giichinese.com logo
giichinese.com logo
日商环球讯息有限公司


垂直集成市场
Printed Electronics USA 2008
Printed Electronics Europe 2009
- Japanese Korean English
Report
[英文调查报告书]

薄膜沈淀披覆技术之趋势、课题与市场分析

Thin Film Deposition: Trends, Key Issues, Market Analysis

商品编码 : 5774
出版日期 : 2007/12

Price

-
此出版品为英文撰写

Abstract

CHAPTER 1

INTRODUCTION

Thin film deposition processes play a critical role in the production of high-density, high-performance microelectronic products. Considerable progress has been achieved in the development of deposition processes -- and in the development of the reactor systems in which they are carried out. This report discusses relevant mechanisms; processing, system, and materials aspects, potential advances, and considerations regarding extendibility to a wafer diameter of 300 mm.

With the introduction of new thin-film materials to consistently shrinking microelectronic devices and circuits, and as the aperture ratio of an integrated-circuit structure increases, conformal step coverage becomes increasingly difficult to achieve. This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD.

In addition., as device geometries shrink, semiconductor manufacturing has become increasingly complex and precise, requiring a better understanding of the specific processes involved. These issues are described in the report.

This report discusses the technology trends, products, applications, and suppliers of materials and equipment. It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement. A market forecast for Thin Film Deposition Tools is presented to 2004.

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Physical Vapor Deposition

  • 3.1 Introduction
  • 3.2 Sputtering Technology
  • 3.3 Plasma Technology
  • 3.4 Reactor Designs
    • 3.4.1 Long-Throw Deposition
    • 3.4.2 Collimated Sputter Deposition
    • 3.4.3 Showerhead Deposition
    • 3.4.4 Ionized PVD
  • 3.5 Semiconductor Processing
    • 3.5.1 Feature Patterning
    • 3.5.2 Gap Fill
  • 3.6 Targets

Chapter 4 Chemical Vapor Deposition

  • 4.1 Introduction
  • 4.2 Chemical Vapor Deposition (CVD) Techniques
    • 4.2.1 APCVD
    • 4.2.2 LPCVD
    • 4.2.3 PECVD
    • 4.2.4 HDPCVD
    • 4.2.5 ALD

Chapter 5 Electrochemical Deposition

  • 5.1 Introduction
  • 5.2 Reactor Design
  • 5.3 Challenges
  • 5.4 Additives
  • 5.5 Processing
    • 5.5.1 Superfilling
    • 5.5.2 Aspect Ratios
  • 5.6 Copper Cathodes
  • 5.7 Wet Copper Seed-Layer

Chapter 6 Film Deposition And Film Properties

  • 6.1 Introduction
  • 6.2 Dielectric Deposition
    • 6.2.1 Silicon Dioxide
      • 6.2.1.1 Thermal CVD
      • 6.2.1.2 PECVD
      • 6.2.1.3 HDPCVD
    • 6.2.2 Silicon Nitride
      • 6.2.2.1 Thermal CVD
      • 6.2.2.2 PECVD
      • 6.2.2.3 HDPCVD
    • 6.2.3 High-K Dielectrics
    • 6.2.4 Low-K Dielectrics
  • 6.3 Metal Deposition
    • 6.3.1 Aluminum
    • 6.3.2 Tungsten/Tungsten Silicide
    • 6.3.3 Titanium Nitride

Chapter 7 Vendor Issues

  • 7.1 Introduction
  • 7.2 300mm Processing
  • 7.3 Integrated Processing
  • 7.4 Copper
  • 7.5 Metrology
  • 7.6 ESD
  • 7.7 Parametric Test

Chapter 8 Market Forecast

  • 8.1 Introduction
  • 8.2 Key Issues
  • 8.3 Market Forecast Assumptions
  • 8.4 Market Forecast
    • 8.4.1 Chemical Vapor Deposition
    • 8.4.2 Physical Vapor Deposition
    • 8.4.3 Copper Electroplating Market
    • 8.4.4 Atomic Layer Deposition Market

FIGURES

  • 3.1 Schematic Of Sputtering System
  • 3.2 Magnetron Sputtering Design
  • 3.3 Showerhead Reactor Design
  • 3.4 Ionized PVD
  • 4.1 APCVD Reactor
  • 4.2 Tube CVD Reactor
  • 4.3 HDPCVD Reactor
  • 4.4 ALD Versus PVD Copper Barrier
  • 5.1 Copper Electroplating System
  • 8.1 Worldwide MCVD Market Shares
  • 8.2 Worldwide DCVD Market Shares
  • 8.3 Worldwide DCVD Market By Sectors
  • 8.4 Worldwide HDHCVD Market Shares
  • 8.5 Worldwide PECVD Market Shares
  • 8.6 Worldwide SACVD Market Shares
  • 8.7 Worldwide LPCVD Market Shares
  • 8.8 Worldwide PVD Market Shares
  • 8.9 Worldwide ECD Market Shares
  • 8.10 ALD Applications a Share of Market
  • 8.11 Worldwide ALD Market Shares

TABLES

  • 8.1 Worldwide CVD Market Forecast
  • 8.2 Worldwide MCVD Market Shares
  • 8.3 Worldwide DCVD Market Shares
  • 8.4 Worldwide HDPCVD Market Shares
  • 8.5 Worldwide PECVD Market Shares
  • 8.6 Worldwide SACVD Market Shares
  • 8.7 Worldwide LPCVD Market Shares
  • 8.8 Worldwide PVD Market Forecast
  • 8.9 Worldwide PVD Market Shares
  • 8.10 Worldwide ECD Market Forecast
  • 8.11 Worldwide ALD Market Forecast
-
此出版品为英文撰写

Top

[英文调查报告书]
薄膜沈淀披覆技术之趋势、课题与市场分析
Thin Film Deposition: Trends, Key Issues, Market Analysis

出版商 : The Information Network The Information Network
代理商 : Global Information, Inc. Global Information, Inc.

US $ 2,545 (PDF by E-mail & Hard Copy)
US $ 2,495 (PDF by E-mail)
商品编码 : 5774

本页所标示之售价为不含购买者所在地消费税之未税价格,相关消费税金将另行加至交易金额中