology helps to remove excess copper and complete PCB tracks (patterns) on the SLP board where copper is missing. With this technology, PCB manufacturers can benefit from common problems observed on PCB boards such as short tracks and open tracks as this technology has the potential to remove the short tracks and connect the open tracks automatically. Due to the additional benefits of AOS as compared to other inspection technologies, it is expected that AOS will grow at the highest CAGR during the forecast period.

"APAC to record highest growth rate during forecast period"

APAC is an emerging market for substrate-like PCBs. APAC has become a global focal point for large investments and business expansion opportunities. More than 50% of the global mobile subscribers live in APAC-mostly in China and India. There has been a paradigm shift of users from 3G to 4G technology in this region. Key factors that drive the SLP market growth in APAC include the increasing adoption of smartphones, a growing number of internet users, rising demand for connectivity solutions, expansion of telecommunications infrastructure, and expanding bandwidth-intensive applications in the region. As most of the smartphone providers are from the APAC region, it is expected that there would be a major demand for SLP in the APAC region during the forecast period. Taiwan has become one of the center places for the development of SLP technology.

In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the substrate-like PCB marketplace.

  • By Company Type: Tier 1 = 35%, Tier 2 =45%, and Tier 3 = 20%
  • By Designation: C-Level Executives = 35%, Directors = 25%, and Others = 40%
  • By Region: North America = 30%, Europe = 20%, APAC = 45%, RoW = 5%

The substrate-like PCB market comprises major players, namely, AT & S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); and LG Innotek (South Korea).

The study includes an in-depth competitive analysis of these key players in the substrate-like PCB market, with their company profiles, recent developments, and key market strategies.

Research Coverage:

The report defines, describes, and forecasts the substrate-like PCB market based on line/space, inspection technologies, application, and geography. It provides detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the substrate-like PCB market. It also analyzes the competitive developments such as joint ventures, collaborations, agreements, contracts, partnerships, mergers and acquisitions, and product launches carried out by the key players to grow in the market.

Key Benefits of Buying the Report:

The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall substrate-like PCB market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to better position their businesses and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
  • 1.4. YEARS CONSIDERED
  • 1.5. CURRENCY
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary interviews with experts
      • 2.1.2.2. Breakdown of primaries
      • 2.1.2.3. Key data from primary sources
      • 2.1.2.4. Key industry insights
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
      • 2.2.1.1. Approach for capturing market size by bottom-up analysis (demand side)
    • 2.2.2. TOP-DOWN APPROACH
      • 2.2.2.1. Approach for capturing market size by top-down analysis (supply side)
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE OPPORTUNITIES IN SUBSTRATE-LIKE PCB MARKET
  • 4.2. SUBSTRATE LIKE PCB MARKET IN APAC, BY APPLICATION AND COUNTRY
  • 4.3. COUNTRY-WISE SUBSTRATE-LIKE PCB MARKET GROWTH RATE

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. High adoption of SLPs by leading OEMs
      • 5.2.1.2. Surge in demand for smart consumer electronics and wearable devices
      • 5.2.1.3. Impactful benefits of SLPs
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Higher setup costs associated with SLPs
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Increasing use of advanced printed circuit boards in high-end technology-based products
      • 5.2.3.2. Rising adoption of SLP technology by smartphone players owing to transition from 4G to 5G technology
      • 5.2.3.3. Growing use of mSAP and SAP processes in PCB manufacturing
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Increasing complexity of printed circuit boards

6. SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE

  • 6.1. INTRODUCTION
  • 6.2. 25/25µM AND 30/30µM LINE/SPACE
    • 6.2.1. 25/25µM & 30/30µM LINE/SPACE SEGMENT DOMINATE SLP MARKET, IN TERMS OF SIZE, OWING TO THE RISING ADOPTION OF MINIATURE DEVICES
  • 6.3. LESS THAN 25/25 µM LINE/SPACE
    • 6.3.1. SUBSTANTIAL GROWTH RATE OF MARKET FOR SLPS WITH LESS THAN 25/25 µM LINE/SPACE DUE TO ADOPTION OF ADDITIVE PROCESS IN MANUFACTURING THESE SLPS

