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市场调查报告书
商品编码
1021724

导电性粘合剂 2022-2032年:技术、市场和预测

Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts

出版日期: | 出版商: IDTechEx Ltd. | 英文 352 Slides | 商品交期: 最快1-2个工作天内

价格
  • 全貌
  • 简介
  • 目录
简介

标题
导电性粘合剂 2022-2032年:技术、市场和预测
导电胶 (ECA) 的全球需求、市场趋势和市场预测,包括各向同性导电胶 (ICA)、各向异性导电膏 (ACP) 和各向异性导电薄膜 (ACF)。

"到 2032 年,导电胶 (ECA) 市场价值将达到 36.7 亿美元。"

导电粘合剂 (ECA) 将成为一系列新兴行业的关键导电连接技术。它们可用于连接各种用途的组件和电路,提供机械强度和导电性的连接。由于铅基焊料的使用受到限制,因此需要新的替代品来填补市场空白,而IDTechEx 认为导电粘合剂是最有前途的选择之一。

此外,ECA 还具有其他优势,例如电子产品小型化所需的细间距容量和低温连接。铝虽然他们也有缺点,这些优点使出口信贷机构很好地成为占主导地位的连接技术在一些新兴的应用,如靈活的,可打印,以及模内的电子设备。

本报告中回答的关键问题:

  • 什么是 ECA?
  • ECA 市场规模有多大?
  • ECA 的主要优点和缺点是什么?
  • 有哪些不同类型的 ECA,它们有何不同?
    未来对 ECA 的需求将如何变化?
  • ECA 的关键应用领域在哪里?
  • ECA 的竞争对手材料有哪些?
  • 使用 E CA需要考虑哪些关键属性?
  • 它们是 ECA 的主要处理阶段,它们会导致什么问题?

"2022-2032 年导电粘合剂 (ECA)" 包含基于初步访谈和产品分析的ECA 的关键见解和商业前景。这份对全球 ECA 行业的综合评估分析了塑造新兴行业的商业和技术因素。该报告同时考虑了各向同性导电粘合剂 ( ICA) 和各向异性导电粘合剂 (ACA),并从技术和商业角度对其进行了分析。还讨论了基于薄膜的粘合剂,特别是各向异性导电薄膜 (ACF)。

该报告分析了 ECA 的当前和新兴应用,考虑了这些领域的关键驱动因素和要求,包括汽车电子、消费电子、显示应用、印刷电子和 RFID 应用。给出了 10年的市场预测每个应用领域,按应用和使用的粘合剂类型细分。评估主要参与者,包括汉高、Panacol、Dexerials、昭和电工材料等。

导电粘合剂 (ECA):技术注意事项

导电胶由两部分组成:导电填料和结构树脂。填充物在连接处形成导电链接。填料通常是金属基的,最常见的金属是银。树脂为粘合剂提供机械强度并固定填料颗粒。树脂通常基于聚合物,环氧树脂是最常见的选择。在本报告中,IDTechEx 讨论了成熟和新兴的填料和树脂,分析了市售粘合剂,并提供了市售 ECA 的详细分类。还讨论了填料和树脂所需的确切性能,并评估了不同材料的适用性。

还考虑了 ECA 行业技术和创新领域的现状。研究了几种新型 ECA 产品,并突出了市场领先供应商所追求的研发领域。

不同组件连接材料的技术准备水平和导电粘合剂 (ECA) 的多项创新

导电粘合剂 (ECA) 的主要优点

使用 ECA 的一些主要优势是细间距容量、低加工温度和可以实现的高靈活性。这些优势使 ECA 非常适合制造更小的电子产品,并允许在比替代技术(例如无铅焊料和银烧结)更广泛的基板上使用。在这些优势的推动下,IDTechEx 预测ECA市场正在增长,ECA 将在一系列应用中取代过时且表现不佳的竞争对手,包括显示器、消费电子产品和可穿戴技术。

然而,ECA 并不是一项完美的技术。缺点包括与其他连接技术相比成本高,主要是由于材料和加工成本高,以及组件缺乏自对准。这可能使它们不适合某些应用,例如不需要细间距的成本敏感应用,或需要易于维修的应用,例如业余爱好者使用。尽管 IDTechEx 认为 ECA 将在未来十年变得越来越重要,但未来可能没有一种单一的导电连接技术会胜出。

导电粘合剂 (ECA):市场和应用

ECA 用于一系列已建立和新兴的应用程序。成熟应用的市场更有可能以稳定的速度增长,而目前代表相对较小市场的新兴技术可能具有更快增长的潜力。

本报告中考虑的当前和未来应用和市场包括:

  • 汽车电子、
  • 消费电子产品,
  • 显示技术
  • RFID
  • EMI 屏蔽
  • 光伏
  • 航空航天
  • 印刷和柔性电子产品
  • 可穿戴技术
  • 模内电子产品

为每个应用程序提供10 年市场预测、关键规格和 SWOT 分析。

导电粘合剂 (ECA) 用于处于不同开发阶段的一系列应用。它们已经在显示器附件等应用中建立起来,并且预计将在模内电子产品中占据越来越大的主导地位。

来自 IDTechEx 的分析师访问

所有报告购买都包括与专家分析师的长达 30 分钟的电话时间,他将帮助您将报告中的关键发现与您要解决的业务问题联系起来。这需要在购买报告后的三个月内使用。

目录

1. 执行摘要

  • 1.1. 接合材料的种类
  • 1.2. ECA 的好处
  • 1.3. ECA 的缺点
  • 1.4. ECA 的 SWOT 分析
  • 1.5。ECA 制造商的类型
  • 1.6. ECA 的应用
  • 1.7. c ommon材料的选择对出口信贷机构
  • 1.8。ECA 的主要特性
  • 1.9. ICA 和 ACA
  • 1.10. ICA 和 ACA 的未来
  • 1.11. 哪些制造商创造哪些产品?
  • 1.12。使用不同的填充材料
  • 1.13. 不同树脂的用途
  • 1.14. ECA 的创新类型
  • 1.15。应用概览
  • 1.16。多个应用程序采用 ECA
  • 1.17. 路线图:ECA 的新兴应用
  • 1.18. ECA 的专业化
  • 1.19. 按 ECA类型划分的全球 ECA市场预测

