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市场调查报告书

HMC (混合记忆体立方体)、HBM (宽带记忆体)的全球市场的预测 ~2023年:记忆体的各类型 (HMC、HBM)、各产品种类 (GPU、CPU、APU、FPGA、ASIC)、各用途 (图形、高性能运算、网路、资料中心)、各地区

Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023

出版商 MarketsandMarkets 商品编码 356156
出版日期 内容资讯 英文 136 Pages
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HMC (混合记忆体立方体)、HBM (宽带记忆体)的全球市场的预测 ~2023年:记忆体的各类型 (HMC、HBM)、各产品种类 (GPU、CPU、APU、FPGA、ASIC)、各用途 (图形、高性能运算、网路、资料中心)、各地区 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023
出版日期: 2018年03月06日内容资讯: 英文 136 Pages
简介

全球HMC、HBM的市场,预计2018年达9亿2270万美元,2022年达38亿4250万美元,以33.02%的年复合成长率 (CAGR) 成长。市场成长的主要原因,是高频宽、省电力、高扩充性记忆体的需求增加,及人工智能 (AI)的普及,电子设备的小型化等。另一方面,设计的困难成为市场成长的瓶颈。

本报告提供全球HMC (混合记忆体立方体) 及HBM (宽带记忆体)的市场调查,产品定义与市场概要,产业结构与价值链,市场规模的变化与预测,市场成长的影响因素,各记忆体/产品类型、各用途、各地区的详细趋势,竞争环境,主要企业简介等汇整。

第1章 简介

第2章 调查手法

第3章 摘要整理

第4章 重要考察

第5章 市场概要

  • 简介
  • 市场动态
    • 成长推动因素
      • 频宽高,消耗功率少,扩充性高的记忆体的需求增加
      • 人工智能 (AI)的普及
      • 电子设备小型化的发展
    • 阻碍成长要素
      • 集积等级的上升伴随的热处理问题
    • 市场机会
      • 云端基础、服务的需求增加
      • 巨量资料的成长
    • 课题
      • HMC、HBM的设计的复杂
      • 生态系统的开发
  • 价值链分析

第6章 HMC、HBM市场:记忆体的各类型

  • 简介
  • HMC (混合记忆体立方体)
  • HBM (宽带记忆体)

第6章 HMC、HBM市场:各类型产品

  • 简介
  • CPU (中央处理器)
  • FPGA (现场可程式化闸阵列)
  • GPU (影像处理单位)
  • ASIC (特定用途的积体电路)
  • APU (Accelerated Processing Unit)

第8章 HMC、HBM市场:各用途

  • 简介
  • HPC (高性能运算)
  • 网路
  • 资料中心
  • 图形

第9章 地区分析

  • 简介
  • 北美 (美国,加拿大,墨西哥)
  • 欧洲 (英国,德国,法国等)
  • 亚太地区 (中国,日本,韩国,台灣等)
  • 其他的国家 (RoW:中东、非洲,南美)

第10章 竞争环境

  • 概要
  • 排行榜分析
  • 竞争方案
    • 产品开发、销售
    • 事业联盟、合作,协定
    • 企业收购
    • 投资、事业扩张

第11章 企业简介 (产业概要,主要产品与服务,近几年趋势,SWOT分析,MnM的见解)

  • 代表性企业
    • MICRON
    • SAMSUNG
    • SK HYNIX
    • ADVANCED MICRO DEVICES
    • INTEL
    • XILINX
    • 富士通
    • NVIDIA
    • IBM
    • OPEN-SILICON
  • 其他主要企业
    • ARIRA
    • CADENCE
    • MARVELL
    • CRAY
    • RAMBUS
    • ARM

第12章 附录

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目录
Product Code: SE 4220

"The HMC and HBM market is estimated to grow at a CAGR of 33.02% between 2018 and 2023."

The HMC and HBM market is emerging and is expected to grow further in the coming years. The market for HMC and HBM is likely to be valued at USD 922.7 million in 2018 and USD 3,842.5 million by 2023, at a CAGR of 33.02% between 2018 and 2023. The factors that drive the market growth include the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices. However, thermal issues caused by high level of integration restrict the growth of the HMC and HBM market.

