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市场调查报告书

全球智慧和智能包装市场:2020-2030年

Smart and Intelligent Packaging 2020-2030

出版商 IDTechEx Ltd. 商品编码 813705
出版日期 内容资讯 英文 258 Slides
商品交期: 最快1-2个工作天内
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全球智慧和智能包装市场:2020-2030年 Smart and Intelligent Packaging 2020-2030
出版日期: 2019年10月02日内容资讯: 英文 258 Slides
简介

本报告研究全球智慧包装市场,汇整市场定义和概要、导入智慧包装技术的推动因素分析、各种实现技术趋势和评估、案例研讨、按技术区分的市场规模推移和预测、主要企业简介等情报。

第1章 摘要整理和结论

第2章 智慧包装:成长推动因素

  • 智慧包装需求
  • 零售产业问题
  • 医疗保健问题
  • 以更好的方式使用更多人类感官

第3章 末端使用者回馈

  • 末端使用者需求:智慧包装推动因素
  • 末端使用者的智慧包装回馈:应用需求
  • 末端使用者的智慧包装看法:技术需求
  • P&G和印刷电子
  • Diage和印刷电子
  • Amcor
  • Colgate-Palmolive Group
  • Unilever

第4章 RFID:智慧包装的NFC和RAIN

  • RFID
  • RFID技术:整体样貌
  • 被动式RFID
  • 偏好的RFID频率
  • 被动RFID系统
  • 电池辅助被动/半主动标签
  • 电池辅助被动 (BAP) RFID感测器案例
  • 主动式RFID
  • RTLS
  • 无晶片/印刷RFID
  • 被动RFID技术:按工作频率
  • 被动HF和UHF标签解剖
  • 连接HF/NFC线圈的课题
  • 被动式RFID的威胁:机器视觉、其他

第5章 印刷、软性、有机电子

  • 印刷、软性、有机电子主要技术组件之说明和分析
  • 市场潜力和盈利能力
  • 目前市场规模
  • 市场投入策略:优缺点
  • 价值链、其他

第6章 显示器

  • 电致变色显示器
  • AC电激发光显示器
  • 热致变色显示器

第7章 印刷LED照明

第8章 印刷软性电池

第9章 印刷感测器

第10章 逻辑

  • 软性/印刷电晶体电路各种类型
  • 为什么是印刷电晶体?
  • 半导体选项比较
  • 仍存在课题
  • 半导体选项
  • 既有TFT技术:基于矽
  • 金属氧化物半导体
  • 金属氧化物制造流程
  • 但可以利用金属氧化物半导体印刷吗?
  • Evonik解决方案:可加工的金属氧化物
  • iXensic最新进展
  • 有机半导体
  • OTFT活动性炒作:真实检验
  • 全印刷TFT
  • 次世代印刷电子技术研究组合 (JAPERA) 的全印刷TFT
  • S2S自动印刷OTFT
  • Roll-to-roll印刷有机TFT
  • Merck有机TFT
  • 碳奈米管和石墨烯电晶体
  • 软性/印刷电晶体 RFID的最新进展、其他

第11章 QR码

第12章 电容/INK STRIPE IDENTIFICATION

  • 无电晶体RFID:HidE (Hidden Electronic Product Code)
  • Printechnologics的印刷ID
  • 雷达ID 60GHz
  • Inksure:SARcode案例
  • Touchcode:T-ink / Printechnologics
  • Touchcode应用概念
  • Touchcode进步
  • TicTag
  • Prismade Labs

第13章 RFID感测器

  • RFID感测器:主要选择
  • 透过IC标签的RFID标签感测器
  • 被动UHF RFID 感测器:Powercast□Vanguard ID Systems的共同开发
  • 被动UHF RFID 感测器:RFMicron□Smartrac
  • GE/ Kemsense:基于传统型RFID标签的生物感测器
  • 化学无损RFID感测器标签
  • 失败教训

第14章 化学品智慧包装技术

  • 食品劣化
  • 微生物腐败
  • 化学和酵素活性
  • 氧化劣化/酸败
  • 水分/蒸气移动
  • 保存期限判定
  • 食品劣化
  • 时间温度指示器(TTI)
  • 化学时间温度指示器(TTI)案例
  • 新鲜度指示器?
  • 成熟度指示器?
  • 时间指示器?、其他

第15章 智慧包装应用:传统RFID

  • 拖板/箱装标签
  • 零售服饰、物品级别
  • 防伪RFID
  • 日本经济产业省的标签目标
  • Coca-Cola Freestyle Machine、其他

第16章 智慧泡壳包装

  • 用药不顺应课题
  • 目前解决方案
  • 印刷电子/ RFID解决方案
  • 智慧泡壳包装、其他

第17章 智慧包装:案例研讨

第18章 电子智慧包装:市场预测

  • RAIN (UHF RFID) 智慧包装
    • 标签数预测
    • 平均价格预测
    • 市场规模预测
  • NFC (HF RFID) 智慧包装
    • 标签数预测
    • 平均价格预测
    • 市场规模预测
  • 电子智慧包装
    • 总数预测
    • 市场规模预测
  • 课题和市场机会

第19章 附录:企业简介

第20章 附录:术语表

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目录

Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.

