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市场调查报告书

半导体尖端加工技术:Intel、Samsung、TSMC的竞争分析

Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC

出版商 MIC - Market Intelligence & Consulting Institute 商品编码 344753
出版日期 内容信息 英文 14 Pages
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半导体尖端加工技术:Intel、Samsung、TSMC的竞争分析 Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC
出版日期: 2015年11月06日 内容信息: 英文 14 Pages
简介

全球半导体晶圆代工厂市场,由于智能型手机、计算机、穿戴式设备、IoT支持设备的需求,近几年持续踏实成长。

本报告提供Intel、Samsung、TSMC的竞争力调查分析,以技术发展、生产能力、客户关系为焦点,提供半导体晶圆代工厂市场未来发展趋势相关的系统性信息。

第1章 尖端加工技术分析

  • 技术发展蓝图
  • 主要技术的发展
  • 资本支出

第2章 生产能力分析

  • 以多样生产线强化竞争力
  • 智能生产产生经济利益

第3章 客户关系分析

  • Samsung、Intel的客户信赖低

结论

  • Intel
  • Samsung
  • TSMC

附录

  • 词汇表
  • 企业清单
目录
Product Code: SCRPT15110601

The worldwide semiconductor foundry market has been growing steadily in recent years, thanks to the demand for smartphones, computers, wearables, and IoT (Internet of Things) application devices. Advanced processes have been the major driving force behind the growth. For this reason, IDMs such as Intel and Samsung have been deploying in 14nm and 10nm process technologies, thereby shaking the leadership of TSMC's market share. This report profiles the competition among Intel, Samsung, and TSMC-from the perspective of technology deployment, manufacturing capabilities, and customer relationship-and analyzes the future development of the semiconductor foundry market.

Table of Contents

1. Analysis of Advanced Process Technologies

  • 1.1 Technology Roadmaps
    • 1.1.1 Intel's Technology Leadership Had Little Impact on Pure-play Foundries
    • 1.1.2 TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
    • 1.1.3 TSMC, Samsung Head-to-Head Competition for 10nm Process
  • 1.2 Development of Key Technologies
    • 1.2.1 Vendors Pursue 3D FinFET in Sub-2xnm Designs
    • 1.2.2 TSMC Gets the Upper Hand over Samsung on 16/14nm Process
    • 1.2.3 Samsung Faces More Challenges at 10nm Technology
    • 1.2.4 Vendors All Focus on 3D IC Packaging Services
  • 1.3 Capital Expenditures (Capex)
    • 1.3.1 TSMC Concentrates on Advanced Process Investments

2. Analysis of Manufacturing Capabilities

  • 2.1 Diversified Production Lines to Strengthen Competitiveness
    • 2.1.1 TSMC Continues to Expand Market Share of Homogeneous ICs
    • 2.1.2 Samsung, Intel Have a Head Start in Heterogeneous Integration
  • 2.2 Smart Manufacturing to Create Economic Benefits
    • 2.2.1 TSMC can Use Big Data Analytics to Widen its Advantage

3. Analysis of Customer Relationship

  • 3.1 Samsung, Intel May Have Lower Customer Trust

Conclusion

  • Intel Strengthens Advanced Process Capacity by Acquisitions
  • Samsung Could Focus on Heterogeneous Integration
  • TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

Analysis of the three companies' advanced process technologies, including their technology roadmaps, key technologies, pros and cons, and capital expenditures during 2011 and 2014

Overview of their manufacturing capabilities, touching on homogeneous integration, heterogeneous integration, and big data analytics applications on semiconductor fabrication

Profile of each company's customer relationship, comparing IDMs and pure-play foundries in terms of customer trust

List of Figures

  • Figure 1: Major Vendors' Advanced Technology Roadmap
  • Figure 2: Comparison of Major Vendors' Key Technologies
  • Figure 3: Comparison of Major Vendors' Packaging & Testing Technologies
  • Figure 4: Comparison of Major Vendors' Capex, 2011-2014
  • Figure 5: Product Lines of Major Vendors' Contract Manufacturing Services
  • Figure 6: Application of Big Data Analytics on Semiconductor Fabrication
  • Figure 7: Major Vendors' Position in the Semiconductor Industry Chain

Companies covered

Altera, Apple, Archronix, ESMT, Etron, IBM, Intel, MediaTek, NVIDIA, Qualcomm, Samsung, Spreadtrum, Tabula, Tsinghua Unigroup, TSMC, Xilinx

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