"Market for HBM expected to grow at the higher CAGR during the forecast period."

Currently, the major application of HBM is graphics. With improved specifications, HBM has started gaining traction in high-performance computing, cloud computing, and networking; the adoption of the HBM technology in these applications is further expected to increase in the coming years. Moreover, HBM is priced at a lower cost than HMC; this has encouraged companies to integrate HBM in their high-end products.

"Market for CPU accounted for the largest share in 2017."

The high market share of CPUs is due to their significant adoption in high-performance computing, especially in data centers. HMCs have been developed for this particular application to support advanced and intensive real-time operation. CPU plays a critical role in deterring how content can be handled. More the applications and content utility more processing capability is required in CPU. Therefore, advanced CPUs widely adopt the HMC and HBM technology to increase the performance of CPUs for servers rather than increasing the number of CPUs. The leading player in the CPU market, Intel (US) offers processors with inbuilt HMC, serving a large market of HPC and data centers.

"Market for graphics application expected to grow at the highest CAGR during the forecast period."

A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process more pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.

"Market in North America accounted for the largest share in 2017."

The high adoption of HMC and HBM memories in North America is largely attributed to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries. Other key tech companies such as Google, Amazon, and Microsoft are headquartered in the US and have served to drive the demand for high-performing CPUs in servers and supercomputers.

Breakdown of Profiles of Primary Participants:

  • By Company: Tier 1 = 32%, Tier 2 = 51%, and Tier 3 = 17%
  • By Designation: C-level Executives = 27%, Directors = 41%, and Others = 32%
  • By Region: North America = 40%, Europe = 16%, APAC = 38%, and RoW = 6%

Major players profiled in this report include:

  • Micron (US)
  • Samsung (South Korea)
  • SK Hynix (South Korea)
  • Intel (US)
  • AMD (US)
  • Fujitsu (Japan
  • IBM (US)
  • NVIDIA (US)
  • Xilinx (US)
  • Open-Silicon (US)

Research Coverage:

The study segments in the HMC and HBM market report include memory type-HMC and HBM; product type- graphics processing unit, central processing unit, accelerated processing unit, field-programmable gate array, application-specific integrated circuit. The study also covers applications and geographic forecast of the market size for various segments with regard to four main regions-North America, Europe, APAC, and RoW.

Reasons to Buy the Report:

The report would help the market leaders/new entrants in this market in the following ways:

  • 1. This report segments the HCM and HBM market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
  • 2. The report gives the detailed analysis of the HMC and HBM market with the help of competitive landscape and value chain analysis, including the key companies in the market and their relations in the ecosystem.
  • 3. The report helps stakeholders understand the pulse of the market and provides them the information on key drivers, restraints, challenges, and opportunities pertaining to the HMC and HBM market.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. GEOGRAPHIC SCOPE
    • 1.3.3. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primary interviews
    • 2.1.3. SECONDARY AND PRIMARY RESEARCH
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
      • 2.2.1.1. Approach for capturing the market size by bottom-up analysis (demand side)
    • 2.2.2. TOP-DOWN APPROACH
      • 2.2.2.1. Approach for capturing the market share by top-down analysis (supply side)
  • 2.3. DATA TRIANGULATION
  • 2.4. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. HMC AND HBM MARKET OVERVIEW
  • 4.2. HMC MARKET, BY APPLICATION
  • 4.3. HMC AND HBM MARKET IN APAC
  • 4.4. GEOGRAPHIC SNAPSHOT OF THE HMC AND HBM MARKET
  • 4.5. HMC AND HBM MARKET IN APAC, BY COUNTRY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Growing need for high-bandwidth, low power consuming, and highly scalable memories
      • 5.2.1.2. Increasing adoption of artificial intelligence
      • 5.2.1.3. Rising trend of miniaturization of electronic devices
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Thermal issues caused by high levels of integration
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. High demand for cloud-based services
      • 5.2.3.2. Growing Big Data
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Design complexities associated with HMC and HBM
      • 5.2.4.2. Ecosystem development
  • 5.3. VALUE CHAIN ANALYSIS