7. SUBSTRATE-LIKE PCB MARKET, BY APPLICATION

  • 7.1. INTRODUCTION
  • 7.2. CONSUMER ELECTRONICS
    • 7.2.1. CONSUMER ELECTRONICS EXPECTED TO HOLD LARGEST SIZE OF SLP MARKET OWING TO ADOPTION OF SLP BY LEADING ORIGINAL EQUIPMENT MANUFACTURERS IN THEIR SMARTPHONES
  • 7.3. COMPUTING AND COMMUNICATIONS
    • 7.3.1. INCREASING ADOPTION OF ADVANCED COMMUNICATION TECHNOLOGIES WOULD LEAD TO HIGH DEMAND FOR SLP FOR COMPUTING AND COMMUNICATIONS APPLICATIONS
  • 7.4. AUTOMOTIVE
    • 7.4.1. INCREASING DEMAND FOR MULTILAYER PRINTED CIRCUIT BOARDS IN AUTOMOTIVE ELECTRONICS WILL SPUR SLP MARKET GROWTH
  • 7.5. MEDICAL
    • 7.5.1. RISING TREND OF MINIATURIZATION OF ADVANCED MEDICAL EQUIPMENT AND DEVICES EXPECTED TO PROVIDE OPPORTUNITIES FOR SLP MARKET PLAYERS
  • 7.6. INDUSTRIAL
    • 7.6.1. GROWING TREND OF IIOT AND INDUSTRY 4.0 TO DRIVE DEMAND FOR SLP IN INDUSTRIAL APPLICATIONS
  • 7.7. MILITARY, DEFENSE, AND AEROSPACE
    • 7.7.1. NORTH AMERICA TO LEAD SLP MARKET FOR MILITARY, DEFENSE AND AEROSPACE APPLICATIONS DUE TO INCREASING DEMAND FOR HIGH-PERFORMANCE PRINTED CIRCUIT BOARDS

8. SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY

  • 8.1. INTRODUCTION
  • 8.2. AUTOMATED OPTICAL INSPECTION (AOI)
    • 8.2.1. AOI TECHNOLOGY TO HOLD LARGEST SHARE OF SLP MARKET OWING TO INCREASED INTEREST OF SLP MANUFACTURERS IN ADOPTING ADVANCED INSPECTION TECHNOLOGIES
  • 8.3. DIRECT IMAGING (DI) OR LASER DIRECT IMAGING (LDI)
    • 8.3.1. STURDY GROWTH OF DI IN SLP MARKET BASED ON INSPECTION TECHNOLOGY AS IT OFFERS OPTIMAL QUALITY AT HIGH SPEED
  • 8.4. AUTOMATED OPTICAL SHAPING (AOS)
    • 8.4.1. SLP MARKET FOR AOS TECHNOLOGY TO GROW AT HIGHEST CAGR DUE TO ITS HIGH POTENTIAL FOR FINDINGS FAULTS AND SHAPING COPPER TRACKS

9. GEOGRAPHIC ANALYSIS

  • 9.1. INTRODUCTION
  • 9.2. NORTH AMERICA
    • 9.2.1. US
      • 9.2.1.1. High adoption of SLPs in consumer electronics applications to boost market growth in US
    • 9.2.2. CANADA
      • 9.2.2.1. Automotive and healthcare segments expected to provide opportunity for SLP market
    • 9.2.3. MEXICO
      • 9.2.3.1. Mexican market expected to grow at steady rate due to increasing government initiatives in industrial sector
  • 9.3. EUROPE
    • 9.3.1. GERMANY
      • 9.3.1.1. Germany expected to dominate European SLP market owing to growing automotive industry in country
    • 9.3.2. UK
      • 9.3.2.1. Increasing importance of smart manufacturing would augment SLP market growth in UK
    • 9.3.3. FRANCE
      • 9.3.3.1. Steady market growth in France owing to rising demand for SLPs in computing and communications applications
    • 9.3.4. ITALY
      • 9.3.4.1. Strong market growth in Italy owing to high adoption of SLPs by manufacturers of premium cars
    • 9.3.5. REST OF EUROPE
  • 9.4. ASIA PACIFIC
    • 9.4.1. CHINA
      • 9.4.1.1. China would witness highest growth rate in SLP market in APAC due to rising demand for consumer electronics in the country
    • 9.4.2. JAPAN
      • 9.4.2.1. Growth of SLP market in Japan will be driven by rising adoption of SLPs in communications, automotive, and medical applications
    • 9.4.3. SOUTH KOREA
      • 9.4.3.1. SLP market in South Korea would grow due to presence of OEMs such as Samsung in country
    • 9.4.4. TAIWAN
      • 9.4.4.1. Taiwan has strong presence of PCB providers who are likely to enter in SLP market
    • 9.4.5. REST OF APAC
  • 9.5. ROW
    • 9.5.1. MIDDLE EAST AND AFRICA
      • 9.5.1.1. SLP market growth in Middle East and Africa would be driven by rising adoption of SLPs in computing and communications applications
    • 9.5.2. SOUTH AMERICA
      • 9.5.2.1. South American market to witness highest CAGR in substrate-like PCB market in RoW

