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年间契约型资讯服务

全球半导体材料市场资料

Materials Market Data Subscription (MMDS)

出版商 SEMI 商品编码 44297
出版日期 4 Issues/Year 内容资讯 英文
价格
全球半导体材料市场资料 Materials Market Data Subscription (MMDS)
出版日期: 4 Issues/Year 内容资讯: 英文
简介

身为半导体、FPD、MEMS、奈米科技相关生产设备・材料产业的国际工会,同时也从事该领域市场调查及统计分析的SEMI(总公司:California State),提供汇整全球半导体材料市场资料的年度资讯服务"Material Market Data Subscription (MMDS)"

本年度资讯服务内容包括:矽晶、SOI等制造材料及导线架、封装载板等封装材料的个别调查分析,以及出货量变化等。内容纲要摘记如下:

调查目标材料

  • 制造材料
    • 矽晶
    • SOI
    • 光罩
    • 抗蚀剂
    • 附属品
    • 瓦斯
    • 化学药品
    • 目标
    • CMP
    • 其他
  • 封装材料
    • 导线架
    • 封装载板
    • 銲线
    • 黏晶片
    • 封模化合物/封胶材料
    • 陶瓷封装材料
    • 其他

调查目标地区

  • 北美
  • 欧洲
  • 其他(ROW)
  • 日本
  • 台灣
  • 韩国
  • 中国
目录

Overwiew:

The SEMI Materials Market Data Subscription includes current revenue data along with two-year forecast and ten years of historical data.

The report contains 10 segments for wafer fab related materials and 7 segments for packaging related materials. In addition, quarterly revenues are included for photoresist, photoresit ancillaries and electronic gases. Shipment numbers are included for silicon* (quarterly) and leadframe (monthly).

Seven regions of the world are covered in this report including North America, Japan, Korea, Taiwan, China, and Rest of World (ROW).

All sales revenue estimates are reflected in U.S dollars.

Product Information:

  • Fab Materials Covered: Silicon, SOI, Photomasks, Photoresists, Photoresist Ancillaries, Gases, Process Chemicals, CMP, Other Wafer Fab Materials;
  • Packaging Materials Covered: Leadframes, Substrates, Bonding Wire, Die Attatch, Mold Compound/Encapsulants, Ceramic Packages, Other Packaging Materials

Table of Contents(Tabs of Spreadsheet)

  • Intro
  • Category Definitions
  • Detailed Annual Silicon Data
  • Bonding Wire Market
  • Wafer Fab Materials
  • Packaging Materials
  • Detailed Annual Gas Sales
  • Quarterly Silicon Shipments
  • Quarterly Photoresist Sales
  • Quarterly PR Ancillary Sales
  • Quarterly Process Gas Sales
  • Monthly Leadframe Shipments