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市场调查报告书

结构用电子产品&电器的智慧材料:2019-2029年

Smart Materials Opportunities in Structural Electronics and Electrics 2020-2030

出版商 IDTechEx Ltd. 商品编码 721790
出版日期 内容资讯 英文 295 Slides
商品交期: 最快1-2个工作天内
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结构用电子产品&电器的智慧材料:2019-2029年 Smart Materials Opportunities in Structural Electronics and Electrics 2020-2030
出版日期: 2019年10月31日内容资讯: 英文 295 Slides
简介

本报告提供结构用电子产品&电器的智慧材料的市场调查,市场定义和概要,结构用电子产品的发展过程与未来展望,智慧材料的功能、形态必要条件,主要的制造技术概要、特征,技术开发趋势,主要产品的简介,企业、研究机关、大学的各种配合措施等资料汇整。

第1章 摘要整理、总论

  • 定义
  • 本报告书的目的
  • 重要性
  • 案例
  • 实行技术
  • 课题
  • 市场规模
  • 新产品、技术发展蓝图

第2章 简介:过程、定义、能力、展望

  • 结构用电子产品的发展的过程

第3章 所需的智慧材料的功能、形态

  • 概要
  • 功能、形态的合理性
  • 功能、形态:目前选项

第4章 制造技术:领导的套模电子产品 (IME)

  • IME是什么?
  • 所谓IME流程
  • IME导电油墨必要条件
  • 材料组合的多样性
  • 功能性材料的幅度的扩大
  • 针对用途、商业化的发展、试制:概要
  • IME功能性材料供应商
  • TactoTek的方法:IME SE的领导者

第5章 其他制造技术:软性印刷、MID、3DPE、喷雾等

  • 对3D表面的直接印刷
    • Optomec Aerosol:市场领导
    • 软性印刷范例:
      • Harvard University
      • University of Illinois at Urbana Champaign
      • Optomec
    • Pulse Electronics
    • GKN、Boeing:787用电热器
    • Nano Dimension (以色列)、Ceradrop (法国)
    • Neotech、Novacentrix、nScrypt
  • 模塑互连元件 (MID):LDS
    • 概要
    • MID、LDS:LPKF, Festo
    • IME的LDS的各种用途
    • MID - LPKF、Molex范例
    • MID - TRW范例
  • 印刷PCB
    • 对使用了Ag奈米粒子墨水的高速PCB试制的进步
    • 印刷PCB:新加入企业
  • 转印:试验带印刷和层压
  • 3D印刷电子产品
    • 概要
    • 丰田
    • Aconity3D
    • Functionalize
    • Harvard University
    • Princeton University
    • Nascent Objects
    • AgIC
    • Voltera
    • Cartesian
    • Botfactory
    • Voxel8
    • 制造选择比较

第6章 大规模SE:汽车、飞机、船舶、建造物、道路

  • 概要
  • 汽车
    • 载重重超级电容器结构体
    • Imperial College London
    • Queensland University of Technology
    • Trinity College Dublin
    • Vanderbilt University
    • ZapGo
  • PV车身
    • 车身用先进薄膜PV
    • Sion Motors
    • IFEVS
    • EIEV
  • 发电轮胎
    • Triboelectric Univ
    • Univ. Bolton
  • 飞机
    • 太阳能飞机范例:Sunstar
    • Sunseeker Duo
    • Solar Impulse
    • SolarShip
    • American Semiconductor:智慧机体、翼
    • Boeing 787 Dreamliner
    • Airbus:3D印刷
    • Nervous system:NASA
    • Morphing wing:FlexFoil、NASA等
  • 船艇、船舶的大面积波浪发电
    • EIEV船
    • 案例:Okeanos Pearl
    • PlanetSolar、SolarLab
    • EIEV调查船等
  • 大楼、建造物
    • 活性智慧玻璃
    • Samsung OLE窗
    • 建筑物一体型PV (BIPV)
    • 太阳能电池瓷砖
    • 太阳能温室
  • 智慧牙桥:案例
  • 智慧负载
    • 智慧负载的潜在技术
    • 目前道路研究计划:压电动能采集
    • 太阳能道路:Missouri Department of Transportation
    • 太阳能道路
    • Bouygues Colas
    • Pavenergy
    • TNO SolaRoad等

