市场调查报告书

全球IC封装与测试产业的发展趋势展望 (2019年以后)

Development of the Global IC Packaging and Testing Industry, 2019 and Beyond

出版商 MIC - Market Intelligence & Consulting Institute 商品编码 922704
出版日期 内容资讯 英文 30 Pages
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全球IC封装与测试产业的发展趋势展望 (2019年以后) Development of the Global IC Packaging and Testing Industry, 2019 and Beyond
出版日期: 2020年01月17日内容资讯: 英文 30 Pages
简介

全球各国OSAT企业 (外包半导体组装与测试) 企业 - 从事IC实装/测试服务的企业 - 于2018年出货额大幅成长。其背后原因包含记忆体产量的持续扩大、以及预测美中贸易战导致关税成长而进行的库存补给和出货额增加等。 2018年全球IC封装与测试产业出货额总计达294亿6200万美元,比2017年成长7.69%。

本报告研究全球IC封装与测试产业与主要企业业绩,并预测未来业绩趋势展望。

第1章 全球整体产业出货额

  • 2018年稳定成长
    • OSAT企业市场占比:受贸易战打击
    • 全球OSAT市场于2019年减速,出货额与2018年相似
  • 台灣IC封装与测试产业:出货额为全球第一,其次为中国
    • 前6名地位不变:前3名差距缩小
    • 台灣IC封装与测试产业成长率:2018年超越全球平均创下8.4%的纪录

第2章 全球领导OSAT企业趋势

  • Amkor:保持稳定成长率、持续专注车用电子设备
  • JCET:持续透过企业并购综效受益、推动高端市场占比
  • Tianshui Huatian Technology:2018年并未实现期望
  • Tongfu Microelectronics:受国际客户支持维持高度成长

第3章 台灣领导OSAT企业趋势

  • ASE:透过企业并购综效受益,专注于SiP技术
    • 积极开发SiP技术协助降低客户成本
  • PTI:扩张非记忆体业务努力实现产品差异化
  • CoF封装成为主流,推动Chipbond与Chipmos收入成长

第4章 MIC觀点

附录

  • 术语表
  • 企业一览
目录
Product Code: SCRPT20011701

Abstract

Worldwide OSAT (Outsourced Semiconductor Assembly and Test) companies who perform IC packaging and testing services registered significant shipment value growth in 2018, thanks to a continued increase in memory production and an advanced inventory replenishment in anticipation of potential tariff increases from the US-China trade war. Worldwide IC packaging and testing industry shipment value in 2018 totaled US$29.462 billion in 2018, up by 7.69% compared to 2017. This report reviews the performance of the worldwide IC packaging and testing industry in 2018 and analyzes its development in 2019 and beyond.

Table of Contents

1.Worldwide Industry Shipment Value

  • 1.1 Steady Growth in 2018
    • 1.1.1 OSAT Companies’ Market Share Struck by Trade War
    • 1.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
  • 1.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
    • 1.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
    • 1.2.2 Taiwanese IC packaging and testing industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

2.Development of Leading International OSAT Companies

  • 2.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
  • 2.2 JCET’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
  • 2.3 Tianshui Huatian Technology Did Not Live Up to Expectation in 201814
  • 2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

3. Development of Leading Taiwanese OSAT Companies

  • 3.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
    • 3.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
  • 3.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
  • 3.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and Chipmos Revenues

4. MIC Perspective

Appendix

  • Glossary of Terms
  • List of Companies

List of Tables

  • Table 1 M&A of Leading OSAT Companies over Past Five Years
  • Table 2 ASE Revenues by Business Types
  • Table 3 Milestones of ASE-SPIL Merger
  • Table 4 PTI Revenue by Business Type

List of Figures

  • Figure 1 Worldwide IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019
  • Figure 2 World’s Top Ten OSAT Companies by Revenue in 2018
  • Figure 3 Taiwanese IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019

List of Topics

Development of the global IC packaging and testing industry and includes shipment value and year-on-year growth rate for the period 2016-2019

Analysis of leading OSAT (Outsourced Semiconductor Assembly and Test) companies, including Amkor, JCET, Tianshui Huatain Technology, Tongfu Microelectronics

Companies covered

AMD

Amkor

ASE

Asus

Chipbond

ChipMOS

FCI

Hisilicon

Hynix

J-Device

JCET

JSCK

KYEC

MediaTek

Nanium

NVidia

Panasonic

PTI

Qorvo

Qualcomm

Samsung

Sigurd

SJSemi

Skyworks

SMIC

SPIL

STATS ChipPAC

Tainshui Huatian Technology

Tera Probe

Tongu Microelectronics

TSI

Tsinghua Unigroup

TSMC

Unisem

UTAC

Winste

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