This comprehensive IDTechEx Research report covers the upcoming requirements and drivers for smart packaging; feedback from Fast Moving Consumer Goods (FMCG) brands with their views of smart packaging; assessment of enabling technologies; smart packaging case studies; key players; and forecasts of electronic smart packaging.

This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.

IDTechEx concludes how the global demand for electronic smart packaging features will be a $895 million market in 2030 versus $55 million in 2020 (and more if the infrastructure, software and services are also included). Based on an impartial analysis, IDTechEx expects that almost 21 billion packages sold in 2030 will feature an electronic feature to enhance the package.

Why Smart and Intelligent Packaging?

Smart and intelligent packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face potential oblivion from competing products. Other drivers include counterfeiting to the ageing population's need for better drug delivery devices.

There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:

  • RFID for wireless item identification (usually invisible to the consumer)
  • Electronic Articles Surveillance (EAS) for anti theft (usually invisible to the consumer)
  • QR codes for identification (increasingly used for payments)
  • Data loggers for temperature, shock, vibration, etc monitoring
  • Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
  • Chemical indicators: temperature, frozen chemical visual indicators
  • Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
  • External active packaging: whereby the package releases aromas, for example, to entice consumers

Drivers for Smart Packaging

There are prominent drivers for smart packaging, including the ageing population, more wealthy consumers, requirement for more data on products purchased, entertainment value, need to distinguish products amidst greater competition and tougher legislation.

Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.

Across that backdrop there are other significant impending changes, from increasing home delivery of products and groceries which may change the value of the product packaging in the decision and sales process to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels. Of course, sustainability is also a high priority for brands.

Global, Detailed Assessment of Smart Packaging

This report from IDTechEx covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.

The report is structured as follows:

  • Executive summary, including key conclusions and forecasts

The need for Smart Packaging and brand perspectives This section covers the drivers for smart packaging, end user requirements and voice of the customer based on feedback from global FMCG firms on their perspectives on smart packaging

  • RFID: NFC and RAIN for Smart Packaging
  • NFC and RAIN technologies, prices and their application to packaging
  • Printed, Flexible and Organic Electronics
  • Assessment of enabling technologies including displays, flexible/printed batteries, printed sensors and flexible logic circuits
  • QR codes
  • Failures and successes, analysis of use of QR codes in China
  • Capacitive ink strip / identification systems
  • Analysis of novel identification systems relevant to smart packaging
  • RFID Sensors
  • NFC and RAIN sensor systems, passive or with battery
  • Chemical smart packaging technologies
  • Review of chemical smart packaging technologies including time temperature and freshness indicators
  • Smart Packaging Applications: RFID
  • Applications and case studies of RFID smart packaging
  • Smart Blister Packs
  • Assessment of smart blister packs for monitoring medication compliance'
  • Smart Packaging Case Studies
  • Case studies and applications of printed electronics in smart packaging
  • Electronic Smart Packaging Forecasts
  • Forecasts and conclusions of electronic smart packaging. Forecasts are given in terms of number of units, average sales price and total market value for each of the following: NFC, RAIN RFID, Light-up/display based electronic smart packaging, audio smart packaging

Opportunities in Smart Packaging

The report identifies and assesses the many challenges still to be addressed, including the value of tagging products in the highest volume versus cost, sustainable profitable applications beyond one-off projects, environmental impact and unmet needs including the lack of integrators and complete product designers. Applicable technologies are assessed with details of the key players.

All of these opportunities and trends, including detailed ten year forecasts, are covered in this IDTechEx report "Smart and Intelligent Packaging 2020-2030". The report reveals many ways in which brands can create a sharp increase in market share, customer satisfaction and profitability. It covers case studies of successes and failures and why.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1.What is Smart Packaging?
  • 1.2.Why Smart Packaging - Logistical and Safety Reasons
  • 1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
  • 1.4.Smart Packaging - Status
  • 1.5.Smart Packaging: Things Are Changing
  • 1.6.EAS tags
  • 1.7.QR Codes
  • 1.8.Unique ID with no silicon chip
  • 1.9.Chipless RFID or Flexible/Printed IC Passive tags
  • 1.10.RAIN (UHF RFID) Smart Packaging
  • 1.11.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 1.12.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 1.13.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 1.14.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 1.15.NFC (HF RFID) Smart Packaging
  • 1.16.NFC (HF RFID) tags 2020-2030 - numbers million
  • 1.17.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 1.18.NFC (HF RFID) tags 2020-2030 - market value $M
  • 1.19.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 1.20.Electronic Smart Packaging beyond RFID
  • 1.21.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 1.22.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 1.23.Challenges and Opportunities

