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市场调查报告书

光连接模组的商机:市场、技术预测-晶载及芯片对芯片

Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip

出版商 Communications Industry Researchers (CIR) 商品编码 278633
出版日期 内容信息 英文
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光连接模组的商机:市场、技术预测-晶载及芯片对芯片 Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip
出版日期: 2013年08月31日 内容信息: 英文
简介

本报告提供芯片层级的光连接模组的最新发展趋势,及全球的重要的研究机关的配合措施相关分析、传统CPU芯片预测、最新的架构、光连接模组与未来的金属互连、互连替代的比较、芯片层级光连接模组之商业机会的10年蓝图,及主要企业的简介,为您概述为以下内容。

摘要整理

第1章 简介

第2章 晶载/芯片对芯片互相连接的需求分析

  • 电子互连的限制
  • 摩尔法则、定标及互相连接
    • 摩尔法则的目前预测
    • 互相连接的影响
  • 多核心微处理器产生新的互连问题
  • 3D芯片
  • 转移至非矽芯片的可能性:奈米碳管、石墨烯、量子点
    • 互相连接的影响
    • 转移至光运算的可能性
  • 本章的要点

第3章 晶载/芯片对芯片互相连接的技术

  • 芯片对芯片互相连接用的目前光学零件
  • 芯片型互相连接取向的新激光技术
    • VCSEL
    • 量子点激光
    • 其他技术
  • 芯片型互相连接取向的新的检测技术
  • 芯片型互相连接取向的新的调制器技术
  • 芯片型互相连接取向的10年蓝图、收益预测
  • 未来的芯片型互相连接的光学集成所扮演的角色
    • 矽光子学
    • 磷化铟以及其他的无机半导体
    • 芯片型互相连接的聚合物波导管所扮演的角色
    • 芯片型互相连接的光集积化的10年蓝图、收益预测
  • 其他先进互相连接光学的替代
    • 奈米碳管
    • 其他
  • 本章的要点
目录

The traditional architectural and material assumptions with regard to how integrated circuits are fabricated have been challenged in recent years and the semiconductor industry is looking for new solutions. Power and thermal issues add to this apparent crisis in the semiconductor industry.

One of the most important problems is the so-called "interconnect bottleneck," that is the tendency for data traffic jams to appear both on-chip and chip-to-chip. The interconnect bottleneck is emerging well before Moore's Law completely runs out of steam, but reappears in differing forms in some of the new architectures designed to make chip scaling easier.

The "obvious" solution is to deploy fiber optics; which is usually the way to go whenever and wherever there is a bandwidth problem. But fiber optic solutions to on-chip and chip-to-chip interconnection is something that will be hard to develop for commercial chip products. Producing photonic devices that are small enough and inexpensive enough to be used at the chip level is an immensely difficult requirement.

In this report, we analyze the latest developments in optical interconnection at the chip level and the progress in this area that is being made by important research teams throughout the world. Both R&D and commercial development are discussed.

The report looks at this issue from the perspective of classic CPU chips as well as the latest architectures, and the opportunities for optical interconnection are compared to a possible future for metal interconnects and interconnect alternatives that are even more exotic than photonics; carbon nanotubes, especially.

The report also contains a 10-year roadmap that explains where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection.

Table of Contents

Executive Summary

  • E.1 Opportunities and Business Models for Photonics Firms
  • E.2 How the Semiconductor Industry Will Use Optical Interconnection as an Enabling Technology
  • E.3 Summary of Key R&D Directions for On-Chip and Chip-to-Chip Optical Interconnection
  • E.4 Eight Companies and Other Organization that Will Create Photonic Interconnection for Chip-Level Interconnection
  • E.5 Roadmap and Summary 10-year Forecast for Chip Level Interconnection

Chapter One Introduction

  • 1.1 Background to this Report
  • 1.2 Objective and Scope of this Report
  • 1.3 Methodology of this Report
  • 1.4 Plan of this Report

Chapter Two Analysis of Demand for On-Chip/Chip-to-Chip Interconnection

  • 2.1 Limits to Electronic Interconnects
  • 2.2 Moore's Law, Scaling and Interconnection
    • 2.2.1 Current Prognosis for Moore's Law
    • 2.2.2 Impact on Interconnection
  • 2.2 Multi-Core Processors Breed New Interconnection Problems
  • 2.3 So Do 3D Chips
  • 2.4 Potential for Moving to Non-Silicon Chips: Carbon Nanotubes, Graphene, Quantum Dots
    • 2.4.1 Impact on Interconnection
    • 2.4 A Possible Transition to Optical Computing
    • 2.4.1 Impact on Interconnection
  • 2.5 Key Points Made in this Chapter

Chapter Three Technologies for On-Chip/Chip-to-Chip Interconnection

  • 3.1 Current Optical Assemblies for Chip-to-Chip Interconnection
  • 3.2 Emerging Laser Technology for Chip-Based Interconnections
    • 3.2.1 VCSELs
    • 3.2.2 Quantum Dot Lasers
    • 3.2.3 Other Technologies
  • 3.3 Emerging Detector Technology for Chip-Based Interconnection
  • 3.4 Emerging Modulator Technology for Chip-Based Interconnection
  • 3.5 Ten-Year Road Map and Revenue Forecast for Chip-Based Optical Interconnection
  • 3.6 The Role of Optical Integration in Future Chip-Based Interconnection
    • 3.6.1 Silicon Photonics
    • 3.6.2 Indium Phosphide and Other Inorganic Semiconductors
    • 3.6.3 The Role of Polymer Waveguides in Chip-Based Interconnection
    • 3.6.4 Ten-Year Road Map and Revenue Forecast for Optical Integration in Chip-Based Optical Interconnection
  • 3.7 Other Alternatives to Optics for Advanced Interconnection
    • 3.7.1 Carbon Nanotubes
    • 3.7.2 Other
  • 3.8 Key Points Made in this Chapter
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