2. 简介

  • 2.1. 什么是导电胶?
    • 2.1.1. 接合材料的种类
    • 2.1.2. 导电胶的结构
    • 2.1.3. 互连示意图
    • 2.1.4. ECA 的好处
    • 2.1.5. ECA 的缺点
    • 2.1.6. ECA 的成本
    • 2.1.7。ECA 的 SWOT 分析
  • 2.2. 市场分析
    • 2.2.1. ECA 制造商的类型
    • 2.2.2 . ECA 制造商概述
    • 2.2.3. 主要跨国供应商:总结
    • 2.2.4. 中型供应商:总结
    • 2.2.5. 小型精品供应商:总结
    • 2.2.6. 市场分散
    • 2.2.7. 调查市场领先者:汉高
    • 2.2.8. ECA 的可定制性
    • 2.2.9. 大小供应商差异汇总
  • 2.3. 导电粘合剂 (ECA) 应用概述
    • 2.3.1. ECA 的应用
    • 2.3.2. 各种应用的优缺点总结
    • 2.3.3. 各种应用的优缺点总结
  • 2.4. ECA 的材料和特性概述
    • 2.4.1. 寻找正确的配方 <我>2.4.2。ECA 选择的关键统计数据
    • 2.4.3. ECA 的常用材料选择
    • 2.4.4. ECA 的主要特性
  • 2.5. 导电连接技术概述
    • 2.5.1. 铅基焊料
    • 2.5.2. 波峰焊和回流焊
    • 2.5.3. 需要更换铅基焊料
    • 2.5.4. 替代导电连接技术
    • 2.5.5。导电连接材料的分类
    • 2.5.6。导电胶的原理
    • 2.5.7。ECA 与铅基焊料的典型特性
    • 2.5.8。ECA:利弊
    • 2.5.9。银烧结
    • 2.5.10。银烧结:优点和缺点
    • 2.5.11。瞬态液相烧结
    • 2.5.12。瞬态液相烧结:优点和缺点
    • 2.5.13。无铅焊料
    • 2.5.14。常见的无铅焊接系统
    • 2.5.15。新型焊接系统
    • 2.5.16。NovaCentrix:光子焊接
    • 2.5.17。SAFI-Tech:低温全金属互连与液态金属焊料微胶囊
    • 2.5.18。无铅焊料:优点和缺点
    • 2.5.19。芯片贴装技术的比较
    • 2.5.20。缺乏 "一刀切" 的技术

3. 各向同性和各向异性电导率

  • 3.1.1. ICA 和 ACA
  • 3.1.2. ACA 的优缺点(与 ICA 相比)
  • 3.1.3. ICA 和 ACA 的未来
  • 3.1.4. 按 ECA 类型划分的全球 ECA 市场预测
  • 3.1.5。按ECA类型比例划分的全球ECA预测
  • 3.1.6。薄膜与糊剂
  • 3.1.7。哪些制造商创造哪些产品?
  • 3.2. 各向同性导电粘合剂 (ICA)
    • 3.2.1. 各向同性导电粘合剂
    • 3.2.2. 渗透阈值
    • 3.2.3. 底部填充
    • 3.2.4. 按应用部门划分的全球 ICA 市场预测
  • 3.3. 各向异性导电粘合剂 (ACA)
    • 3.3.1. 各向异性导电粘合剂
    • 3.3.2. ACA 的基础知识 <我>3.3.3。示意图显示了形成各向异性导电接头所需的程序
    • 3.3.4. 按应用部门划分的全球 ACP 市场预测
    • 3.3.5. 按应用部门划分的全球 ACF 市场预测

4. 导电填料

  • 4.1.1. 填充材料概述
  • 4.1.2. 使用不同的填充材料
  • 4.1.3. 公司采用不同填充材料的方法
  • 4.1.4. 填充材料选择
  • 4.2. 导电填料所需的性能
    • 4.2.1. 导电填料所需的固有特性
    • 4.2.2. 填充材料的外在特性
  • 4.3. 填充材料选项
    • 4.3.1. 填充材料选择 - 常规金属
    • 4.3.2. ECA 中的填充材料属性
    • 4.3.3. 白银迁移
    • 4.3.4. 白银和黄金的成本
    • 4.3.5. 填充材料选择 - 金属替代品
  • 4.4. 填充材料形态
    • 4.4.1. 不同填料形态的可用性
    • 4.4.2. 填料形态
    • 4.4.3. 通过粒子形态的各向异性连接
    • 4.4.4. 导电金属涂层
    • 4.4.5. 散装磁芯的类型
    • 4.4.6. 保护性聚合物涂层
    • 4.4.7。聚合物填料和保护涂层

5. 结构树脂

  • 5.1.1. 树脂材料概述
  • 5.1.2. 不同树脂的用途
  • 5.1.3. 公司对不同树脂材料的处理方法
  • 5.1.4. 树脂材料选择
  • 5.2. 树脂材料所需的特性
    • 5.2.1. 高分子链化学基础
    • 5.2.2. 热塑性塑料和热固性塑料
    • 5.2.3. 对于聚合物RES属性中
    • 5.2.4. 填充材料的特性
  • 5.3. 树脂材料选择
    • 5.3.1. 基质材料选择
    • 5.3.2. ECA 中的基质材料属性

6. ECAS 的使用:一个循序渐进的过程

  • 6.1.1. 申请流程概览
  • 6.2. ECA 的应用技术
    • 6.2.1. 应用技术
    • 6.2.2. 点胶
    • 6.2.3. 丝网印刷
    • 6.2.4. 喷墨
  • 6 .3。ECA 的固化
    • 6.3.1. 固化的重要性
    • 6.3.2. 导电连接材料的等级
    • 6.3.3. 热固化
    • 6.3.4. 固化问题
    • 6.3.5. 非热固化(2 组分系统)
    • 6.3.6. 固化中的时间和温度关系
    • 6.3.7。固化时间表和粘合性能
    • 6.3.8。固化过程中的温度曲线
    • 6.3.9。聚合物 TTT 曲线
  • 6.4. ECA 的存储
    • 6.4.1. 保质期、适用期和工作期
    • 6.4.2. ECA 的储存和冷藏
  • 6.5。使用 ECA 进行组件设计和测试
    • 6.5.1. 元件端接设计
    • 6.5.2. ECA 连接的光学检查和测试
    • 6.5.3. ECA 连接的替代检查和测试
    • 6.5.4。接头的返工和修复
    • 6.5.5。更换关节
  • 6.6. ECA的失效方式
    • 6.6.1. ECA 的失效机制
    • 6.6.2. 树脂驱动的失效机制
    • 6.6.3. 非树脂驱动失效机制