6. HMC AND HBM MARKET, BY MEMORY TYPE

  • 6.1. INTRODUCTION
  • 6.2. HYBRID MEMORY CUBE (HMC)
  • 6.3. HIGH-BANDWIDTH MEMORY (HBM)

7. HMC AND HBM MARKET, BY PRODUCT TYPE

  • 7.1. INTRODUCTION
  • 7.2. CENTRAL PROCESSING UNIT
  • 7.3. FIELD-PROGRAMMABLE GATE ARRAY
  • 7.4. GRAPHICS PROCESSING UNIT
  • 7.5. APPLICATION-SPECIFIC INTEGRATED CIRCUIT
  • 7.6. ACCELERATED PROCESSING UNIT

8. HMC AND HBM MARKET, BY APPLICATION

  • 8.1. INTRODUCTION
  • 8.2. HIGH-PERFORMANCE COMPUTING (HPC)
  • 8.3. NETWORKING
  • 8.4. DATA CENTERS
  • 8.5. GRAPHICS

9. GEOGRAPHIC ANALYSIS

  • 9.1. INTRODUCTION
  • 9.2. NORTH AMERICA
    • 9.2.1. US
    • 9.2.2. CANADA
    • 9.2.3. MEXICO
  • 9.3. EUROPE
    • 9.3.1. UK
    • 9.3.2. GERMANY
    • 9.3.3. FRANCE
    • 9.3.4. REST OF EUROPE
  • 9.4. APAC
    • 9.4.1. CHINA
    • 9.4.2. JAPAN
    • 9.4.3. SOUTH KOREA
    • 9.4.4. TAIWAN
    • 9.4.5. REST OF APAC
  • 9.5. ROW
    • 9.5.1. MIDDLE EAST AND AFRICA
    • 9.5.2. SOUTH AMERICA

10. COMPETITIVE LANDSCAPE

  • 10.1. OVERVIEW
  • 10.2. RANKING ANALYSIS
  • 10.3. COMPETITIVE SCENARIO
    • 10.3.1. PRODUCT DEVELOPMENTS AND LAUNCHES
    • 10.3.2. PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS
    • 10.3.3. ACQUISITIONS
    • 10.3.4. INVESTMENTS AND EXPANSIONS

11. COMPANY PROFILES (Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*

  • 11.1. KEY PLAYERS
    • 11.1.1. MICRON
    • 11.1.2. SAMSUNG
    • 11.1.3. SK HYNIX
    • 11.1.4. ADVANCED MICRO DEVICES
    • 11.1.5. INTEL
    • 11.1.6. XILINX
    • 11.1.7. FUJITSU
    • 11.1.8. NVIDIA
    • 11.1.9. IBM
    • 11.1.10. OPEN-SILICON
  • 11.2. OTHER KEY COMPANIES
    • 11.2.1. ARIRA
    • 11.2.2. CADENCE
    • 11.2.3. MARVELL
    • 11.2.4. CRAY
    • 11.2.5. RAMBUS
    • 11.2.6. ARM

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.