2. SMART PACKAGING DRIVERS

  • 2.1.The need for smart packaging
  • 2.2.Problems in the retail industry
  • 2.3.Problems in healthcare
  • 2.4.Using more of the human senses and in a better way

3. END-USER FEEDBACK

  • 3.1.End User Needs: Drivers for Smart Packaging
  • 3.2.End User Feedback on Smart Packaging - Application Needs
  • 3.3.End User Views on Smart Packaging - Technical Needs
  • 3.4.P&G and printed electronics
  • 3.5.Diageo and printed electronics
  • 3.6.Amcor
  • 3.7.Colgate-Palmolive Group
  • 3.8.Unilever

4. RFID: NFC AND RAIN FOR SMART PACKAGING

  • 4.1.RFID
  • 4.2.RFID Technologies: The Big Picture
  • 4.3.Passive RFID
  • 4.4.Favourite RFID frequencies
  • 4.5.Passive RFID Systems
  • 4.6.Battery Assisted Passive /Semi Active tags
  • 4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
  • 4.8.Active RFID
  • 4.9.Real Time Locating Systems (RTLS)
  • 4.10.Chipless/printed RFID
  • 4.11.Passive RFID: Technologies by Operating Frequency
  • 4.12.Anatomy of passive HF and UHF tags
  • 4.13.Challenges in contacting HF/NFC coils
  • 4.14.Threats to passive RFID: machine vision?
  • 4.15.Might Packaging Become Irrelevant with Online Retailing?

5. PRINTED, FLEXIBLE AND ORGANIC ELECTRONICS

  • 5.1.Description and analysis of the main technology components of printed, flexible and organic electronics
  • 5.2.Market potential and profitability
  • 5.3.Current market size
  • 5.4.Go to Market Strategies: Pros and Cons
  • 5.5.The value chain is unbalanced
  • 5.6.But many have shifted to provide complete solutions
  • 5.7.Many enabling printed electronic technologies are an enabler but not an obvious product
  • 5.8.Creating successful new products is hard
  • 5.9.Cost reduction has been more commercially successful...
  • 5.10....but if it is the only differentiator suppliers can struggle
  • 5.11.Competing on more than cost has been the most successful
  • 5.12.Keep It Simple, Stupid

6. DISPLAYS

  • 6.1.Electrochromic displays
    • 6.1.1.Electrochromic displays
    • 6.1.2.Ynvisible Electrochromic Displays
  • 6.2.AC Electroluminescent displays
    • 6.2.1.AC Electroluminescent displays
    • 6.2.2.AC electroluminescent displays
    • 6.2.3.EL technology
    • 6.2.4.AC Electroluminescent (EL) Displays
  • 6.3.Thermochromic displays
    • 6.3.1.Thermochromic Displays

7. PRINTED LED LIGHTING

  • 7.1.Printed LED lighting
  • 7.2.Nth Degree - Printed LEDs

8. PRINTED, FLEXIBLE BATTERIES

  • 8.1.Introduction to batteries
  • 8.2.Comparison of Power Options
  • 8.3.Applications

9. PRINTED SENSORS

  • 9.1.Applications of printed batteries
  • 9.2.Types of sensors that can be printed
  • 9.3.Sensors: Technology Readiness
  • 9.4.Capacitive pressure/force sensor
  • 9.5.Fluid level sensor

10. LOGIC

  • 10.1.Types of Flexible or Printed Transistor Circuits
  • 10.2.Why Print Transistors
  • 10.3.Semiconductor Choices Compared
  • 10.4.But challenges persist...
  • 10.5.Semiconductor choices
  • 10.6.Incumbent TFT technologies- silicon based
  • 10.7.Metal Oxide Semiconductors
  • 10.8.Metal Oxide production process
  • 10.9.But can Metal Oxide Semiconductors be printed?
  • 10.10.Evonik's solution processible metal oxide
  • 10.11.Latest progress with iXensic
  • 10.12.And even at room temperature with deep UV annealing
  • 10.13.Organic semiconductors
  • 10.14.OTFT Mobility hype: reality check
  • 10.15.All printed TFTs
  • 10.16.JAPERA all printed TFT
  • 10.17.S2S automatic printed OTFT
  • 10.18.Roll-to-roll printed organic TFTs
  • 10.19.Merck's Organic TFT
  • 10.20.Carbon nanotubes and graphene transistors
  • 10.21.Latest progress with flexible/printed transistor RFID
  • 10.22.Flexible or printed transistors for logic, creating smart systems
  • 10.23.Mediocre TFTs can do many functions
  • 10.24.Current work in developing flexible transistor RFID and Smart Packaging
  • 10.25.IMEC / Holst Centre Roadmap
  • 10.26.Benefits of flexible logic
  • 10.27.Save on IC attach cost?
  • 10.28.Logic Based Systems
  • 10.29.Lessons from the Silicon Chip: need for modularity
  • 10.30.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
  • 10.31.Printed electronics components
  • 10.32.PragmatIC's wine temperature sensing label
  • 10.33.Logic and Smart System Forecast 2018-2030 $ millions
  • 10.34.Company profiles related to this chapter

