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市场调查报告书

全球微机电(MEMS)装置及材料市场:销售企业及晶圆代工厂预测与策略

The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

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全球微机电(MEMS)装置及材料市场:销售企业及晶圆代工厂预测与策略 The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries
出版日期: 2021年05月01日内容资讯: 英文
简介

本报告提供全球微机电(MEMS)装置及材料市场的相关概述,供应商趋势,晶圆代工厂的成功主要原因,无晶圆厂企业的机会,以及市场课题,为您概述为以下内容。

第1章 介绍

第2章 与主要的用途市场预测

  • 微机电(MEMS)装置市场预测
    • 喷墨头
    • 压力感应器
    • 矽晶麦克风
    • 加速度计
    • 陀螺仪
    • MOEMS
    • 微显示器
    • 微流体
    • RF MEMS
    • 超小型燃料电池
    • 新兴的用途
  • 微机电(MEMS)系统市场预测

第3章 装置及材料供应商市场

  • 介绍
  • 微机电(MEMS)设备市场
    • 组织
    • 黏合
    • 冲洗
    • 沉淀
    • 切割
    • 蚀刻
    • 雷射微加工
    • 光刻
    • 检验
    • 检验
    • 热处理
    • 晶圆薄化
  • 微机电(MEMS)材料市场
    • 化学物质
    • 光罩
    • 基板

第4章 微机电(MEMS)晶圆代工厂

  • 晶圆代工厂简介和策略
  • 市场区隔

第5章 晶圆代工厂成功主要原因

第6章 有关微机电(MEMS)的重要事项

  • 3Dinter连接和包装
  • 晶片尺寸
  • 微机电(MEMS)检验
  • 无晶圆厂企业的机会

图表

目录

This vision of MEMS whereby microsensors, microactuators and microelectronics and other technologies, can be integrated onto a single microchip is expected to be one of the most important technological breakthroughs of the future. A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography.

This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

Table of Contents

Chapter 1: The MEMS Market Infrastructure

Chapter 2: Forecast Of The Key Applications And Markets

  • 2.1. MEMS Device Market Forecast
    • 2.1.1. Ink Jet Head
    • 2.1.2. Pressure Sensor
    • 2.1.3. Silicon Microphone
    • 2.1.4. Accelerometer
    • 2.1.5. Gyroscope
    • 2.1.6. Micro Display
    • 2.1.7. Other MOEMS
    • 2.1.8. Microfluidics
    • 2.1.9. RF MEMS
    • 2.1.10. Digital Compass
    • 2.1.11. Inertial Sensor
    • 2.1.12. Emerging Applications
  • 2.2. MEMS System Market Forecast
    • 2.2.1. Automotive Systems
    • 2.2.2. Aeronautics Systems
    • 2.2.3. Consumer Systems
    • 2.2.4. Defense Systems
    • 2.2.5. Industrial Systems
    • 2.2.6. Medical/Life Sciences Systems
    • 2.2.7. Telecom Systems

Chapter 3: Markets for Equipment and Materials Suppliers

  • 3.1. Introduction
  • 3.2. MEMS Equipment Markets
    • 3.2.1. Assembly
    • 3.2.2. Bonding
    • 3.2.3. Cleaning
    • 3.2.4. Deposition
    • 3.2.5. Dicing
    • 3.2.6. Etching
    • 3.2.7. Laser Micromachining
    • 3.2.8. Lithography
    • 3.2.9. Metrology/Inspection
    • 3.2.10. Testing
    • 3.2.11. Thermal Treatment
    • 3.2.12. Wafer Thinning
  • 3.3. MEMS Material Markets
    • 3.3.1. Chemicals
    • 3.3.2. Photomasks
    • 3.3.3. Substrates

