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市场调查报告书

全球可程式规划逻辑元件(PLD)市场

Global Programmable Logic Devices (PLD) Market 2019-2023

出版商 TechNavio (Infiniti Research Ltd.) 商品编码 237254
出版日期 内容资讯 英文 135 Pages
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全球可程式规划逻辑元件(PLD)市场 Global Programmable Logic Devices (PLD) Market 2019-2023
出版日期: 2019年01月25日内容资讯: 英文 135 Pages
简介

全球可程式规划逻辑元件(PLD)市场是从2013年到2018年以14.8%的CAGR成长。

本报告提供全球可程式规划逻辑元件(PLD)市场现状与今后的预测分析、各地区、各国的趋势、主要供应商的资讯等。

第1章 摘要整理

第2章 简称清单

第3章 调查范围

  • 市场概要
  • 主要的产品

第4章 市场调查手法

  • 市场调查流程
  • 调查手法

第5章 简介

第6章 市场形势

  • 产业概要
  • 技术形势
  • 市场规模与预测
  • 波特的五力分析

第7章 地区区分

  • 全球PLD市场:各区域区隔
  • APAC(亚太地区)的PLD市场
    • 市场规模与预测
  • EMEA(欧洲、中东、非洲)的PLD市场
  • 南北美洲的PLD市场

第8章 主要国家

  • 中国
  • 美国
  • 日本

第9章 购买标准

  • 家电部门
  • 汽车部门
  • 资料运算部门
  • 产业部门
  • 电讯部门
  • 其他部门

第10章 市场成长的促进要素

第11章 促进成长要素与其影响

第12章 市场课题

第13章 促进成长要素与课题的影响

第14章 市场趋势

第15章 趋势与其影响

第16章 业者情势

第17章 主要供应商分析

第18章 市场摘要

第19章 相关报告

图表清单

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目录
Product Code: IRTNTR30760

About this market

The global PLD market is growing due to the increasing deployment of base stations for telecommunication networks. The demand for base stations is increasing with the need for high-speed network connectivity technologies such as 4G-LTE and 5G. The increasing number of base stations will lead to the rise in the deployment of mobile communication equipment. Telecommunication equipment is manufactured using various electronic devices and components such as microcontrollers and microchips. These components are designed to deliver high performance for variable telecommunication and data loads. Thus, telecommunication equipment is designed based on PLDs. These devices provide the flexibility of high load performance, low power consumption, and variable logical programming to suit the application needs, which is increasing their demand PLDsin base stations. Hence, numerous telecommunication networks will adopt PLDs. Technavio's analysts have predicted that the programmable logic devices (PLD) market will register a CAGR of close to 9% by 2023.

Market Overview

Rising demand for consumer electronics

The demand for PLDs is increasing with the integration of Al in consumer electronic devices.

The implementation of automation technologies by households and industrial enterprises is driving the adoption of loT devices. The incorporation of new technologies at competitive prices has led to an increase in data processing requirements of consumer electronic devices. Thus, the increase in adoption of loT in consumer electronics devices will drive the demand for PLDs. which will lead to the growth of the global PLD market during the forecast period.

Increasing focus on node size reduction

Numerous foundries are focusing on enhancing their production capabilities for smaller node size electronic devices. The focus on the reduction of node sizes for PLDs will intensify the complexity of the devices, as the number of associated subsystems will increase. Also, cost-effective manufacturing of low node size PLDs will be a hindrance, as few vendors have the capability to manufacture semiconductor components suiting node sizes less than 10 nm. Thus, the increasing complexity and production costs of PLDs at low node sizes can hinder the growth of the global PLD market during the forecast period.

For the detailed list of factors that will drive and challenge the growth of the programmable logic devices (PLD) market during the 2019-2023, view our report.

