表纸
市场调查报告书

台灣的半导体制造业:最新趋势(季报数据)

Taiwanese Semiconductor Manufacturing Industry, 4Q 2019

出版商 MIC - Market Intelligence & Consulting Institute 商品编码 286405
出版日期 内容资讯 英文 23 Pages
订单完成后即时交付
价格
Back to Top
台灣的半导体制造业:最新趋势(季报数据) Taiwanese Semiconductor Manufacturing Industry, 4Q 2019
出版日期: 2020年01月17日内容资讯: 英文 23 Pages
简介

台灣的半导体制造业,2014年第一季的出货量约为81亿7000万美元,与前期比减少3.7%。可是预计第2季将为复苏基调。

本报告提供台灣的半导体制造业(IC晶圆代工厂、DRAM供应商、IDM(整合元件制造商))等最新趋势相关分析、整体市场的出货量、出货收益(以季度为基础)的调查,并将其结果依产品的种类和尺寸、企业形态等汇整,为您概述为以下内容。

目录

  • 台灣的半导体制造业的出货收益(过去2年半份)
  • 台灣的半导体制造业的出货收益:企业的各类型(过去2年半份)
  • 半导体制造业的8英吋形式相当晶圆的出货量与使用率(过去2年半份)
  • 晶圆出货量:各尺寸(过去2年半份)
  • 12英吋形式晶圆的出货量和使用率(过去2年份)
  • 12英吋形式晶圆的出货量:供应商的各类型(过去2年份)
  • 8英吋形式以下的晶圆的出货量和使用率(过去2年份)
  • 8英吋形式以下晶圆的出货量:供应商的各类型(过去2年份)
  • 台灣的晶圆代工厂产业:出货收益排行榜(过去2年份)
  • 晶圆代工厂产业的出货收益:各加工技术(过去2年份)
  • 晶圆代工厂产业的出货收益占有率:各加工技术(过去2年份)
  • 台灣的DRAM产业:出货收益排行榜(过去2年份)
  • DRAM产业的8英吋形式相当晶圆的出货量与使用率(过去2年份)
  • DRAM产业的8英吋形式相当晶圆的出货量占有率:各加工技术(过去2年份)
  • 汇率(过去2年份)
  • 分析范围、定义

本网页内容可能与最新版本有所差异。详细情况请与我们联系。

目录
Product Code: SCSTL20011702

Abstract

The report finds that shipment value of the Taiwanese semiconductor manufacturing industry - comprising mainly of foundry, DRAM, flash memory, and IDM sectors - reached US$ 11.5 billion, growing 17.6% sequentially in the third quarter of 2019. The decline in the frist half of 2019 was mainly attributed to relatively high inventory levels. As the inventory levels have reached the optimal level and TSMC’s advanced processes have entered mass production, the industry’s shipment performance in the second half of 2019 is expected to witness year-on-year growth. The market demand is anticipated to regain momentum in the second half of 2020 thanks to the surging demand for 5G applications and 8K TVs.

Table of Contents

  • The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendor's Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019
  • Exchange Rate, 1Q 2017 - 3Q 2019
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered

Inotera

Nanya

Powerchip

TSMC

UMC

Winbon

Back to Top