市场调查报告书

台灣的IC封装、检验产业

Taiwanese IC Packaging & Testing Industry, 4Q 2019

出版商 MIC - Market Intelligence & Consulting Institute 商品编码 291079
出版日期 内容资讯 英文 18 Pages
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价格
台灣的IC封装、检验产业 Taiwanese IC Packaging & Testing Industry, 4Q 2019
出版日期: 2020年01月17日内容资讯: 英文 18 Pages
简介

本报告提供台灣的IC封装产业及检验产业的趋势相关分析,整体出货收益变化 (以季度为基础,) ,及供应商的规模 (各等级)、各出货地 (各用户)的详细趋势过去3年份,各供应商的出货收益排行榜等资讯,为您概述为以下内容。

目录

  • 台灣的IC封装、检验产业的出货收益:服务的各类型
  • 台灣的IC封装产业的出货收益
  • 台灣的IC检验产业的出货收益
  • 台灣的IC封装、检验产业的出货收益
  • 台灣的IC封装产业的出货收益排行榜
  • 台灣的IC封装产业的出货收益:供应商的各规模
  • 台灣的IC检验产业的出货收益排行榜
  • 台灣的IC检验产业的出货收益:供应商的各规模
  • 台灣的IC封装产业的出货收益:各出货地
  • 台灣的IC封装产业的出货收益占有率:各出货地
  • 台灣的IC检验产业的出货收益:各出货地
  • 台灣的IC检验产业的出货收益占有率:各出货地
  • 汇率
  • 分析方法,定义

分析对象企业

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • SPIL
  • Walto

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目录
Product Code: SCSTL20011701

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.

Table of Contents

  • Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging Industry Shipment Value , 1Q 2017 - 1Q 2020
  • Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry’s Shipment Value Rankings, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
  • Exchange Rate, 2Q 2017 - 3Q 2019
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered

Ardentec

ASE

Chipbond

ChipMOS

FATC

KYEC

OSE

PTI

Sigurd

SPIL

Walto