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目录

The new IDTechEx report, "Smart Material Opportunities in Structural Electronics 2020-2030" analyses and forecasts a $200 billion opportunity. Making dumb structures smart means saving in weight, space and cost but it also makes new things possible such as huge solar drones up for five years beaming the internet to everyone. The new solar cars never plug in. The Executive Summary and Conclusions says expect better appliances, wearables, vehicles lasting generations. Think one-piece flexible phones with no case, smart fuselages and smart roads. Learn enablers: additive metal and dielectric patterning and new organic, inorganic and composite materials merged. From transparent concrete to stretchable ink patterns, it introduces the e-window performing three functions and the wave blanket as a power station, all facilitated by new materials and processing with huge sales potential. Many infograms pull together market readiness of composites and how improved metal patterning can create electricity and bend light. See separate forecasts for vehicles, building and ground-integrated photovoltaics, for in-mold electronics, flexible AMOLEDs and other SE technologies. Even elements of this are forecasted including embedded RFID, solar cars, building integrated photovoltaics, smart glass. Appraise technology roadmaps for flexible phones as they integrate flexible batteries.

The Introduction reveals the evolution of the needs and practices with phones, wearables, vehicles, structures and more. Which of the 12 energy harvesting technologies lend themselves to being incorporated in the new monolithic smart structures? Tesla sunroof with electric tinting and lighting functions in one glass, human body area networks, energy positive solar boats and self-healing plastics are among the host of examples explained.

Chapter 3 Vehicle Integrated Photovoltaics VIPV introduces such things as energy positive solar cars, autonomous solar flying wings that replace trucks and those upper atmosphere solar drones. Infograms show how many disciplines leverage to deliver many benefits here. Why the importance of single crystal silicon bodywork but potential of GaAs film and thin film, 3 junction InGaP, GaAs, InGaAs. Which companies, why, by when?

Chapter 4 pulls together Smart Roads, Bridges, Buildings emphasising new materials and potential. Here is the largest sector BIPV including solar tiles and windows. What materials and benefits? Scope for heat and piezoelectric harvesting roads? Why did solar roads and environs fail in Germany and France but they look good in the UK, Netherlands, Japan, China and Hungary? What new materials? What next?

Chapter 5 goes deeper with Materials and Manufacturing: Large Structural Electrics. Here is structural battery and supercapacitor technology from graphene and CNT, glass and carbon fiber to vanadium and ruthenium boosting pseudocapacitance. Learn new reinforcement with multifunctional resins. Understand progress of electrically multifunctional fibers, smart glass electrically changing color, tint, display, darkness, photovoltaic action, even greenhouses optimising both electricity creation and plant growth with new dyes. Throughout there are many examples of research progress and deployment.

Chapter 6 Monolithic Flexible Display Materials and Technology examines the materials and processes as glass-free AMOLEDS become a complete flexible phone or other device. No need for a case. What is monolithic now and what gets incorporated later? How do you print flexible quantum dot displays? What seven key components merge into flexible OLEDs?

Chapters 7 addresses in detail the vital new subject of Vehicle and Consumer Goods Simplification: In Mold Electronics with its stretchable inks, dielectric patterning and so on. Chapter 8 covers alternatives and complementary materials and processes such as Conformal Printing, MID, 3D printed electronics using elastomers and metals, optronics and the research on spraying of electrically active new materials. "Smart Material Opportunities in Structural Electronics 2020-2030" analyses and forecasts a formidable new business opportunity.

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Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1.Changing the world
  • 1.2.Purpose of this report
  • 1.3.Primary conclusions
    • 1.3.1.Technological megatrend
    • 1.3.2.Benefits
    • 1.3.3.Challenges
    • 1.3.4.Why now?
    • 1.3.5.Focus
  • 1.4.Evolution
  • 1.5.Most promising SE functions in business potential with examples
  • 1.6.SE opportunity vs progress by business sector
  • 1.7.SE manufacturing and technology readiness by applicational sector and date
  • 1.8.Structural electronics as protective coating or wrap: applications compared
  • 1.9.Structural electronics as load bearing structure: applications compared
  • 1.10.Structural electronics technologies compared
    • 1.10.1.Thickness vs area
    • 1.10.2.In use
    • 1.10.3.Working well in laboratory and trials
    • 1.10.4.Later
  • 1.11.Formats of technology
  • 1.12.Status of multifunctional composites by application
  • 1.13.Much more can be done with metal patterning on appropriate substrates
  • 1.14.Some organisations attempting significant SE advances
  • 1.15.Patent analysis
    • 1.15.1.Structural electronics
    • 1.15.2.Structural solar
  • 1.16.Market forecasts
    • 1.16.1.Overview 2020-2030
    • 1.16.2.Solar energy-independent cars 2019-2030 - Number of vehicles (thousand)
    • 1.16.3.Solar energy-independent cars 2019-2030 - Market Value (US$ billion)
    • 1.16.4.Smart glass market size ($ million) 2019-2030
    • 1.16.5.Building integrated photovoltaics BIPV
    • 1.16.6.RFID sensor tags and systems $ million
  • 1.17.SE product and technology roadmaps 2019-2040
    • 1.17.1.General
    • 1.17.2.Roadmap to flexible displays and phones
    • 1.17.3.Roadmap for solar and supercapacitor cars

