Taiwanese IC Packaging & Testing Industry, 4Q 2019
|出版商||MIC - Market Intelligence & Consulting Institute||商品编码||291079|
|出版日期||内容资讯||英文 18 Pages
|台灣的IC封装、检验产业 Taiwanese IC Packaging & Testing Industry, 4Q 2019|
|出版日期: 2020年01月17日||内容资讯: 英文 18 Pages||
本报告提供台灣的IC封装产业及检验产业的趋势相关分析，整体出货收益变化 (以季度为基础，) ，及供应商的规模 (各等级)、各出货地 (各用户)的详细趋势过去3年份，各供应商的出货收益排行榜等资讯，为您概述为以下内容。
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.