10. COMPETITIVE LANDSCAPE

  • 10.1. OVERVIEW
  • 10.2. RANKING ANALYSIS OF MARKET PLAYERS
    • 10.2.1. PRODUCT LAUNCHES/DEVELOPMENTS
    • 10.2.2. AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS
    • 10.2.3. ACQUISITIONS
    • 10.2.4. EXPANSIONS

11. COMPANY PROFILES (Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*

  • 11.1. OVERVIEW
  • 11.2. KEY PLAYERS
    • 11.2.1. KINSUS INTERCONNECT TECHNOLOGY
    • 11.2.2. IBIDEN
    • 11.2.3. COMPEQ
    • 11.2.4. UNIMICRON
    • 11.2.5. AT&S
    • 11.2.6. TTM TECHNOLOGIES
    • 11.2.7. SAMSUNG ELECTRO-MECHANICS
    • 11.2.8. KOREA CIRCUIT
    • 11.2.9. ZHEN DING TECHNOLOGY
  • 11.3. OTHER PLAYERS
    • 11.3.1. DAEDUCK GDS COMPANY
    • 11.3.2. ISU PETASYS
    • 11.3.3. TRIPOD TECHNOLOGY CORP
    • 11.3.4. LG INNOTEK

*Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.

12. APPENDIX

  • 12.1. DISCUSSION GUIDE
  • 12.2. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.3. RELATED REPORTS
  • 12.4. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE, 2017-2024 (USD MILLION)
  • TABLE 2: SUBSTRATE LIKE PCB MARKET FOR 25/25 AND 30/30 µM LINE/SPACE, BY INSPECTION TECHNOLOGY, 2017-2024 (USD MILLION)
  • TABLE 3: SLP MARKET FOR 25/25 AND 30/30 µM LINE/SPACE, BY APPLICATION, 2017-2024 (USD MILLION)
  • TABLE 4: SUBSTRATE-LIKE PCB MARKET FOR LESS THAN 25/25 LINE/SPACE, BY INSPECTION TECHNOLOGY, 2020-2024 (USD MILLION)
  • TABLE 5: SLP MARKET FOR LESS THAN 25/25 µM LINE/SPACE, BY APPLICATION, 2020-2024 (USD MILLION)
  • TABLE 6: SUBSTRATE-LIKE PCB MARKET, BY APPLICATION, 2017-2024 (USD MILLION)
  • TABLE 7: SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION, BY REGION, 2017-2024 (USD MILLION)
  • TABLE 8: SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION, BY LINE/SPACE, 2017-2024 (USD MILLION)
  • TABLE 9: SUBSTRATE-LIKE PCB MARKET FOR COMPUTING AND COMMUNICATIONS APPLICATION, BY REGION, 2019-2024 (USD MILLION)
  • TABLE 10: SUBSTRATE-LIKE PCB MARKET FOR COMPUTING & COMMUNICATIONS APPLICATION, BY LINE/SPACE, 2019-2024 (USD MILLION)
  • TABLE 11: SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY REGION, 2019-2024 (USD MILLION)
  • TABLE 12: SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY LINE/SPACE, 2019-2024 (USD MILLION)
  • TABLE 13: SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY REGION, 2020-2024 (USD MILLION)
  • TABLE 14: SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY LINE/SPACE, 2020-2024 (USD MILLION)
  • TABLE 15: SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY REGION, 2020-2024 (USD MILLION)
  • TABLE 16: SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY LINE/SPACE, 2020-2024 (USD MILLION)
  • TABLE 17: SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY REGION, 2020-2024 (USD MILLION)
  • TABLE 18: SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY LINE/SPACE, 2020-2024 (USD MILLION)
  • TABLE 19: SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY, 2017-2024 (USD MILLION)
  • TABLE 20: SUBSTRATE-LIKE PCB MARKET FOR AUTOMATIC OPTICAL INSPECTION, BY LINE/SPACE, 2017-2024 (USD MILLION)
  • TABLE 21: SUBSTRATE-LIKE PCB MARKET FOR DIRECT IMAGING, BY LINE/SPACE, 2017-2024 (USD MILLION)
  • TABLE 22: SUBSTRATE-LIKE PCB MARKET FOR AUTOMATED OPTICAL SHAPING, BY LINE/SPACE, 2017-2024 (USD MILLION)
  • TABLE 23: SUBSTRATE-LIKE PCB MARKET, BY REGION, 2017-2024 (USD MILLION)
  • TABLE 24: SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY COUNTRY, 2017-2024 (USD MILLION)
  • TABLE 25: SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY APPLICATION, 2017-2024 (USD MILLION)
  • TABLE 26: SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY COUNTRY, 2019-2024 (USD MILLION)
  • TABLE 27: SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY APPLICATION, 2019-2024 (USD MILLION)
  • TABLE 28: SUBSTRATE-LIKE PCB MARKET IN APAC, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 29: SUBSTRATE-LIKE PCB MARKET IN APAC, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 30: SUBSTRATE-LIKE PCB MARKET IN ROW, BY REGION, 2019-2024 (USD MILLION)
  • TABLE 31: SUBSTRATE-LIKE PCB MARKET IN ROW, BY APPLICATION, 2019-2024 (USD MILLION)
  • TABLE 32: RANKING ANALYSIS OF MARKET PLAYERS, 2017
  • TABLE 33: PRODUCT LAUNCHES, 2016-2018
  • TABLE 34: AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS, 2017-2018
  • TABLE 35: ACQUISITIONS, 2018
  • TABLE 36: EXPANSIONS, 2017-2018

