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New Venture Research

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结果共9个,以下为1 - 9 排序依 每页数量
The Worldwide OEM Electronics Assembly Market - 2019 Edition: A Unique Database Providing Global Electronics Assembly Data of Nearly 380 of the World's Leading OEM Outsourcing Companies
The Worldwide OEM Electronics Assembly Market - 2019 Edition: A Unique Database Providing Global Electronics Assembly Data of Nearly 380 of the World's Leading OEM Outsourcing Companies
出版商
New Venture Research
商品编码
245000
出版日期
2019年10月25日
内容资讯
68 Pages; 64 Excel Tables
价格
USD 3,995 Sample Availavle
Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition: A New Comprehensive Report Covering Critical Market Segments of the Global IC Packaging Industry
Global IC Packaging Applications and Outsourced Semiconductor and Test (OSAT) Markets - 2019 Edition: A New Comprehensive Report Covering Critical Market Segments of the Global IC Packaging Industry
出版商
New Venture Research
商品编码
914875
出版日期
2019年09月30日
内容资讯
300+ Pages
价格
USD 3,995 Sample Availavle
The Worldwide Electronics Manufacturing Services Market - 2019 Edition: The Most Comprehensive Study Available on the Worldwide EMS Market
The Worldwide Electronics Manufacturing Services Market - 2019 Edition: The Most Comprehensive Study Available on the Worldwide EMS Market
出版商
New Venture Research
商品编码
205844
出版日期
2019年07月31日
内容资讯
600 Pages
价格
USD 3,995 Sample Availavle
Advanced IC Packaging, Technologies, Materials and Markets - 2018 Edition: A Strategic Report Covering the Latest Technologies in Advanced IC Packaging, Enabling Portable, Wireless and Other Electronics
Advanced IC Packaging, Technologies, Materials and Markets - 2018 Edition: A Strategic Report Covering the Latest Technologies in Advanced IC Packaging, Enabling Portable, Wireless and Other Electronics
出版商
New Venture Research
商品编码
226112
出版日期
2018年11月19日
内容资讯
315 Pages
价格
USD 3,995 Sample Availavle
The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
The Worldwide IC Packaging Market - 2018 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版商
New Venture Research
商品编码
275970
出版日期
2018年04月30日
内容资讯
500+ Pages
价格
USD 3,995 Sample Availavle
The Worldwide Merchant Embedded Computing Market - 2018 Edition: A Comprehensive Report on the Latest Embedded Computing Technologies, Plus Forecasts of Key Markets
The Worldwide Merchant Embedded Computing Market - 2018 Edition: A Comprehensive Report on the Latest Embedded Computing Technologies, Plus Forecasts of Key Markets
出版商
New Venture Research
商品编码
241567
出版日期
2018年03月31日
内容资讯
400+ Pages
价格
USD 3,995 Sample Availavle
OEM and EMS - A Market and Competitive Analysis 2016 Edition: A Unique Report Combining In-Depth Review of 360 OEMs' Outsourced Electronics Assembly and Market Share Analysis of 48 Product Segments of the 100 Largest EMS Subcontractors
OEM and EMS - A Market and Competitive Analysis 2016 Edition: A Unique Report Combining In-Depth Review of 360 OEMs' Outsourced Electronics Assembly and Market Share Analysis of 48 Product Segments of the 100 Largest EMS Subcontractors
出版商
New Venture Research
商品编码
440708
出版日期
2016年12月31日
内容资讯
234 Pages
价格
USD 3,995 Sample Availavle
The Worldwide OEM, EMS and ODM Electronics Assembly Market in Historical Perspective 1992-2012
The Worldwide OEM, EMS and ODM Electronics Assembly Market in Historical Perspective 1992-2012
出版商
New Venture Research
商品编码
263327
出版日期
2014年08月31日
内容资讯
 
价格
USD 2,495 Sample Availavle
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The Multi-Component IC Packaging Market - 2014 Edition
出版商
New Venture Research
商品编码
295091
出版日期
2014年01月30日
内容资讯
188+ Pages
价格
USD 1,495 Sample Availavle