7. ECAS 的新兴技术

  • 7.1.1. ECA 的创新类型
  • 7.1.2. 主要跨国供应商:创新与发展
  • 7. 1.3. 中型供应商:创新与发展
  • 7.1.4. 小型精品供应商:创新与发展
  • 7.1.5。不同技术创新总结
  • 7.1.6。准备水平:组件附件材料
  • 7.2. 各向同性导电粘合剂 (ICA) 的新兴技术
    • 7.2.1. ICA 的创新
    • 7.2.2. ICA中的技术总结
    • 7.2.3. ICA电影
    • 7.2.4. 各向同性导电薄膜 (ICF) 的好处
    • 7.2.5. ICF的未来
    • 7.2.6. 半烧结ICA浆料
    • 7.2.7. 金属/玻璃浆
  • 7.3. 各向异性导电薄膜 (ACF) 的新兴技术
    • 7.3.1. ACF 的创新
    • 7.3.2. ACF技术总结
    • 7.3.3. 电对准 ACF (CondAlign)
    • 7.3.4. 条件对齐
    • 7.3.5. 机械对齐的 ACF(Dexerials)
    • 7.3.6. 德士锐
    • 7.3.7。各向异性导电浆料 (ACP) 的新兴技术
    • 7.3 .8。ACP 的创新
    • 7.3.9。ACP 技术总结
    • 7.3.10。磁性排列的 ACA (SunRay Scientific)
    • 7.3.11。新锐科技
    • 7.3.12。诺普