11. QR CODES

  • 11.1.QR Codes: Failure in Europe and America, Huge Success in China
  • 11.2.QR Codes: where next?
  • 11.3.Will NFC or RAIN Impact QR Codes?

12. CAPACITIVE / INK STRIPE IDENTIFICATION

  • 12.1.RFID without transistors Hidden Electronic Product Code (HidE)
  • 12.2.Printechnologics printed ID
  • 12.3.Radar ID 60GHz
  • 12.4.Inksure - SARcode Example
  • 12.5.Touchcode: T-ink / Printechnologics
  • 12.6.Touchcode Application Concepts
  • 12.7.Touchcode Progress
  • 12.8.TicTag
  • 12.9.Prismade Labs

13. RFID SENSORS

  • 13.1.RFID Sensors: main choices
  • 13.2.RFID tag sensor from IC-TAG
  • 13.3.Passive UHF RFID sensor co-developed by Powercast and Vanguard ID Systems
  • 13.4.Passive UHF RFID Sensor: RFMicron and Smartrac
  • 13.5.GE/ Kemsense: BioSensors on conventional RFID labels
  • 13.6.Chemical powerless RFID sensor tag
  • 13.7.Lessons from Failures

14. CHEMICAL SMART PACKAGING TECHNOLOGIES

  • 14.1.Food degradation
  • 14.2.Microbial Spoilage
  • 14.3.Chemical and Enzymatic Activity
  • 14.4.Oxidative Deterioration/Rancidity
  • 14.5.Moisture/Vapour Migration
  • 14.6.Determining Shelf Life
  • 14.7.Food Degradation
  • 14.8.Time Temperature Indicators (TTIs)
  • 14.9.Chemical TTIs
  • 14.10.Chemical Time Temperature Indicators
  • 14.11.Examples of Chemical Time Temperature Indicators (TTIs
  • 14.12.Freshness Indicators
  • 14.13.Ripeness Indicators
  • 14.14.Time Indicators

15. SMART PACKAGING APPLICATIONS - CONVENTIONAL RFID

  • 15.1.Pallet/ case tagging
  • 15.2.Retail apparel, item level
  • 15.3.Retail Apparel Payback
  • 15.4.RFID for anti-counterfeiting - it's the law!
  • 15.5.METI, Japan, target 100 billion tags/year by 2025
  • 15.6.IDTechEx view on the METI announcement
  • 15.7.RFID provides more consumer engagement and use data
  • 15.8.Coca-Cola Freestyle Machine
  • 15.9.RFID provides more consumer engagement and use data

16. SMART BLISTER PACKS

  • 16.1.The Problem: Medication Non-Compliance
  • 16.2.The Problem: Medication Non-Compliance - Statistics
  • 16.3.The Current Solution
  • 16.4.The Printed Electronics / RFID Solutions
  • 16.5.Smart Blister Packs
  • 16.6.Smart Blister Packs - Not a Big Success Yet
  • 16.7.Things are Changing & More Players Enter
  • 16.8.Smart Blister Packs: Outlook

17. SMART PACKAGING CASE STUDIES

  • 17.1.Batteries with integral battery tester
  • 17.2.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
  • 17.3.Place mats - McDonalds
  • 17.4.Interactive tablecloth - Hallmark
  • 17.5.Beer package game - VTT Technology
  • 17.6.Cookie heater pack - T-Ink
  • 17.7.Theft detection - Swedish Postal Service and Deutsche Post

18. FORECASTS: ELECTRONIC SMART PACKAGING

  • 18.1.RAIN (UHF RFID) Smart Packaging
  • 18.2.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 18.3.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 18.4.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 18.5.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 18.6.NFC (HF RFID) Smart Packaging
  • 18.7.NFC (HF RFID) tags 2020-2030 - numbers million
  • 18.8.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 18.9.NFC (HF RFID) tags 2020-2030 - market value $M
  • 18.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 18.11.Electronic Smart Packaging beyond RFID
  • 18.12.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 18.13.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 18.14.Challenges and Opportunities

19. APPENDIX: COMPANY PROFILES

20. APPENDIX: GLOSSARY

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