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市场调查报告书

美国的半导体部门的资本投资:2015-2019年

Semiconductor Capital Spending Market in the US 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品编码 350016
出版日期 内容信息 英文 64 Pages
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美国的半导体部门的资本投资:2015-2019年 Semiconductor Capital Spending Market in the US 2015-2019
出版日期: 2016年01月06日 内容信息: 英文 64 Pages
简介

于 美国的半导体供应商的资本投资额在预测期间内,预计以近9%的年复合成长率扩大。该成长由各种要素所带来,尤其是内存及晶圆代工厂相关的投资扩大为显著的要素,这些资产的投资额总计占整体3分之2的占有率。

本报告提供美国的半导体供应商的资本投资趋势的相关调查、市场定义、主要供应商的提供产品、市场整体及各设备/资产种类的市场规模 (CAPEX) 的变化与预测、主要市场趋势、市场的各种影响因素分析、竞争环境、主要供应商简介等汇整数据。

第1章 摘要整理

  • 焦点

第2章 调查范围

  • 市场概要
  • 主要供应商产品

第3章 市场调查手法

  • 调查手法
  • 经济指标

第4章 简介

  • 主要市场焦点

第5章 市场形势

  • 市场概要
  • 市场规模、预测
  • 波特的五力分析

第6章 市场分析:各类型

  • 晶圆构造设备
  • 晶粒层级包装&集合设备
  • 自动实验设备
  • 晶圆级构装&集合设备

第7章 推动市场要素

第8章 推动因素的影响

第9章 市场课题

第10章 推动因素与课题的影响

第11章 市场趋势

第12章 业者情势

  • 竞争模式
  • 主要供应商
  • 其他的有力供应商

第13章 主要供应商分析

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

第14章 对供应商、投资者的建议

第15章 附录

第16章 关于Technavio

图表

目录
Product Code: IRTNTR7795

Market outlook of the semiconductor capital spending market in the US

Semiconductors are the basic component for any electronic component. Semiconductor technology is continuously growing with emergence of advanced technology. Since the last decade, the most prominent segment in global semiconductor industry has been memory, logic, MPU and analog, which made up almost 75% of the total semiconductor demand. Technavio predicts the semiconductor capital spending market in the US to multiply rapidly with a CAGR of close to 9% during the forecast period.

The semiconductor capital spending market in the US is driven by numerous drivers, of which, the most prominent among of all is the accelerated capex in memory and foundry segments. Collectively, memory and foundry represent close to two-third of the total semiconductor capital spending market. With such accelerated capital investments on a global scale, the outcome will have a considerable impact on the semiconductor industry worldwide.

Segmentation of the semiconductor capital spending market in the US by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment
  • Others

Wafer fab equipment segment constitutes the largest share of the overall market, accounting for a market share of more than 48% in 2014. Wafer fab equipment is mainly used during the first half of semiconductor's manufacturing process that makes memory cells and transistors. It covers various patterning, deposition and cleaning process, till wafer passivation.

Competitive landscape and key vendors

The competition in the semiconductor capital spending market in the US is rigid. And the main reason for such intense completion is the evolution of technology. With the pace of technological advancements in the US market, vendors are involved in substantial capital spending, hence, the market comprises of players with strong technological proficiency.

Key vendors in this market are -

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

Other prominent vendors included in this report are AMD, Analog Devices, Broadcom, Freescale, Semiconductor, Marvell Technologies, Qualcomm, and Texas Instruments.

Growth drivers, challenges, and upcoming trends:

Technavio also highlights various trends affecting the semiconductor capital spending market in the US, and one such trend is the rise in China's semiconductor industry. Even though, there are a large number of local semiconductor components manufacturers in China, more than 80% of the semiconductor requirements in China is fulfilled by US semiconductor companies, such as Intel and Global Foundries.

This report provides a number of factors contributing to the adoption, limitations, and opportunities of the semiconductor capital spending market in the US. It also offers an analysis of each factor and an estimation of the extent to which the factors are likely to impact the overall market growth.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2019?
  • What are the key factors driving the semiconductor capital spending market in the US?
  • What are the key market trends impacting the growth of the semiconductor capital spending market in the US?
  • What are the challenges to market growth?
  • Who are the key vendors in the semiconductor capital spending market in the US?
  • What are the market opportunities and threats faced by the vendors in the semiconductor capital spending market in the US?
  • What are the key outcomes of the five forces analysis of the semiconductor capital spending market in the US?

Technavio also offers customization on reports based on specific client requirement.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Product offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment

PART 07: Market Drivers

PART 08: Market drivers and their impacts

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 13: Key vendor analysis

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

PART 14: Key recommendations for vendors/investors

PART 15: Appendix

  • List of abbreviation

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: Semiconductor capital spending market in the US
  • Exhibit 02: Semiconductor capital spending market in the US ($ billions)
  • Exhibit 03: Five forces analysis
  • Exhibit 04: Semiconductor capital spending market in the US by type 2014-2019 (% share)
  • Exhibit 05: Capital spending in wafer fab equipment market($ billions)
  • Exhibit 06: Capital spending in die-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 07: Capital spending in automated test equipment market 2014-2019 ($ billions)
  • Exhibit 08: Capital spending in wafer-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 09: Impact of drivers
  • Exhibit 10: Impact of drivers and challenges
  • Exhibit 11: Global Foundries: Service offerings
  • Exhibit 12: Intel: Business segmentation 2014 by revenue
  • Exhibit 13: Intel: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 14: Micron: Business segmentation 2014: By revenue
  • Exhibit 15: Micron: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 16: Micron: Geographical segmentation by revenue 2014
  • Exhibit 17: Samsung Electronics: Business segmentation 2013
  • Exhibit 18: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 19: Samsung Electronics: Geographical segmentation by revenue 2014
  • Exhibit 20: SK Hynix: Product segmentation 2014
  • Exhibit 21: SK Hynix: Product segmentation revenue by 2014 ($ billions)
  • Exhibit 22: SK Hynix: Geographical segmentation by revenue 2014
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