8. ECAS的应用

  • 8.1.1 . ECA 的应用
  • 8.1.2. 应用概览
  • 8.1.3. 多个应用程序采用 ECA
  • 8.1.4. 路线图:ECA 的新兴应用
  • 8.1.5。ECA 的专业化
  • 8.1.6。需要更专业的应用
  • 8.1.7。需要轻微专业化的应用程序
  • 8.1.8。ECA 应用的限制
  • 8.1.9。各种应用的优缺点总结
  • 8.1.10。各种应用的优缺点总结
  • 8.1.11。按应用部门划分的全球 ECA 市场预测
  • 8.1.12。按应用部门划分的全球 ICA 市场预测
  • 8.1.13。按应用部门划分的全球 ACP 市场预测
  • 8.1.14。按应用部门划分的全球 ACF 市场预测
  • 8.2. 消费电子产品
    • 8.2.1. 消费电子应用中的 ECA 摘要
    • 8.2.2. 按 ECA 类型划分的全球 ECA 消费电子市场预测
    • 8.2.3. 按最终产品类型划分的全球 ECA 消费电子市场预测
    • 8.2.4. 按最终产品类型划分的全球 ICA 消费电子市场预测
    • 8.2.5. 按最终产品类型划分的全球 ACA 消费电子市场预测
    • 8.2.6. 消费电子行业
    • 8.2.7。消费电子产品中的电路板附件
    • 8.2.8。水晶设备的安装
    • 8.2.9. 水晶设备支架 - Fujikura Kasei
    • 8.2.10。用于消费电子应用的 ECA 的理想特性
    • 8.2.11。消费电子应用中 ECA 的 SWOT 分析
  • 8.3. 汽车
    • 8.3.1. 汽车电子应用中的 ECA 汇总
    • 8.3.2. 按ECA类型划分的全球ECA汽车电子市场预测
    • 8.3.3. 按发动机类型划分的汽车类型
    • 8.3.4. 全球ECA汽车电子市场按车型预测
    • 8.3.5. 全球 ICA 汽车电子市场按车型预测
    • 8.3.6. 按车型划分的全球 ACA 汽车电子市场预测
    • 8.3.7。汽车电子应用的潜力
    • 8.3.8。在车辆内使用 ECA
    • 8.3.9。ECA 在汽车电路板中的使用
    • 8.3.10。高级汽车传感器中的 ECA
    • 8.3.11。汽车显示应用
    • 8.3.12。用于汽车电子应用的 ECA 的理想特性
    • 8.3.13。ECA在汽车电子应用中的SWOT分析
  • 8.4. 航天
    • 8.4.1. 苏玛在航空电子应用出口信用机构RY
    • 8.4.2. 按 ECA 类型划分的全球 ECA 航空航天电子市场预测
    • 8.4.3. ECA 在航空航天应用中的使用
    • 8.4.4. 航空航天工业中的结构电子学
    • 8.4.5。结构粘合剂 - Luna Innovations
    • 8.4.6. 用于航空航天电子应用的 ECA 的理想特性
    • 8.4.7。ECA在航空电子应用中的SWOT分析
  • 8.5。显示器
      < li>8.5.1。ECA在显示技术应用中的总结
    • 8.5.2. 全球显示应用市场ECA预测
    • 8.5.3. 显示应用的 ECA
    • 8.5.4。显示应用示例
    • 8.5.5。显示互连示意图
    • 8.5.6。不同显示技术的流行
    • 8.5.7。汽车显示应用
    • 8.5.8。用于显示附件的 ACF - Dexerials
    • 8.5.9。一个ECA的所需的性质,在显示了Applica使用蒸发散
    • 8.5.10。显示应用中ECA的SWOT分析
  • 8.6. 电磁屏蔽
    • 8.6.1。EMI 屏蔽应用中的 ECA 摘要
    • 8.6.2. 全球 EMI 屏蔽市场 ECA 预测
    • 8.6.3. EMI屏蔽效应
    • 8.6.4。EMI 屏蔽的 ECA 差异
    • 8.6.5。EMI屏蔽的要求
    • 8.6.6。EMI 屏蔽:粘合剂与密封剂
    • 8.6.7。EMI屏蔽的联合配置
    • 8.6.8。EMI屏蔽的机械要求
    • 8.6.9。EMI 屏蔽的机械要求 - 搭接剪切强度
    • 8.6.10。EMI 屏蔽的机械要求 - 粘合线厚度
    • 8.6.11。EMI 屏蔽的机械要求 - 靈活性
    • 8.6.12。埃尔EMI屏蔽的ectrical要求
    • 8.6.13。用于 EMI 屏蔽应用的 ECA 的理想特性
    • 8.6.14。EMI 屏蔽应用中 ECA 的 SWOT 分析
  • 8.7. 光伏
    • 8.7.1。光伏应用中的ECA 摘要
    • 8.7.2. 全球光伏应用ECA市场预测
    • 8.7.3. ECA 在光伏应用中的潜在用途
    • 8.7.4。开发用于光伏电池的 ECA
    • 8.7.5。叠瓦光伏电池
    • 8.7.6。用于光伏应用的 ECA 的理想特性
    • 8.7.7。光伏电池应用中 ECA 的 SWOT 分析
  • 8.8. 印刷和柔性电子产品
    • 8.8.1。印刷和柔性电子应用中的 ECA 摘要
    • 8.8.2. 按 ECA 类型对印刷和柔性电子市场的全球 ECA 进行预测
    • 8.8.3. ECA 在印刷电子产品中的潜力
    • 8.8.4。印刷/柔性电子产品的低温基板趋势
    • 8.8.5。柔性基板上的导电粘合剂示例
    • 8.8.6。靈活的混合电子元件附件
    • 8.8.7。一个ECA的所需的性质,在靈活,印刷电子应用使用lications
    • 8.8.8。ECA 在柔性和印刷电子应用中的 SWOT 分析
  • 8.9. 可穿戴设备
    • 8.9.1。可穿戴电子应用中的 ECA 摘要
    • 8.9.2. 按ECA类型划分的全球ECA可穿戴电子市场预测
    • 8.9.3. 按最终产品类型划分的全球 ECA 可穿戴电子市场预测
    • 8.9.4。全球 ICA 可穿戴电子市场按最终产品类型预测
    • 8.9.5。全球 ACA 可穿戴电子市场按最终产品类型预测
    • 8.9.6。什么是可穿戴技术?
    • 8.9.7。历史可穿戴技术市场预测
    • 8.9.8。可穿戴应用中的两种 ECA
    • 8.9.9。可穿戴应用中的 ECA 示意图
    • 8.9.10。可穿戴电子产品中的组件/组件 ECA
    • 8.9.11。可穿戴应用中的 ICA 与 ACA
    • 8.9.12。粘合剂研究 - AR
    • 8.9.13。创意材料
    • 8.9.14。迪克泰克
    • 8.9.15。组件/组件附加 E CA 开发
    • 8.9.16。什么是电极/皮肤粘附粘合剂?
    • 8.9.17。为什么需要 E/S 粘合剂?
    • 8.9.18。带有穿戴式电极的产品区域
    • 8.9.19。湿电极和干电极的区别
    • 8.9.20。湿电极与干电极示意图
    • 8.9.21。医用粘合剂技术
    • 8.9.22。水凝胶粘合剂的发展领域
    • 8.9.23。罗曼磁带:关键因素
    • 8.9.24。积水化成 & ST-gel
    • 8.9.25。汉高:心电图安排
    • 8.9.26。CondAlign:电极连接
    • 8.9.27。用于可穿戴应用的 ECA 的理想特性
    • 8.9.28。可穿戴应用中 ECA 的 SWOT 分析
  • 8.10. 射频识别
    • 8.10.1。RFID 应用中的 ECA 摘要
    • 8.10.2. 按 ECA 类型对 RFID 市场的全球 ECA 预测
    • 8.10.3。什么是射频识别?
    • 8.10.4。用于 RFID 的 ECA
    • 8.10.5。用于 RFID 应用的 ECA 的理想特性
    • 8.10.6。RFID应用中ECA的SWOT分析
  • 8.11. 模内电子
    • 8.11.1。模内电子应用中的 ECA 摘要
    • 8.11.2. 按 ECA 类型对模内电子市场的全球 ECA 进行预测
    • 8.11.3. 锅ential的出口信贷机构在模内电子
    • 8.11.4。模内电子工艺概述
    • 8.11.5。模内电子产品的挑战
    • 8.11.6。在 IME 过程中幸存下来
    • 8.11.7。用于模内电子应用的 ECA 的理想特性
    • 8.11.8。用于 IME 应用程序的 ECA 的 SWOT 分析

9. 预测

  • 9.1.1. 按 ECA 类型划分的全球 ECA 市场预测
  • 9.1.2. 按 ECA 类型的比例对全球 ECA 进行预测
  • 9.1 .3. 按应用部门划分的全球 ECA 市场预测
  • 9.1.4. 按应用部门划分的全球 ICA 市场预测
  • 9.1.5。按应用部门划分的全球 ACP 市场预测
  • 9.1.6。按应用部门划分的全球 ACF 市场预测
  • 9.1.7。按 ECA 类型划分的全球ECA 消费电子市场预测
  • 9.1.8。按最终产品类型划分的全球 ECA 消费电子市场预测
  • 9.1.9。按最终产品类型划分的全球 ICA 消费电子市场预测
  • 9.1.10。按最终产品类型划分的全球 ACA 消费电子市场预测
  • 9.1.11。按ECA类型划分的全球ECA汽车电子市场预测
  • 9.1.12。全球ECA汽车电子市场按车型预测
  • 9.1.13。全球 ICA 汽车电子市场按车型预测
  • 9.1.14。按车型划分的全球 ACA 汽车电子市场预测
  • 9.1.15。按 ECA 类型划分的全球 ECA 航空航天电子市场预测
  • 9.1.16。用于显示应用的全球市场ECA重建基金AST
  • 9.1.17。全球 EMI 屏蔽市场 ECA 预测
  • 9.1.18。全球光伏应用ECA市场预测
  • 9.1.19。按 ECA 类型对印刷和柔性电子市场的全球 ECA 进行预测
  • 9.1.20。按 ECA 类型划分的全球 ECA 可穿戴电子产品市场预测
  • 9.1.21。按最终产品类型划分的全球 ECA 可穿戴电子市场预测
  • 9.1.22。全球 ICA 可穿戴电子市场按最终产品类型预测
  • 9.1.23。按最终产品类型划分的全球 ACA 可穿戴电子市场预测
  • 9.1.24。按 ECA 类型对 RFID 市场的全球 ECA 预测
  • 9.1.25。按 ECA 类型对模内电子市场的全球 ECA 进行预测
目录
Product Code: ISBN 9781913899622

Title:
Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts
Global demands, market trends and market forecasts for electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs).