Competitive Landscape

The market appears to be highly concentrated and with the presence of very few vendors. This market research report will help clients identify new growth opportunities and design unique growth strategies by providing a comprehensive analysis of the market's competitive landscape and offering information on the products offered by companies.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

  • 2.1 Preface
  • 2.2 Preface
  • 2.3 Currency conversion rates for US$

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY APPLICATION

  • Market segmentation by application
  • Comparison by application
  • Communication and data processing - Market size and forecast 2018-2023
  • Industrial - Market size and forecast 2018-2023
  • Automotive - Market size and forecast 2018-2023
  • Others - Market size and forecast 2018-2023
  • Market opportunity by application

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • North America - Market size and forecast 2018-2023
  • South America - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 11:MARKET TRENDS

  • Increasing partnerships for development of PLD technologies
  • Rising demand for in-vehicle electronics
  • Growth in demand for FPGAs in space applications

PART 12: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 13: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Intel
  • Lattice Semiconductor
  • Microchip Technology
  • QuickLogic
  • Xilinx

PART 14: APPENDIX

  • Research methodology
  • List of abbreviations

PART 15: EXPLORE TECHNAVIO

List of Exhibits

  • Exhibit 01: Global semiconductor market
  • Exhibit 02: Segments of global semiconductor market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2018
  • Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
  • Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 09: Five forces analysis 2018
  • Exhibit 10: Five forces analysis 2023
  • Exhibit 11: Bargaining power of buyers
  • Exhibit 12: Bargaining power of suppliers
  • Exhibit 13: Threat of new entrants
  • Exhibit 14: Threat of substitutes
  • Exhibit 15: Threat of rivalry
  • Exhibit 16: Market condition - Five forces 2018
  • Exhibit 17: Application - Market share 2018-2023 (%)
  • Exhibit 18: Comparison by application
  • Exhibit 19: Communication and data processing - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 20: Communication and data processing - Year-over-year growth 2019-2023 (%)
  • Exhibit 21: Industrial - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 22: Industrial - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: Automotive - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 24: Automotive - Year-over-year growth 2019-2023 (%)
  • Exhibit 25: Others - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 26: Others - Year-over-year growth 2019-2023 (%)
  • Exhibit 27: Market opportunity by application
  • Exhibit 28: Customer landscape
  • Exhibit 29: Market share by geography 2018-2023 (%)
  • Exhibit 30: Geographic comparison
  • Exhibit 31: APAC - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 32: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 33: EMEA - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 34: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 35: North America - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 36: North America - Year-over-year growth 2019-2023 (%)
  • Exhibit 37: South America - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 38: South America - Year-over-year growth 2019-2023 (%)
  • Exhibit 39: Key leading countries
  • Exhibit 40: Market opportunity
  • Exhibit 41: Comparison between ASIC and PLD
  • Exhibit 42: Impact of drivers and challenges
  • Exhibit 43: Vendor landscape
  • Exhibit 44: Landscape disruption
  • Exhibit 45: Vendors covered
  • Exhibit 46: Vendor classification
  • Exhibit 47: Market positioning of vendors
  • Exhibit 48: Intel - Vendor overview
  • Exhibit 49: Intel - Business segments
  • Exhibit 50: Intel - Organizational developments
  • Exhibit 51: Intel - Geographic focus
  • Exhibit 52: Intel - Segment focus
  • Exhibit 53: Intel - Key offerings
  • Exhibit 54: Lattice Semiconductor - Vendor overview
  • Exhibit 55: Lattice Semiconductor - Business segments
  • Exhibit 56: Lattice Semiconductor - Organizational developments
  • Exhibit 57: Lattice Semiconductor - Geographic focus
  • Exhibit 58: Lattice Semiconductor - Key offerings
  • Exhibit 59: Microchip Technology - Vendor overview
  • Exhibit 60: Microchip Technology - Business segments
  • Exhibit 61: Microchip Technology - Organizational developments
  • Exhibit 62: Microchip Technology - Geographic focus
  • Exhibit 63: Microchip Technology - Segment focus
  • Exhibit 64: Microchip Technology - Key offerings
  • Exhibit 65: QuickLogic - Vendor overview
  • Exhibit 66: QuickLogic - Business segments
  • Exhibit 67: QuickLogic - Organizational developments
  • Exhibit 68: QuickLogic - Geographic focus
  • Exhibit 69: QuickLogic - Key offerings
  • Exhibit 70: Xilinx - Vendor overview
  • Exhibit 71: Xilinx - Business segments
  • Exhibit 72: Xilinx - Organizational developments
  • Exhibit 73: Xilinx - Geographic focus
  • Exhibit 74: Xilinx - Key offerings
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