LIST OF FIGURES

  • FIGURE 1: SUBSTRATE-LIKE PCB MARKET: PROCESS FLOW OF MARKET SIZE ESTIMATION
  • FIGURE 2: SUBSTRATE-LIKE PCB MARKET: RESEARCH DESIGN
  • FIGURE 3: SUBSTRATE-LIKE PCB MARKET: BOTTOM-UP APPROACH
  • FIGURE 4: TOP-DOWN APPROACH TO ARRIVE AT MARKET SIZE
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: ASSUMPTIONS FOR RESEARCH STUDY
  • FIGURE 7: 25/25 AND 30/30 µM LINE/SPACE SEGMENT EXPECTED TO HOLD LARGER SIZE OF SUBSTRATE-LIKE PCB MARKET BY 2024
  • FIGURE 8: AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN SLP MARKET DURING FORECAST PERIOD
  • FIGURE 9: AUTOMATED OPTICAL INSPECTION TECHNOLOGY EXPECTED TO HOLD LARGEST SHARE OF SUBSTRATE-LIKE PCB MARKET BY 2024
  • FIGURE 10: APAC TO ACCOUNT FOR LARGEST SHARE IN THE SLP MARKET BY 2024
  • FIGURE 11: GROWING ADOPTION OF SLP IN CONSUMER ELECTRONICS APPLICATIONS TO SURGE MARKET GROWTH DURING FORECAST PERIOD
  • FIGURE 12: CONSUMER ELECTRONICS AND CHINA ARE EXPECTED TO ACCOUNT FOR LARGEST SHARE OF SLP MARKET IN APAC IN 2024
  • FIGURE 13: SUBSTRATE-LIKE PCB MARKET IN CHINA TO GROW AT FASTEST RATE DURING FORECAST PERIOD
  • FIGURE 14: SURGE IN DEMAND FOR SMART CONSUMER ELECTRONICS AND WEARABLE DEVICES DRIVES THE SLP MARKET GROWTH
  • FIGURE 15: SUBSTRATE-LIKE PCB MARKET SEGMENTATION, BY LINE/SPACE (L/S)
  • FIGURE 16: 25/25 & 30/30 µM LINE/SPACE SEGMENT EXPECTED TO DOMINATE SLP MARKET, IN TERMS OF SIZE, DURING FORECAST PERIOD
  • FIGURE 17: AUTOMATED OPTICAL INSPECTION TECHNOLOGY TO ACCOUNT FOR LARGEST SIZE OF MARKET FOR SLP HAVING 25/25 AND 30/30 µM LINE/SPACE IN 2024
  • FIGURE 18: AUTOMATED OPTICAL INSPECTION TECHNOLOGY-BASED SLP WITH LESS THAN 25/25 µM LINE/SPACE TO ACCOUNT FOR LARGEST MARKET SIZE DURING 2020-2024
  • FIGURE 19: SUBSTRATE-LIKE PCB MARKET, BY APPLICATION
  • FIGURE 20: CONSUMER ELECTRONICS APPLICATION TO ACCOUNT FOR LARGEST SIZE OF SLP MARKET IN 2024
  • FIGURE 21: APAC TO DOMINATE SLP MARKET FOR CONSUMER ELECTRONICS APPLICATION DURING FORECAST PERIOD
  • FIGURE 22: 25/25 & 30/30 µM LINE/SPACE SEGMENT TO COMMAND SLP MARKET FOR COMPUTING AND COMMUNICATIONS APPLICATIONS DURING FORECAST PERIOD