"The electrically conductive adhesives (ECAs) market will be worth $3.67 billion by 2032."

Electrically conductive adhesives (ECAs) are set to become a key conductive joining technology across a range of emerging industries. They may be used to connect components and circuitry across a wide range of uses, giving joins which are mechanically strong and electrically conductive. Due to the restricted use of lead-based solders, new alternatives are needed to fill the gap in the market, and IDTechEx believes electrically conductive adhesives are one of the most promising options.

Additionally, ECAs provide other benefits, such as fine pitch capacity, required for miniaturisation of electronics, and low temperature joining. Although they do have drawbacks, these benefits make ECAs well positioned to become the dominant joining technology in several emerging applications such as flexible, printable, and in-mold electronics.

Key questions answered in this report:

  • What are ECAs?
  • What is the ECA market size?
  • What are the key pros and cons of ECAs?
  • What are the different types of ECAs and how do they differ?
  • How will the demand for ECAs change in the future?
  • Where are the key application areas of ECAs?
  • What are the competitor materials to ECAs?
  • What are the key properties to consider with an ECA?
  • What are they main processing stages of ECAs, and what problems do they cause?

"Electrically Conductive Adhesives (ECAs) 2022-2032" contains key insights and commercial outlooks for ECAs, built upon primary interviews and product analysis. This comprehensive evaluation of the global ECA industry analyses the commercial and technological factors that are set to shape the emerging industry. The report considers both isotropically conductive adhesives (ICAs) and anisotropically conductive adhesives (ACAs), analysing them from both a technical and commercial point of view. Film based adhesives, in particularly anisotropically conductive films (ACFs), are also discussed.

The report analyses both current and emerging applications of ECAs, considering the key drivers and requirements for these areas, including automotive electronics, consumer electronics, display applications, printed electronics, and RFID applications.10-year market forecasts are given for each application area, broken down both by application, and by the type of adhesives used. Key players are evaluated, including Henkel, Panacol, Dexerials, Showa Denko Materials, and others.

Electrically Conductive Adhesives (ECAs): Technology Considerations

Electrically conductive adhesives are made of two components: the conductive filler, and the structural resin. The filler creates the conductive link across a join. Fillers are typically metal based, with the most common metal being silver. The resin provides mechanical strength to the adhesives and holds the filler particles in place. Resins are generally polymer based, with epoxy being the most common option. In this report, IDTechEx discusses established and emerging fillers and resins, analysing commercially available adhesives, and providing a detailed breakdown of commercially available ECAs. The exact properties desired from both the filler and the resin are also discussed, and different materials are evaluated for suitability.

The current state of the ECA industry technology and areas of innovation are also considered. Several novel ECA products are investigated, and areas of R&D pursued by market leading suppliers are highlighted.

Technology readiness levels for different component attachment materials and several innovations in Electrically Conductive Adhesives (ECAs)

Key benefits of Electrically Conductive Adhesives (ECAs)

Some key benefits of using an ECA are the fine pitch capacity, the low processing temperature, and the high flexibilities which can be achieved. These benefits make ECAs well suited to making smaller electronics and allow for use on a wider variety of substrates than alternative technologies, such as lead-free solders and silver sintering. Driven by these benefits, IDTechEx forecasts that the market for ECAs is growing, with ECAs set to replace outdated and poor performing competitors across a range of applications, including displays, consumer electronics and wearable technology.

ECAs are not a perfect technology, however. Drawbacks include high costs compared with other joining technologies, primarily due to high materials and processing costs, as well as a lack of self-alignment for components. This can make them unsuitable for certain applications, such as cost-sensitive applications where fine pitch is not required, or applications where ease of repair is desirable, such as hobbyist use. It is likely that no single conductive joining technology will win out in future, although IDTechEx believes that ECAs will become increasingly important over the next decade.

Electrically Conductive Adhesives (ECAs): Markets and Applications

ECAs are used across a range of established and emerging applications. Markets for established applications are more likely to grow at a steady rate, whereas emerging technologies that currently represent a comparatively small market may have the potential for much more rapid growth.

Current and future applications and markets considered in this report include:

  • Automotive electronics,
  • Consumer electronics,
  • Displays technologies
  • RFID
  • EMI shielding
  • Photovoltaics
  • Aerospace
  • Printed and flexible electronics
  • Wearable technologies
  • In-mold electronics

With 10-year market forecasts, key specifications, and SWOT analyses, provided for each application.

Electrically Conductive Adhesives (ECAs) are used across a range of applications at different stages of development. They are already established in applications such as display attachment, and are forecast to become increasingly dominant in In-mold electronics.

Analyst access from IDTechEx

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TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. Types of Joining Materials
  • 1.2. Benefits of ECAs
  • 1.3. Drawbacks of ECAs
  • 1.4. SWOT analysis of ECAs
  • 1.5. Types of ECA manufacturers
  • 1.6. Applications of ECAs
  • 1.7. Common Materials choices for ECAs
  • 1.8. Key properties of ECAs
  • 1.9. ICAs and ACAs
  • 1.10. The future of ICAs and ACAs
  • 1.11. Which manufacturers create which products?
  • 1.12. Usage of different filler materials
  • 1.13. Usage of different Resins
  • 1.14. Types of Innovation in ECAs
  • 1.15. Overview of applications
  • 1.16. ECA Adoption for Multiple Applications
  • 1.17. Roadmap: Emerging applications for ECAs
  • 1.18. Specialisation of ECAs
  • 1.19. Global ECA market forecast by type of ECA