2. INTRODUCTION: PHONES, WEARABLES, VEHICLES, STRUCTURES

  • 2.1.Progression to structural electronics
    • 2.1.1.Sequence
    • 2.1.2.Multiple sources
    • 2.1.3.Beginnings: PCBs: multilayer, heat pipe vias, load bearing PCB
    • 2.1.4.True structural electronics: Plastic Electronic, Smart Plastics Network
    • 2.1.5.Hybrid structural-conventional
    • 2.1.6.Hybrid structural conventional: wearables Matrix Powerwatch
    • 2.1.7.Flexible mobile phones
  • 2.2.Emerging structural electronics
    • 2.2.1.Tesla sunroof with electric tinting and integrated lighting
    • 2.2.2.Energy harvesting suitable for SE
  • 2.3.Combining many functions
    • 2.3.1.Overview and healthcare
    • 2.3.2.Triboelectric integrated with other sensing/ harvesting
  • 2.4.Vehicles
    • 2.4.1.Load bearing supercapacitors replace steel bodywork

3. VEHICLE INTEGRATED PHOTOVOLTAICS VIPV

  • 3.1.Basics
    • 3.1.1.Definitions and history
    • 3.1.2.Energy positive vehicles
    • 3.1.3.New user propositions enabled by structural solar
  • 3.2.Importance of solar cars
  • 3.3.Tipping points for sales of solar cars
  • 3.4.Tipping points for sales of solar trucks, buses and trains
  • 3.5.Corporate and geographical positioning
  • 3.6.Chemistry
  • 3.7.Format
  • 3.8.Leading solar cars compared: Sono, Lightyear, Hanergy, Toyota
  • 3.9.Solar buses and trucks
  • 3.10.Energy Independent Electric Vehicles EIEV

4. SMART ROADS, BRIDGES, BUILDINGS

  • 4.1.Overview
  • 4.2.Smart roads and other paving
    • 4.2.1.Overview
    • 4.2.2.Smart road probability of success vs current investment
    • 4.2.3.Piezoelectric motion harvesting US, UK
    • 4.2.4.Realistic solar roads, parking, paths, barriers overview
    • 4.2.5.Solar roads in France and Germany a failure
    • 4.2.6.Mirai Labo Japan
    • 4.2.7.Pavenergy China
    • 4.2.8.Platio Hungary
    • 4.2.9.Solar Roadways USA
    • 4.2.10.Tokyo Government Japan
    • 4.2.11.TNO SolaRoad Netherlands
  • 4.3.Gantry vs road surface: Korea, China
  • 4.4.Solar wind / sound barriers: Eindhoven University of Technology
  • 4.5.Building integrated photovoltaics
    • 4.5.1.Overview
    • 4.5.2.BAPV vs BIPV
    • 4.5.3.BIPV technologies and location

5. MATERIALS AND MANUFACTURING: LARGE STRUCTURAL ELECTRICS

  • 5.1.Overview
  • 5.2.Dream for supercapacitors and their derivatives: other planned benefits
  • 5.3.Structural battery technology
  • 5.4.Structural supercapacitor technology
    • 5.4.1.Imperial College London; Chalmers Sweden
    • 5.4.2.Queensland University of Technology Australia, Rice University USA
    • 5.4.3.Trinity College Dublin Ireland
    • 5.4.4.Vanderbilt University USA
    • 5.4.5.ZapGo UK
  • 5.5.Smart glass technology
    • 5.5.1.Active smart glass in buildings - Market drivers
    • 5.5.2.Active and passive glass darkening materials
  • 5.6.Smart cement technology
    • 5.6.1.Batteries as cement
    • 5.6.2.Battery charging cement Magment (TM)
  • 5.7.Structural photovoltaic materials and future
    • 5.7.1.Choice of operating principles
    • 5.7.2.Comparison of performance and issues
    • 5.7.3.Sharp conversion efficiency 37.9%
    • 5.7.4.Perovskite silicon tandem: record 25.2% efficiency
    • 5.7.5.CIGS PV in action
    • 5.7.6.pcSi PV in action
    • 5.7.7.scSi PV in action
    • 5.7.8.GaAs PV in action
    • 5.7.9.Future structural photovoltaics plus structural supercapacitor
    • 5.7.10.Three in one PV window material
    • 5.7.11.Building integrated photovoltaic thermal (BIPVT)
  • 5.8.Multi-functional PV materials
    • 5.8.1.Optimising crop growth in greenhouses
    • 5.8.2.Desalination and optimising growth
    • 5.8.3.Fiber making and storing electricity
    • 5.8.4.Fiber and film making electricity two ways and storing