Chapter 4: MEMS Foundries

  • 4.1. Foundry Profiles and Strategies
    • 4.1.1. Advanced Microsensors
    • 4.1.2. Agiltron
    • 4.1.3. Asia Pacific Microsystems
    • 4.1.4. Beijing First MEMS
    • 4.1.5. Bosch
    • 4.1.6. China Resources Semiconductor
    • 4.1.7. Colibrys
    • 4.1.8. C2V
    • 4.1.9. Dai-Nippon Printing
    • 4.1.10. Dalso
    • 4.1.11. Freescale
    • 4.1.12. GLOBALFOUNDRIES
    • 4.1.13. Honeywell MEMSplus
    • 4.1.14. Infineon Technologies SensoNor As
    • 4.1.15. Institute of Microelectronics
    • 4.1.16. Innovative Micro Tech
    • 4.1.17. Integrated Sensing Systems Inc. (ISSYS)
    • 4.1.18. LioniX
    • 4.1.19. MEMS Engineering and Material
    • 4.1.20. MEMSCAP
    • 4.1.21. Micralayne
    • 4.1.22. Micrel
    • 4.1.23. Midwest MicroDevices, LLC
    • 4.1.24. Nanostructures Inc
    • 4.1.25. Norcada Inc.
    • 4.1.26. Olympus
    • 4.1.27. Omron
    • 4.1.28. Proton Mikrotechnik
    • 4.1.29. Semiconductor Manufacturing International Corporation
    • 4.1.30. SEMEFAB
    • 4.1.31. Silex Microsystems
    • 4.1.32. Sony
    • 4.1.33. ST Microelectronics
    • 4.1.34. Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
    • 4.1.35. Texas Instruments
    • 4.1.36. Touch Microsystems
    • 4.1.37. Tronics Microsystems
    • 4.1.38. X-Fab
  • 4.2. Small-Mid-Sized Companies

Chapter 5: Factors for Foundry Success

  • 5.1.1. Achieving Economies Of Scale
  • 5.1.2. Competitive Advantages
  • 5.1.3. Core Strengths
  • 5.1.4. Employee Commitment
  • 5.1.5. Expansion Plans
  • 5.1.6. Financial Objectives:
  • 5.1.7. Groundbreaking MEMS Solutions
  • 5.1.8. In- House Expertise in MEMS Testing And Reliability
  • 5.1.9. Leadership in Technology
  • 5.1.10. Manufacturing Excellence
  • 5.1.11. Manufacturing Process
  • 5.1.12. Mastering Process and Production Technology
  • 5.1.13. Patent Protection
  • 5.1.14. Partnerships
  • 5.1.15. Products
  • 5.1.16. Proprietary Development Processes
  • 5.1.17. Sales Organization
  • 5.1.18. Sales Process and Customer Base
  • 5.1.19. Strong Customer Relations
  • 5.1.20. Vision and Goal

Chapter 6: Critical MEMS Issues

  • 6.1. 3-D Interconnects and Packaging
  • 6.2. Wafer Size
  • 6.3. MEMS Testing
  • 6.4. Opportunities For Fabless MEMS Companies

List Of Tables

  • 4.1. Top MEMS Foundries by Revenues

List of Figures

  • 2.1. MEMS Markets
  • 2.2. Ink Jet Head Sales Forecast
  • 2.3. Pressure Sensor Sales Forecast
  • 2.4. Silicon Microphone Sales Forecast
  • 2.5. Accelerometer Sales Forecast
  • 2.6. Gyroscope Sales Forecast
  • 2.7. Micro Display Sales Forecast
  • 2.8. Other MOEMS Sales Forecast
  • 2.9. Microfluidics Sales Forecast
  • 2.10. RF MEMS Sales Forecast
  • 2.11. Digital Compass Sales Forecast
  • 2.12. Inertial Sensor Sales Forecast
  • 2.131. Emerging Applications Sales Forecast
  • 2.12. Automotive System Sales Forecast
  • 2.15. Aeronautics System Sales Forecast
  • 2.16. Consumer System Sales Forecast
  • 2.17. Defense System Sales Forecast
  • 2.18. Industrial System Sales Forecast
  • 2.19. Medical System Sales Forecast
  • 2.20. Telecom System Sales Forecast
  • 3.1. Discrete Assembly of MEMS
  • 3.2. Assembly Equipment Sales Forecast
  • 3.3. Bonding Equipment Sales Forecast
  • 3.4. Cleaning Equipment Sales Forecast
  • 3.5. Deposition Equipment Sales Forecast
  • 3.6. Dicing Equipment Sales Forecast
  • 3.7. Schematic Of DRIE
  • 3.8. Etching Equipment Sales Forecast
  • 3.9. Laser Micromachining Equipment Sales Forecast
  • 3.10. Driving Principle Of The MOR (a) Parallel State (B) Tilted State
  • 3.11. Lithography Equipment Sales Forecast
  • 3.12. Metrology/Inspection Equipment Sales Forecast
  • 3.13. Testing Equipment Sales Forecast
  • 3.14. Thermal Treatment Equipment Sales Forecast
  • 3.15. Wafer Thinning Equipment Sales Forecast
  • 3.16. Chemicals Sales Forecast
  • 3.17. Photomasks Sales Forecast
  • 3.18. Substrates Sales Forecast
  • 3.19. Wafer Starts By Substrate Size
  • 6-1. Process For Capping MEMS
  • 6-2. Examples Of Thermoplastic Cavity Packages
  • 6.3. Fluidic Packaging System
  • 6.4. Forecast of Wafer Size
  • 6-5. Fluidic Packaging System