2. INTRODUCTION

  • 2.1. What are Electrically Conductive Adhesives?
    • 2.1.1. Types of Joining Materials
    • 2.1.2. Structure of Electrically Conductive Adhesives
    • 2.1.3. Schematic of Interconnects
    • 2.1.4. Benefits of ECAs
    • 2.1.5. Drawbacks of ECAs
    • 2.1.6. The cost of ECAs
    • 2.1.7. SWOT analysis of ECAs
  • 2.2. Market Analysis
    • 2.2.1. Types of ECA manufacturers
    • 2.2.2. ECA manufacturer overview
    • 2.2.3. Major Multinational Suppliers: Summary
    • 2.2.4. Mid-Sized Suppliers: Summary
    • 2.2.5. Small Boutique Suppliers: Summary
    • 2.2.6. Market fragmentation
    • 2.2.7. Investigating the market leader: Henkel
    • 2.2.8. Customisablity of ECAs
    • 2.2.9. Summary of differences between large and small suppliers
  • 2.3. An overview of applications of Electrically Conductive Adhesives (ECAs)
    • 2.3.1. Applications of ECAs
    • 2.3.2. Summary of Pros and Cons for Various Applications
    • 2.3.3. Summary of Pros and Cons for Various Applications
  • 2.4. Overview of materials and properties of ECAs
    • 2.4.1. Finding the Correct Formulation
    • 2.4.2. Key Statistics for ECA choice
    • 2.4.3. Common Materials choices for ECAs
    • 2.4.4. Key properties of ECAs
  • 2.5. An overview of conductive joining technologies
    • 2.5.1. Lead based solder
    • 2.5.2. Wave and Reflow soldering
    • 2.5.3. The need to replace lead based solders
    • 2.5.4. Alternate conductive joining technologies
    • 2.5.5. Taxonomy of conductive joining materials
    • 2.5.6. Principles of Electrically Conductive Adhesives
    • 2.5.7. Typical properties of ECAs versus lead based solders
    • 2.5.8. ECAs: pros and cons
    • 2.5.9. Silver Sintering
    • 2.5.10. Silver Sintering: pros and cons
    • 2.5.11. Transient Liquid Phase Sintering
    • 2.5.12. Transient Liquid Phase Sintering: pros and cons
    • 2.5.13. Non-lead based solders
    • 2.5.14. Common lead free solder systems
    • 2.5.15. Novel soldering systems
    • 2.5.16. NovaCentrix: Photonic soldering
    • 2.5.17. SAFI-Tech: Low temperature full metal interconnects with liquid metal solder microcapsules
    • 2.5.18. Non-lead based solders: pros and cons
    • 2.5.19. Comparison of die attach techniques
    • 2.5.20. The lack of a "one-size fits all" technique

3. ISOTROPIC AND ANISOTROPIC CONDUCTIVITY

  • 3.1.1. ICAs and ACAs
  • 3.1.2. Pros and Cons of ACAs (compared to ICAs)
  • 3.1.3. The future of ICAs and ACAs
  • 3.1.4. Global ECA market forecast by type of ECA
  • 3.1.5. Global ECA forecast by proportion of ECA type
  • 3.1.6. Films vs pastes
  • 3.1.7. Which manufacturers create which products?
  • 3.2. Isotropically conductive adhesives (ICAs)
    • 3.2.1. Isotropically conductive adhesives
    • 3.2.2. Percolation threshold
    • 3.2.3. Underfill
    • 3.2.4. Global ICA market forecast by Application sector
  • 3.3. Anisotropically conductive adhesives (ACAs)
    • 3.3.1. Anisotropically conductive adhesives
    • 3.3.2. Fundamentals of ACAs
    • 3.3.3. Schematic showing the procedure required to form an anisotropically conductive joint
    • 3.3.4. Global ACP market forecast by Application sector
    • 3.3.5. Global ACF market forecast by Application sector

4. THE CONDUCTIVE FILLER

  • 4.1.1. Filler materials overview
  • 4.1.2. Usage of different filler materials
  • 4.1.3. Company approaches to different filler materials
  • 4.1.4. Filler materials selection
  • 4.2. Properties required of the conductive filler
    • 4.2.1. Intrinsic properties required of the conductive filler
    • 4.2.2. Extrinsic properties of the filler materials
  • 4.3. Filler material options
    • 4.3.1. Filler Materials Choices - Conventional Metals
    • 4.3.2. Filler Materials properties in ECAs
    • 4.3.3. Silver migration
    • 4.3.4. Costs of Silver and Gold
    • 4.3.5. Filler materials choices - Metal Alternatives
  • 4.4. Filler material morphology
    • 4.4.1. Availability of different filler morphologies
    • 4.4.2. Filler materials morphology
    • 4.4.3. Anisotropic connections via particle morphology
    • 4.4.4. Conductive metal coatings
    • 4.4.5. Types of bulk core
    • 4.4.6. Protective polymer coatings
    • 4.4.7. Polymer filler and protective coat

5. THE STRUCTURAL RESIN

  • 5.1.1. Resin Materials Overview
  • 5.1.2. Usage of different Resins
  • 5.1.3. Company approaches to different resin materials
  • 5.1.4. Resin materials selection
  • 5.2. Properties required of the resin material
    • 5.2.1. Fundamentals of polymer chain chemistry
    • 5.2.2. Thermoplastics and thermosets
    • 5.2.3. Properties for the Polymer Resin
    • 5.2.4. Properties of the filler materials
  • 5.3. Resin material options
    • 5.3.1. Matrix Materials Choices
    • 5.3.2. Matrix Materials properties in ECAs

6. UTILISATION OF ECAS: A STEP BY STEP PROCESS

  • 6.1.1. Overview of the application process
  • 6.2. Application techniques for ECAs
    • 6.2.1. Application techniques
    • 6.2.2. Dispensing
    • 6.2.3. Screen Printing
    • 6.2.4. Inkjetting
  • 6.3. Curing of ECAs
    • 6.3.1. The Importance of Curing
    • 6.3.2. Hierarchy of conductive joining materials
    • 6.3.3. Thermal Cure
    • 6.3.4. Issues with curing
    • 6.3.5. Non-thermal curing (2 component systems)
    • 6.3.6. Time and Temperature relations in curing
    • 6.3.7. Cure Schedule and Adhesive Properties
    • 6.3.8. Temperature profiles during curing
    • 6.3.9. Polymer TTT curve
  • 6.4. Storage of ECAs
    • 6.4.1. Shelf life, Pot Life and Work Life
    • 6.4.2. Storage and refrigeration of ECAs
  • 6.5. Component design and testing with ECAs
    • 6.5.1. Component termination design
    • 6.5.2. Optical inspection and testing of ECA connections
    • 6.5.3. Alternate inspection and testing of ECA connections
    • 6.5.4. Rework and repair of joints
    • 6.5.5. Replacement of joints
  • 6.6. Failure Methods of ECAs
    • 6.6.1. Failure mechanisms of ECAs
    • 6.6.2. Resin Driven Failure Mechanisms
    • 6.6.3. Non - Resin Driven Failure Mechanisms