12. APPENDIX

  • 12.1. INSIGHTS OF INDUSTRY EXPERTS
  • 12.2. DISCUSSION GUIDE
  • 12.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 12.5. AVAILABLE CUSTOMIZATIONS
  • 12.6. RELATED REPORTS
  • 12.7. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: HMC AND HBM MARKET, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 2: HBM2 VS. HMC (GEN3)
  • TABLE 3: HMC MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 4: HBM MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 5: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 6: HMC AND HBM MARKET FOR CENTRAL PROCESSING UNIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 7: HMC AND HBM MARKET FOR CENTRAL PROCESSING UNIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 8: HMC AND HBM MARKET FOR FIELD-PROGRAMMABLE GATE ARRAY, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 9: HMC AND HBM MARKET FOR FIELD-PROGRAMMABLE GATE ARRAY, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 10: HMC AND HBM MARKET FOR GRAPHICS PROCESSING UNIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 11: HMC AND HBM MARKET FOR GRAPHICS PROCESSING UNIT MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 12: HMC AND HBM MARKET FOR APPLICATION-SPECIFIC INTEGRATED CIRCUIT, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 13: HMC AND HBM, MARKET FOR APPLICATION-SPECIFIC INTEGRATED CIRCUIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 14: HMC AND HBM MARKET FOR ACCELERATED PROCESSING UNIT MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 15: HMC AND HBM MARKET FOR ACCELERATED PROCESSING UNIT, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 16: HMC AND HBM MARKET, BY APPLICATION, 2016-2023 (USD MILLION)
  • TABLE 17: HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 18: HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 19: HMC AND HBM MARKET FOR NETWORKING APPLICATIONS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 20: HMC AND HBM MARKET FOR NETWORKING, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 21: HMC AND HBM MARKET FOR DATA CENTER APPLICATIONS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 22: HMC AND HBM MARKET FOR DATA CENTER APPLICATIONS, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 23: HMC AND HBM MARKET FOR GRAPHICS, BY MEMORY TYPE, 2016-2023 (USD MILLION)
  • TABLE 24: HMC AND HBM MARKET FOR GRAPHICS, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 25: HMC AND HBM MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 26: NORTH AMERICA: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 27: NORTH AMERICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 28: NORTH AMERICA: GRAPHICS PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 29: NORTH AMERICA: CENTRAL PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 30: NORTH AMERICA: ACCELERATED PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 31: NORTH AMERICA: FIELD-PROGRAMMABLE GATE ARRAY MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 32: NORTH AMERICA: APPLICATION-SPECIFIC INTEGRATED CIRCUIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 33: US: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 34: CANADA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 35: MEXICO: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 36: EUROPE: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 37: EUROPE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 38: EUROPE: GRAPHICS PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 39: EUROPE: CENTRAL PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 40: EUROPE: ACCELERATED PROCESSING UNIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 41: EUROPE: FIELD-PROGRAMMABLE GATE ARRAY MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 42: EUROPE: APPLICATION-SPECIFIC INTEGRATED CIRCUIT MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 43: UK: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 44: GERMANY: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 45: FRANCE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 46: ROE: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 47: APAC: HMC AND HBM MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 48: APAC: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 49: APAC: GRAPHICS PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 50: APAC: CENTRAL PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 51: APAC: ACCELERATED PROCESSING UNITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 52: APAC: FIELD-PROGRAMMABLE GATE ARRAYS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 53: APAC: APPLICATION-SPECIFIC INTEGRATED CIRCUITS MARKET, BY COUNTRY, 2016-2023 (USD MILLION)
  • TABLE 54: CHINA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 55: JAPAN: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 56: SOUTH KOREA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 57: TAIWAN: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 58: ROA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 59: ROW: HMC AND HBM MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 60: ROW: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 61: ROW: GRAPHICS PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 62: ROW: CENTRAL PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 63: ROW: ACCELERATED PROCESSING UNITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 64: ROW: FIELD-PROGRAMMABLE GATE ARRAYS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 65: ROW: APPLICATION-SPECIFIC INTEGRATED CIRCUITS MARKET, BY REGION, 2016-2023 (USD MILLION)
  • TABLE 66: MIDDLE EAST AND AFRICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 67: SOUTH AMERICA: HMC AND HBM MARKET, BY PRODUCT TYPE, 2016-2023 (USD MILLION)
  • TABLE 68: RANKING ANALYSIS OF THE TOP 5 PLAYERS IN THE HMC AND HBM MARKET
  • TABLE 69: PRODUCT DEVELOPMENTS AND LAUNCHES, 2016-2017
  • TABLE 70: PARTNERSHIPS, AGREEMENTS, AND COLLABORATIONS, 2015-2017
  • TABLE 71: ACQUISITIONS, 2015
  • TABLE 72: INVESTMENTS AND EXPANSIONS, 2013-2014

