市场调查报告书

全球IC封装、实验产业概要与预测

Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016

出版商 MIC - Market Intelligence & Consulting Institute 商品编码 372564
出版日期 内容资讯 英文 14 Pages
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价格
全球IC封装、实验产业概要与预测 Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016
出版日期: 2016年09月26日内容资讯: 英文 14 Pages
简介

本报告提供全球IC封装、实验产业调查分析,最近的发展趋势,2016年之后的发展预测相关的系统性资讯。

第1章 全球IC封装、实验产业的出货收益

  • OSAT产业的出货收益的减少
  • 台灣最大的出货收益占有率

第2章 主要国际供应商的发展

  • 汽车用IC市场上,Amkor收购J-Device
  • 中国高阶技术和统包解决方案受到关注

第3章 主要台灣供应商的发展

  • ASE开发多样的技术
  • SPIL开发Foxconn和SiP

第4章 结论

附录

词汇表

企业清单

目录
Product Code: SCRPT16092601

The worldwide IC packaging and testing industry, worldwide and Taiwanese companies alike, suffered weak growth momentum in 2015 due to declines in the global PC market and a slowdown in mobile device sales. Despite the new opportunities contributed by non-3C segments such as automobile and IoT (Internet of Things), growth of these segments has remained limited as they are still in the early stages of development. Therefore, 3C products will continue to be a key driving force to fuel growth. In response to changes in the industry, foreign and Taiwanese IC packaging and testing vendors have introduced many new strategies and deployments. This report reviews the business performance of the worldwide IC packaging and testing industry in 2015 and analyzes its development in 2016.

Table of Contents

1. Worldwide IC Packaging and Testing Industry Shipment Value

  • 1.1 OSAT Industry Shipment Value Declines in 2015 on Weak Market Demand
  • 1.2 Taiwan Boasts Largest Shipment Value Share in 2015, Followed by China

2. Leading International Vendors' Development

  • 2.1 Amkor Acquires J-Device for Automotive IC Market; UTAC Focuses on Product Diversification
  • 2.2 China Eyes on High-end Technology and Turn-key Solutions

3. Leading Taiwanese Vendors' Development

  • 3.1 ASE Develops Diversified Technologies in Multiple Industries
  • 3.2 SPIL Develops SiP with Foxconn; PTI Enhances Deployment in China with Micron

4. Conclusion

  • 4.1 China's Horizontal Integration Poses Threats to Taiwanese Vendors
  • 4.2 Taiwan can Maintain Competitiveness via Horizontal and Vertical Integration

Appendix

  • Glossary of Terms
  • List of Companies

List of Topics

Overview of the worldwide IC packaging and testing industry, including OSAT industry's shipment value and share by country from 2014 to 2017

Summary of the development of key players, including Amkor and UTAC, leading Chinese vendors Jiangsu Changjiang Electronics Technology, Tianshui Huatian Technology, and Nantong Fujitsu Microelectronics, as well as leading Taiwanese vendors ASE, SPIL, and PTI; also included are vendors' strategic alliance with upstream wafer foundries in China

List of Figures

  • Figure 1: Worldwide OSAT Industry Shipment Value and Growth Rates, 2014 - 2017
  • Figure 2: OSAT Industry Shipment Value Share by Country, 2014 - 2017
  • Figure 3:Leading International IC Packaging and Testing Vendors' Milestones
  • Figure 4: Leading Chinese Packaging and Testing Vendors' Acquisition of Advanced Technologies and Provisioning of Turn-key Solutions
  • Figure 5: ASE's Technology Development and Industrial Deployment
  • Figure 6: Recent Developments of SPIL and PTI

Companies covered

AMD, Amkor, ASE, ASE Embedded Electronics Incorporated, FCI, Foxconn, Infineon, Inotera Memories, J-Devices, Jiangsu Changjiang Electronics, Micron, Nantong Fujitsu Microelectronics, ProMOS Technologies, PTI, Shanghai Huahong Grace, Shanghai Huali Microelectronics, SJsemi, SMIC, SPIL, STATS ChipPAC, TDK, Tianshui Huatian Technology, USI, UTAC, XMC