7. EMERGING TECHNOLOGIES IN ECAS

  • 7.1.1. Types of Innovation in ECAs
  • 7.1.2. Major Multinational Suppliers: Innovation and Development
  • 7.1.3. Mid-Sized Suppliers: Innovation and Development
  • 7.1.4. Smaller Boutique Suppliers: Innovation and Development
  • 7.1.5. Summary of Different Technical Innovations
  • 7.1.6. Readiness level: Component attachment materials
  • 7.2. Emerging Technologies in Isotropically Conductive Adhesives (ICAs)
    • 7.2.1. Innovations in ICAs
    • 7.2.2. Summary of Technologies in ICA
    • 7.2.3. ICA films
    • 7.2.4. The benefits of Isotropic Conductive Films (ICF)
    • 7.2.5. The future of ICF
    • 7.2.6. Semi-Sintering ICA pastes
    • 7.2.7. Metal / Glass pastes
  • 7.3. Emerging Technologies in Anisotropically Conductive Films (ACFs)
    • 7.3.1. Innovations in ACFs
    • 7.3.2. Summary of Technologies in ACF
    • 7.3.3. Electrically aligned ACF (CondAlign)
    • 7.3.4. CondAlign
    • 7.3.5. Mechanically aligned ACF (Dexerials)
    • 7.3.6. Dexerials
    • 7.3.7. Emerging Technologies in Anisotropically Conductive Pastes (ACPs)
    • 7.3.8. Innovations in ACPs
    • 7.3.9. Summary of Technologies in ACP
    • 7.3.10. Magnetically aligned ACA (SunRay Scientific)
    • 7.3.11. SunRay Scientific
    • 7.3.12. Nopion