  • FIGURE 23: APAC TO LEAD SLP MARKET FOR AUTOMOTIVE APPLICATIONS IN COMING YEARS
  • FIGURE 24: NORTH AMERICA TO HOLD LARGEST SIZE OF SLP MARKET FOR MEDICAL APPLICATIONS DURING FORECAST PERIOD
  • FIGURE 25: 25/25 & 30/30 µM LINE/SPACE SEGMENT TO HOLD LARGER SIZE OF SPL MARKET FOR INDUSTRIAL APPLICATION IN 2024
  • FIGURE 26: NORTH AMERICA TO RULE SLP MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION DURING FORECAST PERIOD
  • FIGURE 27: SUBSTRATE-LIKE PCB MARKET SEGMENTATION, BY INSPECTION TECHNOLOGY
  • FIGURE 28: SLP MARKET BASED ON AOI TECHNOLOGY TO LEAD THE MARKET BY 2024
  • FIGURE 29: AOI IN MANUFACTURING PROCESS
  • FIGURE 30: 25/25 & 30/30 µM LINE/SPACE SEGMENT TO HOLD LARGER SIZE OF SLP MARKET FOR AOI DURING FORECAST PERIOD
  • FIGURE 31: SCHEMATIC LDI SYSTEM
  • FIGURE 32: APAC TO LEAD SUBSTRATE LIKE PCB MARKET BY 2024
  • FIGURE 33: SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN NORTH AMERICA
  • FIGURE 34: US TO LEAD SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA DURING FORECAST PERIOD
  • FIGURE 35: SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN EUROPE
  • FIGURE 36: GERMANY TO HOLD LARGEST SIZE OF SUBSTRATE-LIKE PCB MARKET IN EUROPE DURING FORECAST PERIOD
  • FIGURE 37: SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN APAC
  • FIGURE 38: CHINA TO COMMAND SUBSTRATE-LIKE PCB MARKET IN APAC WITH LARGEST SIZE DURING FORECAST PERIOD
  • FIGURE 39: SOUTH AMERICA TO LEAD SUBSTRATE-LIKE PCB MARKET IN ROW DURING FORECAST PERIOD
  • FIGURE 40: ORGANIC AND INORGANIC STRATEGIES ADOPTED BY COMPANIES OPERATING IN SUBSTRATE-LIKE PCB MARKET
  • FIGURE 41: KINSUS INTERCONNECT TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 42: IBIDEN: COMPANY SNAPSHOT
  • FIGURE 43: COMPEQ: COMPANY SNAPSHOT
  • FIGURE 44: UNIMICRON: COMPANY SNAPSHOT
  • FIGURE 45: AT&S: COMPANY SNAPSHOT
  • FIGURE 46: TTM TECHNOLOGIES: COMPANY SNAPSHOT
  • FIGURE 47: SAMSUNG ELECTRO-MECHANICS: COMPANY SNAPSHOT
  • FIGURE 48: KOREA CIRCUIT: COMPANY SNAPSHOT
  • FIGURE 49: ZHEN DING TECHNOLOGY: COMPANY SNAPSHOT
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