6. MONOLITHIC FLEXIBLE DISPLAY MATERIALS AND TECHNOLOGY

  • 6.1.First step: OLED on plastic substrate
  • 6.2.Inkjet printing organic materials for thin film encapsulation of OLEDs
  • 6.3.Printed OLED: key players
  • 6.4.Printing for monolithic flexible displays is near
  • 6.5.Printing flexible quantum dot displays
  • 6.6.Resulting flexible devices 2018-2020
  • 6.7.Key components for flexible OLEDs

7. VEHICLE AND CONSUMER GOODS SIMPLIFICATION: IN MOLD ELECTRONICS

  • 7.1.What is in-mould electronics?
    • 7.1.1.IME products have exceptional environmental tolerance
    • 7.1.2.Aircraft aerofoil flap with integral heater for de-icing using in-mold electronics
    • 7.1.3.IME: 3D friendly process for circuit making
    • 7.1.4.Related processes comparison IMD, IME, MID/LDS
  • 7.2.What is the in-mold electronic process?
    • 7.2.1.Comments on requirements
  • 7.3.Conductive ink requirements for IME
    • 7.3.1.New ink requirements: stretchability
    • 7.3.2.New ink requirements: portfolio approach
  • 7.4.Diversity of material portfolio
    • 7.4.1.New ink requirements: surviving heat stress
    • 7.4.2.New ink requirements: stability
    • 7.4.3.All materials in the stack must be reliable
    • 7.4.4.Design: general observations
  • 7.5.Expanding range of functional materials
    • 7.5.1.Stretchable carbon nanotube transparent conducting films
    • 7.5.2.Beyond IME conductive inks: adhesives
    • 7.5.3.Beyond conductive inks: thermoformed polymeric actuator?
  • 7.6.Overview of applications, commercialization progress, and prototypes
    • 7.6.1.In-mold electronic application: automotive
    • 7.6.2.White goods, medical and industrial control (HMI)
    • 7.6.3.Is IME commercial yet?
    • 7.6.4.First (ALMOST) success story: overhead console in cars
    • 7.6.5.Commercial products: wearable technology
    • 7.6.6.Automotive: direct heating of headlamp plastic covers
    • 7.6.7.Automotive: human machine interfaces
    • 7.6.8.White goods: human machine interfaces
    • 7.6.9.Mobile phone storage
  • 7.7.IME functional material suppliers
    • 7.7.1.Emerging value chain
    • 7.7.2.Stretchable conductive ink suppliers multiply
    • 7.7.3.IME conductive ink suppliers multiply
    • 7.7.4.IME with functional films made with evaporated lines
  • 7.8.Approach of TactoTek: the IME SE leader
    • 7.8.1.TactoTek Profile

8. CONFORMAL PRINTING, MID, 3DPE, SPRAYING

  • 8.1.Printing directly on a 3D surface
    • 8.1.1.Optomec Aerosol: market leader
    • 8.1.2.Conformal printing examples: Harvard University, University of Illinois at Urbana Champaign, Optomec
    • 8.1.3.Pulse Electronics
    • 8.1.4.Spraying leading edge 787 heater GKN, Boeing
    • 8.1.5.Nano Dimension Israel, Ceradrop France
    • 8.1.6.Neotech, Novacentrix, nScrypt
  • 8.2.Molded Interconnect Devices: Laser Direct Structuring
    • 8.2.1.Overview
    • 8.2.2.MID and LDS: LPKF, Festo
    • 8.2.3.Applications of laser direct structuring in IME
    • 8.2.4.MID - LPKF and Molex examples
    • 8.2.5.MID - TRW example
  • 8.3.Genuinely Printed PCB
    • 8.3.1.Progress towards rapid PCB prototyping using Ag nanoparticle inks
    • 8.3.2.Printed PCB: Newcomers
  • 8.4.Transfer printing: printing test strips & using lamination to compete with IME
  • 8.5.3D printed electronics
    • 8.5.1.Overview
    • 8.5.2.Toyota Japan
    • 8.5.3.Aconity3D Germany, USA
    • 8.5.4.Functionalise USA
    • 8.5.5.Harvard University
    • 8.5.6.Princeton University
    • 8.5.7.Nascent Objects
    • 8.5.8.aGic Japan, Voltera Canada
    • 8.5.9.Cartesian USA, Botfactory USA
    • 8.5.10.Voxel8
  • 8.6.Manufacturing options compared
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