8. APPLICATIONS OF ECAS

  • 8.1.1. Applications of ECAs
  • 8.1.2. Overview of applications
  • 8.1.3. ECA Adoption for Multiple Applications
  • 8.1.4. Roadmap: Emerging applications for ECAs
  • 8.1.5. Specialisation of ECAs
  • 8.1.6. Applications which require greater specialisation
  • 8.1.7. Applications which require slight specialisation
  • 8.1.8. The limits of ECA applications
  • 8.1.9. Summary of Pros and Cons for Various Applications
  • 8.1.10. Summary of Pros and Cons for Various Applications
  • 8.1.11. Global ECA market forecast by Application sector
  • 8.1.12. Global ICA market forecast by Application sector
  • 8.1.13. Global ACP market forecast by Application sector
  • 8.1.14. Global ACF market forecast by Application sector
  • 8.2. Consumer electronics
    • 8.2.1. A summary of ECAs in consumer electronics applications
    • 8.2.2. Global ECA consumer electronics market forecast by type of ECA
    • 8.2.3. Global ECA consumer electronics market forecast by final product type
    • 8.2.4. Global ICA consumer electronics market forecast by final product type
    • 8.2.5. Global ACA consumer electronics market forecast by final product type
    • 8.2.6. The Consumer Electronics Industry
    • 8.2.7. Circuit board attachment in Consumer Electronics
    • 8.2.8. Mounting of Crystal devices
    • 8.2.9. Crystal Device Mounts - Fujikura Kasei
    • 8.2.10. Desirable Properties of an ECA for use in Consumer Electronics Applications
    • 8.2.11. SWOT analysis of ECA in Consumer electronics applications
  • 8.3. Automotive
    • 8.3.1. A summary of ECAs in automotive electronics applications
    • 8.3.2. Global ECA automotive electronics market forecast by type of ECA
    • 8.3.3. Types of automotive vehicle by engine type
    • 8.3.4. Global ECA automotive electronics market forecast by vehicle type
    • 8.3.5. Global ICA automotive electronics market forecast by vehicle type
    • 8.3.6. Global ACA automotive electronics market forecast by vehicle type
    • 8.3.7. The potential of Automotive Electronics Applications
    • 8.3.8. Uses of ECAs within a vehicle
    • 8.3.9. Use of ECAs in automotive circuit boards
    • 8.3.10. ECAs in Advanced automotive sensors
    • 8.3.11. Automotive display applications
    • 8.3.12. Desirable Properties of an ECA for use in Automotive Electronics Applications
    • 8.3.13. SWOT analysis of ECA in automotive electronics applications
  • 8.4. Aerospace
    • 8.4.1. A summary of ECAs in aerospace electronics applications
    • 8.4.2. Global ECA aerospace electronics market forecast by type of ECA
    • 8.4.3. The use of ECAs in Aerospace applications
    • 8.4.4. Structural Electronics in the aerospace industry
    • 8.4.5. Structural Adhesives - Luna Innovations
    • 8.4.6. Desirable Properties of an ECA for use in Aerospace Electronics Applications
    • 8.4.7. SWOT analysis of ECA in aerospace electronics applications
  • 8.5. Displays
    • 8.5.1. A summary of ECAs in display technology applications
    • 8.5.2. Global ECA for display applications market forecast
    • 8.5.3. ECAs for Display Applications
    • 8.5.4. Examples of display applications
    • 8.5.5. A schematic of display interconnections
    • 8.5.6. Prevalence of different display technologies
    • 8.5.7. Automotive display applications
    • 8.5.8. ACFs for Display attachment - Dexerials
    • 8.5.9. Desirable Properties of an ECA for use in Display Applications
    • 8.5.10. SWOT analysis of ECA in display applications
  • 8.6. EMI Shielding
    • 8.6.1. A summary of ECAs in EMI shielding applications
    • 8.6.2. Global ECA for EMI shielding market forecast
    • 8.6.3. EMI shielding effects
    • 8.6.4. ECA differences for EMI Shielding
    • 8.6.5. The demands of EMI shielding
    • 8.6.6. EMI Shielding: Adhesives vs Sealants
    • 8.6.7. Joint Configurations of EMI shielding
    • 8.6.8. Mechanical Requirements of EMI Shielding
    • 8.6.9. Mechanical Requirements of EMI Shielding - Lap Shear Strength
    • 8.6.10. Mechanical Requirements of EMI Shielding - Bond Line Thickness
    • 8.6.11. Mechanical Requirements of EMI Shielding - Flexibility
    • 8.6.12. Electrical Requirements of EMI Shielding
    • 8.6.13. Desirable Properties of an ECA for use in EMI Shielding Applications
    • 8.6.14. SWOT analysis of ECA in EMI Shielding applications
  • 8.7. Photovoltaics
    • 8.7.1. A summary of ECAs in Photovoltaic applications
    • 8.7.2. Global ECA for photovoltaic applications market forecast
    • 8.7.3. The potential use of ECAs in photovoltaic applications
    • 8.7.4. Development of ECAs for PV cells
    • 8.7.5. Shingled PV cells
    • 8.7.6. Desirable Properties of an ECA for use in Photovoltaic Applications
    • 8.7.7. SWOT analysis of ECAs in PV cell applications
  • 8.8. Printed and Flexible Electronics
    • 8.8.1. A summary of ECAs in printed and flexible electronics applications
    • 8.8.2. Global ECA for printed and flexible electronics market forecast by type of ECA
    • 8.8.3. The potential for ECAs in Printed Electronics
    • 8.8.4. Trend towards low temperature substrates for printed/flexible electronics
    • 8.8.5. Example of conductive adhesives on flexible substrates
    • 8.8.6. Component attachment for flexible hybrid electronics
    • 8.8.7. Desirable Properties of an ECA for use in Flexible and Printed Electronics Applications
    • 8.8.8. SWOT analysis of ECA in flexible and printed electronics applications
  • 8.9. Wearables
    • 8.9.1. A summary of ECAs in wearable electronics applications
    • 8.9.2. Global ECA wearable electronics market forecast by type of ECA
    • 8.9.3. Global ECA wearable electronics market forecast by final product type
    • 8.9.4. Global ICA wearable electronics market forecast by final product type
    • 8.9.5. Global ACA wearable electronics market forecast by final product type
    • 8.9.6. What are Wearable Technologies?
    • 8.9.7. Historic Wearable Technology Market Forecast
    • 8.9.8. The two types of ECAs in wearable applications
    • 8.9.9. Schematics of ECAs in wearable applications
    • 8.9.10. Component/Component ECAs in wearable electronics
    • 8.9.11. ICA vs ACA in wearable applications
    • 8.9.12. Adhesives Research - AR
    • 8.9.13. Creative Materials
    • 8.9.14. Dycotec
    • 8.9.15. Component/Component attach ECAs development
    • 8.9.16. What are electrode/skin attach adhesives?
    • 8.9.17. Why are E/S adhesives needed?
    • 8.9.18. Product areas with body-worn electrodes
    • 8.9.19. Differences between wet and dry electrodes
    • 8.9.20. Wet vs dry electrodes schematic
    • 8.9.21. Medical Adhesive Technologies
    • 8.9.22. Development areas for hydrogel adhesives
    • 8.9.23. Lohmann Tapes: Key Factors
    • 8.9.24. Sekisui Kasei & ST-gel
    • 8.9.25. Henkel: ECG arrangements
    • 8.9.26. CondAlign: Electrode Attachment
    • 8.9.27. Desirable Properties of an ECA for use in Wearable Applications
    • 8.9.28. SWOT analysis of ECA in Wearable Applications
  • 8.10. RFID
    • 8.10.1. A summary of ECAs in RFID applications
    • 8.10.2. Global ECA for RFID market forecast by type of ECA
    • 8.10.3. What is RFID?
    • 8.10.4. ECAs for use in RFID
    • 8.10.5. Desirable Properties of an ECA for use in RFID Applications
    • 8.10.6. SWOT analysis of ECA in RFID applications
  • 8.11. In-mold Electronics
    • 8.11.1. A summary of ECAs in In-mold electronics applications
    • 8.11.2. Global ECA for In-mold electronics market forecast by type of ECA
    • 8.11.3. The potential for ECAs in In-mold Electronics
    • 8.11.4. A summary of the In-mold electronics process
    • 8.11.5. Challenges of In-mold Electronics
    • 8.11.6. Surviving the IME process
    • 8.11.7. Desirable Properties of an ECA for use in In-mold Electronics Applications
    • 8.11.8. SWOT analysis of ECA for IME applications

9. FORECASTS

  • 9.1.1. Global ECA market forecast by type of ECA
  • 9.1.2. Global ECA forecast by proportional of ECA type
  • 9.1.3. Global ECA market forecast by Application sector
  • 9.1.4. Global ICA market forecast by Application sector
  • 9.1.5. Global ACP market forecast by Application sector
  • 9.1.6. Global ACF market forecast by Application sector
  • 9.1.7. Global ECA consumer electronics market forecast by type of ECA
  • 9.1.8. Global ECA consumer electronics market forecast by final product type
  • 9.1.9. Global ICA consumer electronics market forecast by final product type
  • 9.1.10. Global ACA consumer electronics market forecast by final product type
  • 9.1.11. Global ECA automotive electronics market forecast by type of ECA
  • 9.1.12. Global ECA automotive electronics market forecast by vehicle type
  • 9.1.13. Global ICA automotive electronics market forecast by vehicle type
  • 9.1.14. Global ACA automotive electronics market forecast by vehicle type
  • 9.1.15. Global ECA aerospace electronics market forecast by type of ECA
  • 9.1.16. Global ECA for display applications market forecast
  • 9.1.17. Global ECA for EMI shielding market forecast
  • 9.1.18. Global ECA for photovoltaic applications market forecast
  • 9.1.19. Global ECA for printed and flexible electronics market forecast by type of ECA
  • 9.1.20. Global ECA wearable electronics market forecast by type of ECA
  • 9.1.21. Global ECA wearable electronics market forecast by final product type
  • 9.1.22. Global ICA wearable electronics market forecast by final product type
  • 9.1.23. Global ACA wearable electronics market forecast by final product type
  • 9.1.24. Global ECA for RFID market forecast by type of ECA
  • 9.1.25. Global ECA for In-mold electronics market forecast by type of ECA