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[英文调查报告书]

SMD(表面贴装设备)安装的最新动向

Emerging Trends in SMD Placement

商品编码 : 56999
出版日期 : 2007/09

Price

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此出版品为英文撰写

Abstract

This research service focuses on the latest trends in surface mount device (SMD) placement system and its relevant technologies.

Table of Contents

1 EXECUTIVE SUMMARY

  • Scope and Methodology
    • Scope
    • Methodology
  • Research Overview and Key Findings
    • Research Overview
    • Key Findings

2 SURFACE MOUNT DEVICE ASSEMBLY

  • Technology Snapshot
    • The Emergence of SMD Assembly Process
    • Overview of the SMD Assembly Process
  • SMD Performance and Components
    • Factors that Influence SMD Assembly
    • SMD Assembly Components

3 SMD PLACEMENT SYSTEMS

  • Types of SMD Placement Designs
    • Overview
    • Turret-Style Systems
    • Pick and Place Systems
    • Multistation Systems
  • Summary and Key Companies
    • Summary
    • Key Players in this Sector

4 EMERGING TRENDS AND ISSUES IN SMD PLACEMENT

  • Placement Technology
    • Modular Design Using Parallel Placement
    • Vision Systems
    • Placement Optimization Issues
    • Placement Head Technology
  • Related Technologies and Issues
    • Standardization
    • Supporting Miniaturization (01005)
    • New Packaging and Board Technologies
    • Problems of Lead-Free Solder
    • Rework Technologies

5 KEY DEVELOPMENTS RELATED TO THE SMD SECTOR

  • Global Developments in Placement Machine Technology
    • Hybrid Pick and Place Machine--Netherlands
    • Handling Capability and Speedpack Upgrade to a Series--Netherlands
    • New MG-2 Chipshooter for M Series--Netherlands
    • Upgrades in X Series--Netherlands
    • Linear Motor Driven AdVantis XS--USA
    • Lightning Placement Technology--USA
    • Gold Dual-Lane and Black Midrange Electric Tape Feeder--USA
    • World' s First Parallel 2D/3D Inspection--Germany
    • New D-Series Placement Machines--Germany
    • Boosting the Capability of Siplace through Acquisitions--Germany
    • Linear Motors in High Speed HLX Series--Germany
  • Global Developments Affecting Placement Technology
    • StencilQuick Rework Solution--USA
    • Fully-Hermetic Plastic Packaging--USA
    • Assembléon and Yamaha Intelligent Machinery Partnership--Germany and Japan
    • New Solder Ball Feeder Equipment--UK

6 KEY CONTACTS AND SELECTED PATENTS

  • Key Contacts
    • Industry
    • Academics
  • Selected Patents
    • Patents I
    • Patents II

7 DECISION SUPPORT DATABASE

  • Decision Support Database Tables
    • World OLED Revenues (2002 to 2012)
    • Global Semiconductor and Semiconductor Equipment Market (2002-2012)
    • Percentage of Electronic Components Contribution to Electronics Industry (2002-2012)
    • Consumer Electronics Contribution to Electronics Industry--2002 to 2012
    • Global HB-LED Sales for Lighting (USD Million) 2002-2013
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此出版品为英文撰写

Top

[英文调查报告书]
SMD(表面贴装设备)安装的最新动向
Emerging Trends in SMD Placement

出版商 : Technical Insights, Inc. Technical Insights, Inc.
代理商 : Global Information, Inc. Global Information, Inc.

US $ 6,000 (Web Access (Regional License))
US $ 6,500 (Hard Copy & Web Access (Regional License))
商品编码 : 56999

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