LIST OF FIGURES

  • FIGURE 1: HMC AND HBM MARKET SEGMENTATION
  • FIGURE 2: RESEARCH FLOW
  • FIGURE 3: HMC AND HBM MARKET: RESEARCH DESIGN
  • FIGURE 4: BOTTOM-UP APPROACH
  • FIGURE 5: TOP-DOWN APPROACH
  • FIGURE 6: DATA TRIANGULATION
  • FIGURE 7: HBM TO REGISTER THE HIGHER CAGR IN THE HMC & HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 8: MARKET FOR APU TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 9: CPU MARKET FOR HIGH-PERFORMANCE COMPUTING TO ACCOUNT FOR THE LARGEST MARKET SHARE DURING THE FORECAST PERIOD
  • FIGURE 10: HMC AND HBM MARKET FOR GRAPHICS APPLICATIONS TO GROW AT THE HIGHEST CAGR DURING 2018-2023
  • FIGURE 11: NORTH AMERICA TO ACCOUNT FOR THE LARGEST MARKET SHARE IN 2017
  • FIGURE 12: HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE THE MARKET FOR HMC AND HBM
  • FIGURE 13: HMC MARKET FOR GRAPHICS APPLICATIONS TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 14: CPU SEGMENT HELD THE LARGEST SHARE OF THE HMC AND HBM MARKET IN APAC IN 2017
  • FIGURE 15: HMC AND HBM MARKET IN APAC TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 16: HMC AND HBM MARKET IN SOUTH KOREA TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 17: GROWING NEED FOR HIGH-BANDWIDTH, LOW POWER CONSUMING, AND HIGHLY SCALABLE MEMORIES IS DRIVING THE GROWTH OF THE HMC AND HBM MARKET
  • FIGURE 18: BIG DATA VOLUME, 2014-2020 (ZETTABYTES)
  • FIGURE 19: VALUE CHAIN: HMC AND HBM MARKET, 2017
  • FIGURE 20: HBM TO REGISTER THE HIGHEST GROWTH RATE IN THE HMC & HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 21: ACCELERATED PROCESSING UNIT SEGMENT TO GROW AT THE HIGHEST CAGR IN THE HMC AND HBM MARKET DURING THE FORECAST PERIOD
  • FIGURE 22: HIGH-PERFORMANCE COMPUTING, THE LARGEST APPLICATION SEGMENT IN THE CENTRAL PROCESSING UNIT MARKET
  • FIGURE 23: MARKET FOR APU IN APAC TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 24: HMC AND HBM MARKET FOR GRAPHICS TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 25: APU HMC AND HBM MARKET FOR HIGH-PERFORMANCE COMPUTING TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 26: GEOGRAPHIC SNAPSHOT: APAC COUNTRIES TO REGISTER HIGHEST GROWTH DURING THE FORECAST PERIOD (2018-2023)
  • FIGURE 27: APAC MARKET TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 28: MARKET SNAPSHOT: NORTH AMERICA
  • FIGURE 29: APU SEGMENT TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD IN THE US
  • FIGURE 30: MARKET SNAPSHOT: EUROPE
  • FIGURE 31: ACCELERATED PROCESSING UNIT SEGMENT TO GROW AT THE HIGHEST RATE IN THE ROE MARKET DURING THE FORECAST PERIOD
  • FIGURE 32: MARKET SNAPSHOT: APAC
  • FIGURE 33: CENTRAL PROCESSING UNITS SEGMENT TO HOLD LARGEST SHARE OF THE MARKET IN CHINA
  • FIGURE 34: COMPANIES ADOPTED PRODUCT DEVELOPMENTS AND LAUNCHES AS THE KEY GROWTH STRATEGY OVER THE LAST FIVE YEARS (2013-2017)
  • FIGURE 35: MICRON: COMPANY SNAPSHOT
  • FIGURE 36: SAMSUNG: COMPANY SNAPSHOT
  • FIGURE 37: SK HYNIX: COMPANY SNAPSHOT
  • FIGURE 38: AMD: COMPANY SNAPSHOT
  • FIGURE 39: INTEL: COMPANY SNAPSHOT
  • FIGURE 40: XILINX: COMPANY SNAPSHOT
  • FIGURE 41: FUJITSU: COMPANY SNAPSHOT
  • FIGURE 42: NVIDIA: COMPANY SNAPSHOT
  • FIGURE 43: IBM: COMPANY SNAPSHOT
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