市场调查报告书

5G时代的大型晶片供应商:成为成功关键的全程(端到端)平台

Major Chip Providers in the 5G Era: End-to-end Platforms May Be the Key to Success

出版商 Analysys Mason 商品编码 896926
出版日期 内容资讯 英文 PPTX and PDF (23 slides); PDF (3 pages)
商品交期: 最快1-2个工作天内
价格
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5G时代的大型晶片供应商:成为成功关键的全程(端到端)平台 Major Chip Providers in the 5G Era: End-to-end Platforms May Be the Key to Success
出版日期: 2019年07月30日内容资讯: 英文 PPTX and PDF (23 slides); PDF (3 pages)
简介

透过将无线接取网路(RAN)功能引进至既有硬体,市售中央处理器厂商也能够加入5G市场,然而却面临了必须一边进行极为困难的作业一边大幅降低成本的挑战。因此,仅有一部分的供应商做出可以确保整体供应链云端RAN服务盈利能力的端到端平台。

本报告针对大型晶片供应商因应5G时代的行动提供了详细分析。

主要内容

  • 打算加入5G市场,或是希望守住市场地位的大型晶片供应商,要获得成功的不可或缺因素
  • 预想中的支援5G晶片市场情形,以及和广泛云端基础设施的关联性
  • 能够化解持续下降的网路总持有成本要件,与持续增加多样性和复杂性的网路晶片之间的矛盾的最新电脑系统结构
  • 网路机器供应商与通讯业者将市售平台与开放原始码框架结合,可以改善5G和云端的经济性,降低总成本
目录

"A leading role in 5G is at stake for major chip providers if they can create an end-to-end platform as networks move to the cloud."

Deploying a RAN on commodity hardware opens the door for merchant processor makers in the 5G market, but comes with the challenge to reduce costs significantly while supporting extremely demanding tasks. Only a few vendors will achieve the end-to-end platform that will make the cloud-RAN economically viable for the whole supply chain.

In this report, we answer the following questions.

  • What are the critical success factors for large chip providers that are entering or defending their position in the 5G market?
  • What will the 5G chip landscape look like, and how will it relate to the broader cloud infrastructure?
  • How can new architecture resolve the conflict between falling network TCO requirements and the rising variety and complexity of network chips?
  • How can NEPs and operators improve their 5G and cloud economics and reduce their overall costs by combining merchant platforms with open-source frameworks?

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